Abstract: Disclosed is an Augmented Reality (AR) optical waveguide. The AR optical waveguide includes a transparent substrate including a user proximate surface and a user distal surface. The AR optical waveguide also includes a slant etched diffractive grating included on the user distal surface of the transparent substrate. The slant etched diffractive grating includes a refractive index of greater than or equal to 2.0.

Abstract: Methods of making a semiconductor device assembly are provided. The methods can comprise providing a first semiconductor device having a first dielectric material at a first surface, providing a carrier wafer having a second dielectric material at a second surface, and forming a dielectric-dielectric bond between the first dielectric material and the second dielectric material. At least one of the first surface and the second surface includes a region of hydrophobic material electrically isolated from any circuitry of the first semiconductor device and configured to have a reduced bonding strength to a facing region relative to the dielectric-dielectric bond. The method can further include stacking one or more second semiconductor devices over the first semiconductor device to form the semiconductor device assembly, and removing the semiconductor device assembly from the carrier wafer.

Abstract: Semiconductor dies and devices, such as memory dies and devices, and associated systems and methods, are disclosed herein. A representative semiconductor die comprises a substrate including a first surface, a second surface opposite the first surface, a perimeter, and a recess formed into the first surface adjacent to the perimeter. The recess has a depth in a direction extending between the first surface and the second surface. The semiconductor die further comprises a first bonding structure on the first surface and a second bonding structure on the second surface. The first bonding structure has a thickness, and the depth is at least ten times greater than the thickness. The recess can facilitate mechanical debonding of the semiconductor die during a manufacturing process that includes stacking the semiconductor die within a semiconductor device package.

Abstract: A lens including a first lens group including three positive singlets and an achromatic doublet for collecting all field rays received at the first lens group while making initial corrections of spherical and color aberrations, a second lens group including a near-symmetrical group including two positive meniscus elements and two negative meniscus elements, wherein the second lens group is configured to correct distortions, a third lens group including two positive lenses with an air gap disposed between the two positive lenses, wherein the third lens group is configured to correct field curvature and astigmatism and a fourth lens group including a triplet and a positive meniscus element, wherein the fourth lens group is configured to correct spherical, coma, axial color and lateral color aberrations, wherein the lens is disposed in an order of the first lens group, the second lens group, the third lens group and the fourth lens group.

Abstract: Semiconductor devices including one or more interfacing segments patterned within an outer protective layer and associated systems and methods are disclosed herein. The one or more interfacing segments may provide attachment interfaces/surfaces for connection pads. The one or more interfacing segments or a portion thereof may remain uncovered or exposed and provide warpage control for the corresponding semiconductor device.

Abstract: The present invention discloses a method and system for recognizing a geometric regularity image of a honeycomb structure. The method includes the steps of image acquisition, image processing, vertex extraction, cell reconstruction, and quality evaluation, wherein a step of binaryzation is set between the step of image processing and the step of vertex extraction, and is to set a pixel value of a background in the image to be 0 and set a pixel value of a honeycomb skeleton in the image to be 1 to form a binary image, and the step of quality evaluation is to calculate angular deviation values of all the cells and an average thereof as well as linear deviation values and an average thereof based on the reconstructed cell image, and determine whether the honeycomb structure is qualified or not by comparing with a set tolerance zone.

Abstract: A backlight module and a display panel are provided. The display panel includes a main body and a backlight module. The backlight module includes a light source and a light guide plate. By accommodating a light-emitting chip of the light source into a groove of the light guide plate, misalignment of the light source and the light guide plate is prevented so that a relative positional relationship between the light source and the light guide plate is always consistent, thereby improving the consistency and stability of the light effect of a lamp port of the backlight module.

Abstract: Provided are an antigen binding protein capable of binding to PD-1 and a fusion protein thereof, and corresponding preparation method therefor and the use thereof. The fusion protein is capable of targeting PD-1 and CD73.

Abstract: A flame simulation projection device including a first light source, a light reflection mechanism, a second light source and a housing, wherein the first light source, the light reflection mechanism and the second light source are separately matched and connected to the housing; the first light source is disposed facing the light reflection mechanism; the housing forms an inner cavity; and the second light source is disposed facing the outside of the inner cavity. Since the first light source, the light reflection mechanism, the second light source and the housing form a standardized, serialized and integrated module, it can not only speed up the progress of production, assembly and maintenance of products, but also be designed by DIY. Users can freely arrange flame imaging screens and/or simulated fuel beds.

Abstract: The present disclosure is directed to enhancing a lumen display in a CT sectional image of a blood vessel. The CT sectional image may be displayed with a first window level. An average CT value of lumen sections near the heart may be obtained, and a highest CT value of a section of a current blood vessel may also be obtained. A window level may be determined based on the average CT value and the highest CT value. At least a part of the section of the current blood vessel may then be displayed with the window level. The techniques allow for a window level to be preset to enhance lumen display and to improve the consistency of delineating the lumen contour, thereby avoiding deviations caused by subjective selection while saving time and improving patient flow.

Abstract: A semiconductor refrigeration chip and a method for manufacturing same are provided. The method includes: providing a semiconductor refrigeration assembly, where the semiconductor refrigeration assembly includes a first insulating and heat-conducting layer and a second insulating and heat-conducting layer provided opposite to each other and a semiconductor layer arranged between the first insulating and heat-conducting layer and the second insulating and heat-conducting layer, a side of the semiconductor refrigeration assembly provided with the first insulating and heat-conducting layer is a cold end, and a side of the semiconductor refrigeration assembly provided with the second insulating and heat-conducting layer is a hot end; and forming a packaging structure, and causing the packaging structure to cover a side wall of the semiconductor refrigeration assembly and define a first groove with the first insulating and heat-conducting layer, to obtain the semiconductor refrigeration chip.

Abstract: A system for calibrating an equipment, the system including a beam splitter; a first reticle configured to be removably attached to the equipment; and an image capture device including an image plane, wherein an image of the first reticle is configured to be received by way of the beam splitter at the image plane along an optical axis of the beam splitter, wherein the orientation as indicated by the first reticle is compared to an orientation of the image plane and if the orientation as indicated by the first reticle differs from the orientation of the image plane, the equipment is rotated about the optical axis of the beam splitter such that the orientation as indicated by the first reticle matches the orientation of the image plane.

Abstract: A system for providing a virtual distance of a device under test, the system including a light source, a wedge shear plate including a first surface, a second surface and a wedge angle, wherein the second surface is disposed at the wedge angle with respect to the first surface and the wedge shear plate is configured to be disposed between the device under test and the light source, a first detector configured for receiving a first interference pattern formed as a result of the light source being disposed through and reflected by the first surface and the second surface of the wedge shear plate and a second detector configured for receiving a second interference pattern formed as a result of the light source being disposed through and reflected by the first surface and the second surface of the wedge shear plate.

Abstract: Conductive buffer layers for semiconductor die assemblies, and associated systems and methods are disclosed. In an embodiment, a semiconductor die assembly includes first and second semiconductor dies directly bonded to each other. The first semiconductor die includes a first copper pad and the second semiconductor die includes a second copper pad. The first and second copper pads form an interconnect between the first and second semiconductor dies, and the interconnect includes a conductive buffer material between the first and second copper pads, where the conductive buffer material includes aggregates of conductive particles. In some embodiments, the first and second copper pads are not conjoined but electrically connected to each other through the conductive buffer material. In some embodiments, the conductive buffer material is porous such that the aggregates of conductive particles can be compressed together in response to the pressure applied to the conductive buffer layer.

Abstract: A method for controlling an autoexposure function of a camera to a gray level setting, the method including establishing a critical exposure time of an image sensing device of the camera, wherein the critical exposure time of the image sensing device of the camera is an exposure time at which a first sensed gray level of the image sensing device of the camera is disposed at a target gray level, the sensed gray level is disposed in a trend of decreasing sensed gray level values; exposing the image sensing device of the camera to light to obtain a second sensed gray level and comparing the second sensed gray level at the critical exposure time to the target gray level, if the second sensed gray level is disposed at least at the target gray level, limiting the exposure of the image sensing device of the camera to the critical exposure time.

Abstract: An alignment tool including a first and a second positioning system configured for positioning and orientating a first lens and a second lens respectively, wherein a light beam is configured to be disposed through the first lens and the second lens to cast a light spot on the image plane, if the light spot does not stay stationary on the image plane when at least one of the first lens and the second lens is rotated about the central axis of the light beam, at least one of the first positioning system and the second positioning system is actuated to alter at least one of the position and orientation of at least one of the first lens and the second lens until the light spot becomes stationary on the image plane, indicating the first lens is coaxially disposed with the second lens.

Abstract: A method is disclosed for manufacturing a high dielectric constant metal gate of NMOS and PMOS, comprising: step 1, forming an interface layer; step 2, forming a high dielectric constant layer; step 3, performing decoupled plasma nitridation; step 4, performing plasma nitridation annealing with a temperature set below a preset first temperature to reduce the number of oxygen vacancies in the high dielectric constant layer; step 5, forming a P-type work function metal layer; step 6, removing the P-type work function metal layer from the region of the gate structure of the NMOS; step 7, forming an N-type work function metal layer, wherein metal atoms of the N-type work function metal layer of a first NMOS diffuses laterally from an interface to the P-type work function metal layer of adjacent first PMOS and are fixed at the oxygen vacancies by forming a dipole; and step 8, forming the metal gate.

Abstract: A chromatic confocal sensor configured for calibrating an orientation of an equipment about the optical axis of the chromatic confocal sensor, wherein the equipment is disposed at a first orientation about the optical axis of the chromatic confocal sensor, the chromatic confocal sensor including a light source, a collimator, a lens and a reticle, wherein the light source, the collimator and the lens are coaxially disposed along the optical axis, the reticle is configured to be interposable between the collimator and the lens along the optical axis, an image is configured to be cast by the light source through the collimator, the reticle and the lens on the equipment, the image is disposed at a second orientation about the optical axis and the equipment is calibratable by aligning the equipment with the image such that the first orientation approaches the second orientation.

Abstract: Representational state transfer (REST) based geo-aware content transfer includes a REST server configured for receiving an application programming interface (API) request from a client device. The REST server obtains a upload universal resource locator (URL) targeting a caching server that is geographically closest to the client device, constructs an upload link containing the upload URL and a completion callback, and sends the upload link to the client device. The client device uses the upload URL to upload content to the caching server. The caching server interprets the completion callback to obtain a completion URL and, upon completion of content uploading, makes a REST API call using the completion URL. Responsive to the REST API call, the REST server executes an inbound operation to complete the uploading to a content management system and returns the content URL to the caching server which sends the content URL to the client device.

Abstract: The present application provides a structure and method for improving near-infrared quantum efficiency of a backside illuminated image sensor. The structure includes a substrate and a plurality of photodiodes. The photodiodes are formed in the substrate. A cell deep trench isolation structure is fabricated on a surface of each photodiode. The cross section of the cell deep trench isolation structure 3 parallel to the surface of said photodiode comprises one or both of a four-quadrant square shape and a Union Jack shape. In the present application, by fabricating the cell deep trench isolation structures on the surface of each photodiode, the cell deep trench isolation structures increase light scattering in the photodiode, thus the optical path is increased, thereby improving the absorption of incident light, especially in near-infrared wavelength. As a result the quantum efficiency and sensor's imaging quality are improved.