Patents by Inventor Weidong Ma

Weidong Ma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128671
    Abstract: A terminal comprises a terminal body including a pair of terminal plates spaced opposite each other in a height direction, and a pair of elastic contact members arranged on respective inner sides of the pair of terminal plates. Each elastic contact member includes an elastic arm having an extension direction inclined with respect to a length direction of the terminal body. The elastic arms are adapted to clamp to a mating terminal inserted therebetween along the extension direction to achieve electrical connection between the terminal and the mating terminal.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 18, 2024
    Applicants: Tyco Electronics Technology (SIP) Ltd., Tyco Electronics (Shanghai)) Co., Ltd.
    Inventors: Weidong Zhang, Wenzheng Ma, Jian Wang, Pengsheng Jiang, Zaiyun Bai
  • Publication number: 20230275673
    Abstract: Disclosed are a signal demodulation method and apparatus, a computer storage medium and a device. The method comprises: acquiring a signal to be demodulated; performing direct current blocking and bias processing on the signal to obtain a processed signal; comparing the processed signal with a preset decision signal, and obtaining a demodulation signal according to a comparison result. Thus, direct current blocking processing on a modulation signal can avoid dynamic changes of DC components caused by average power changes of carrier signals, avoiding wrongly demodulating the modulation signal. Bias processing after the direct current blocking on the modulation signal can further realize an AC signal decision without introducing a negative pressure source. A real-time decision on the processed signal via the preset decision signal can dynamically adapt the average power of carrier signals, thereby ensuring to correctly demodulate the modulation signal and improving the accuracy of demodulation results.
    Type: Application
    Filed: December 21, 2020
    Publication date: August 31, 2023
    Inventors: Zhi YANG, Cuihong ZHANG, Weidong MA
  • Patent number: 11397340
    Abstract: A heating electrode for lowering stress of a light waveguide and a VOA. The heating electrode is provided on an upper cladding layer (04) of a PLC waveguide. The heating electrode is formed by combining two or more sub-heating electrodes (13) arranged at internals. Adjacent sub-heating electrodes (13) are connected by means of conductive electrodes (14) having a conductive function. By dividing a complete elongated heating electrode into a plurality of sub-heating electrodes (13), the stress exerted to a waveguide core layer is lowered without affecting the heating efficiency, and thus the reliability of optical indexes of a device is effectively improved.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: July 26, 2022
    Inventors: Weidong Ma, Xiaohui Xu, Ding Li
  • Patent number: 11181702
    Abstract: A coupling structure includes a single mode active device and a planar optical waveguide. Specifically, the planar optical waveguide includes a silica waveguide for transmitting an optical signal, where the silica waveguide includes a coupling section and a conduction section; the coupling section is of a regular trapezoidal structure or an inverted trapezoidal structure, where a surface of the coupling section coupled to the single mode active device is a trapezoid top, and a surface of the coupling section connected with the conduction section is a trapezoid bottom; and a coupling gap is preset between the single mode active device and the planar optical waveguide.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: November 23, 2021
    Assignee: Wuhan Telecommunication Devices Co., Ltd.
    Inventors: Ben Chen, Xuerui Liang, Baiquan Hu, Chenggang Liu, Di Zhang, Yongan Fu, Liping Sun, Weidong Ma, Xianghong Yu
  • Publication number: 20200348542
    Abstract: A heating electrode for lowering stress of a light waveguide and a VOA. The heating electrode is provided on an upper cladding layer (04) of a PLC waveguide. The heating electrode is formed by combining two or more sub-heating electrodes (13) arranged at internals. Adjacent sub-heating electrodes (13) are connected by means of conductive electrodes (14) having a conductive function. By dividing a complete elongated heating electrode into a plurality of sub-heating electrodes (13), the stress exerted to a waveguide core layer is lowered without affecting the heating efficiency, and thus the reliability of optical indexes of a device is effectively improved.
    Type: Application
    Filed: December 19, 2016
    Publication date: November 5, 2020
    Applicant: Accelink Technologies Co., Ltd.
    Inventors: Weidong Ma, Xiaohui Xu, Ding Li
  • Publication number: 20200233159
    Abstract: A coupling structure includes a single mode active device and a planar optical waveguide. Specifically, the planar optical waveguide includes a silica waveguide for transmitting an optical signal, where the silica waveguide includes a coupling section and a conduction section; the coupling section is of a regular trapezoidal structure or an inverted trapezoidal structure, where a surface of the coupling section coupled to the single mode active device is a trapezoid top, and a surface of the coupling section connected with the conduction section is a trapezoid bottom; and a coupling gap is preset between the single mode active device and the planar optical waveguide.
    Type: Application
    Filed: April 9, 2020
    Publication date: July 23, 2020
    Inventors: Ben Chen, Xuerui Liang, Baiquan Hu, Chenggang Liu, Di Zhang, Yongan Fu, Liping Sun, Weidong Ma, Xianghong Yu
  • Patent number: 10680709
    Abstract: A debugging method and device for an operating point voltage of a parallel MZI electro-optical modulator. The parallel MZI electro-optical modulator comprises a Parent MZI (2) formed by a parallel connection of a Child MZI (3) in an I path and a Child MZI (4) in a Q path.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: June 9, 2020
    Assignee: Accelink Technologies Co., Ltd.
    Inventors: Zhao Huang, Bo Zhang, Kun Qian, Yi Hu, Weidong Ma
  • Patent number: 10656350
    Abstract: A coupling structure includes a single mode active device and a planar optical waveguide. Specifically, the planar optical waveguide includes a silica waveguide for transmitting an optical signal, where the silica waveguide includes a coupling section and a conduction section; the coupling section is of a regular trapezoidal structure or an inverted trapezoidal structure, where a surface of the coupling section coupled to the single mode active device is a trapezoid top, and a surface of the coupling section connected with the conduction section is a trapezoid bottom; and a coupling gap is preset between the single mode active device and the planar optical waveguide.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: May 19, 2020
    Assignee: Wuhan Telecommunication Devices Co., Ltd.
    Inventors: Ben Chen, Xuerui Liang, Baiquan Hu, Chenggang Liu, Di Zhang, Yongan Fu, Liping Sun, Weidong Ma, Xianghong Yu
  • Patent number: 10451805
    Abstract: The present invention provides a wavelength division multiplexing/demultiplexing optical transceiving assembly based on a diffraction grating, which is an uplink optical emitting unit and a downlink optical receiving unit that comprise a laser chip array, a light receiving detector array, a first fast axis collimating lens, a second fast axis collimating lens, a first slow axis collimating lens, a diffraction grating, a slow axis focusing lens, a second slow axis collimating lens, an optical isolator, a coupling output lens, a coupling input lens, a coupling outputting optical fiber and a coupling inputting optical fiber.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: October 22, 2019
    Assignee: WUHAN TELECOMMUNICATION DEVICES CO., LTD
    Inventors: Xuesheng Tang, Di Zhang, Shenglei Hu, Yongan Fu, Yanfeng Fu, Chenggang Liu, Shiyu Li, Liping Sun, Weidong Ma
  • Patent number: 10416379
    Abstract: An arrayed waveguide grating based hybrid integrated laser has an adjustable external cavity. The waveguide includes a semiconductor gain die and an optical waveguide chip. The optical waveguide chip includes an arrayed waveguide grating and an arrayed waveguide reflection-controllable component. A resonant cavity is formed by the output end reflection-controllable arrayed waveguide grating chip and the semiconductor gain die. An output wavelength of the laser can be adjusted by changing a driving condition of the reflection-controllable component. The output wavelength is determined by a center wavelength of each channel of the arrayed waveguide grating.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: September 17, 2019
    Assignee: Accelink Technologies Co., Ltd.
    Inventors: Yanfeng Fu, Kun Qian, Di Zhang, Xuesheng Tang, Shenglei Hu, Yi Tang, Di Li, Weidong Ma, Qianggao Hu
  • Publication number: 20190273558
    Abstract: A debugging method and device for an operating point voltage of a parallel MZI electro-optical modulator. The parallel MZI electro-optical modulator comprises a Parent MZI (2) formed by a parallel connection of a Child MZI (3) in an I path and a Child MZI (4) in a Q path.
    Type: Application
    Filed: December 19, 2016
    Publication date: September 5, 2019
    Applicant: Accelink Technologies Co., Ltd.
    Inventors: Zhao Huang, Bo Zhang, Kun Qian, Yi Hu, Weidong Ma
  • Patent number: 10256606
    Abstract: A wavelength-tunable external cavity laser comprises a semiconductor optical amplifier chip and a laser external cavity, the laser external cavity comprising a grid filter, a phase adjustor and a silicon-based micro-ring chip, the grid filter and the silicon-based micro-ring chip constituting a wavelength-tunable optical filter which implements wavelength tuning by spectral tuning of the grid filter and/or the silicon-based micro-ring chip. A micro-ring filter in the silicon-based micro-ring chip of the tunable external-cavity laser is manufactured by adopting a mature silicon light technology, which can greatly reduce a manufacturing difficulty of the adjustable filter, and reduce the manufacturing cost of a device. An existing external-cavity adjustable technology platform may be used for smooth transition, so as to improve the degree of integration of this type of device and simplify a preparation process.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: April 9, 2019
    Assignee: Accelink Technologies Co., Ltd.
    Inventors: Shenglei Hu, Yanfeng Fu, Yi Tang, Di Zhang, Shiyu Li, Xuesheng Tang, Kun Qian, Weidong Ma, Qianggao Hu
  • Publication number: 20190086620
    Abstract: A coupling structure includes a single mode active device and a planar optical waveguide. Specifically, the planar optical waveguide includes a silica waveguide for transmitting an optical signal, where the silica waveguide includes a coupling section and a conduction section; the coupling section is of a regular trapezoidal structure or an inverted trapezoidal structure, where a surface of the coupling section coupled to the single mode active device is a trapezoid top, and a surface of the coupling section connected with the conduction section is a trapezoid bottom; and a coupling gap is preset between the single mode active device and the planar optical waveguide.
    Type: Application
    Filed: November 16, 2018
    Publication date: March 21, 2019
    Inventors: Ben Chen, Xuerui Liang, Baiquan Hu, Chenggang Liu, Di Zhang, Yongan Fu, Liping Sun, Weidong Ma, Xianghong Yu
  • Patent number: 10209463
    Abstract: A silicon waveguide coupling alignment apparatus includes a fine adjustment bracket, a stress releasing clamp and a silicon photonic integrated chip force sensor. A silicon photonic integrated chip is fixed on the silicon photonic integrated chip force sensor, at least a part of an optical fiber to be coupled is fixed on one end of the stress releasing clamp, the stress releasing clamp is arranged on the fine adjustment bracket, an end surface of the optical fiber to be coupled is aligned with an end surface of the silicon photonic integrated chip by adjusting a position of the fine adjustment bracket, and a cushioning mechanism is arranged within the stress releasing clamp to cushion a collision force in a direction perpendicular to the end surface of the optical fiber to be coupled. The contact force imposed by the optical fiber on the end surface of the chip can be released by the clamp.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: February 19, 2019
    Assignee: Accelink Technologies Co., Ltd.
    Inventors: Qionghui Song, Jiecong Huang, Jiuhong Ling, Wei Du, Weidong Ma
  • Patent number: 10145731
    Abstract: A performance testing device for a multi-channel tunable laser, comprising a collimating and coupling lens, a first beam splitter, a power testing unit, a side-mode suppression ratio testing unit, a wavelength testing unit and a control and drive unit, the power testing unit being positioned in a reflection path of the first beam splitter, the wavelength testing unit being positioned in a transmission path of the first beam splitter, the side-mode suppression ratio testing unit being positioned in a reflection path of the second beam splitter, the control and drive unit being in a control connection with the power testing unit, the side-mode suppression ratio testing unit and the wavelength testing unit. The performance testing device has a simple structure, a low cost, and is convenient to use.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: December 4, 2018
    Assignee: Accelink Technologies Co., Ltd.
    Inventors: Kun Qian, Yanfeng Fu, Xuesheng Tang, Yi Tang, Yizong Chen, Di Zhang, Shenglei Hu, Weidong Ma
  • Publication number: 20180314006
    Abstract: The present invention provides a wavelength division multiplexing/demultiplexing optical transceiving assembly based on a diffraction grating, which is an uplink optical emitting unit and a downlink optical receiving unit that comprise a laser chip array, a light receiving detector array, a first fast axis collimating lens, a second fast axis collimating lens, a first slow axis collimating lens, a diffraction grating, a slow axis focusing lens, a second slow axis collimating lens, an optical isolator, a coupling output lens, a coupling input lens, a coupling outputting optical fiber and a coupling inputting optical fiber.
    Type: Application
    Filed: December 28, 2015
    Publication date: November 1, 2018
    Inventors: Xuesheng TANG, Di ZHANG, Shenglei HU, Yongan FU, Yanfeng FU, Chenggang LIU, Shiyu LI, Liping SUN, Weidong MA
  • Publication number: 20180216995
    Abstract: A performance testing device for a multi-channel tunable laser, comprising a collimating and coupling lens, a first beam splitter, a power testing unit, a side-mode suppression ratio testing unit, a wavelength testing unit and a control and drive unit, the power testing unit being positioned in a reflection path of the first beam splitter, the wavelength testing unit being positioned in a transmission path of the first beam splitter, the side-mode suppression ratio testing unit being positioned in a reflection path of the second beam splitter, the control and drive unit being in a control connection with the power testing unit, the side-mode suppression ratio testing unit and the wavelength testing unit.
    Type: Application
    Filed: December 15, 2015
    Publication date: August 2, 2018
    Applicant: Accelink Technologies Co., Ltd.
    Inventors: Kun Qian, Yanfeng Fu, Xuesheng Tang, Yi Tang, Yizong Chen, Di Zhang, Shenglei Hu, Weidong Ma
  • Publication number: 20180196205
    Abstract: A silicon waveguide coupling alignment apparatus includes a fine adjustment bracket, a stress releasing clamp and a silicon photonic integrated chip force sensor. A silicon photonic integrated chip is fixed on the silicon photonic integrated chip force sensor, at least a part of an optical fiber to be coupled is fixed on one end of the stress releasing clamp, the stress releasing clamp is arranged on the fine adjustment bracket, an end surface of the optical fiber to be coupled is aligned with an end surface of the silicon photonic integrated chip by adjusting a position of the fine adjustment bracket, and a cushioning mechanism is arranged within the stress releasing clamp to cushion a collision force in a direction perpendicular to the end surface of the optical fiber to be coupled. The contact force imposed by the optical fiber on the end surface of the chip can be released by the clamp.
    Type: Application
    Filed: December 15, 2015
    Publication date: July 12, 2018
    Applicant: Accelink Technologies Co., Ltd.
    Inventors: Qionghui Song, Jiecong Huang, Jiuhong Ling, Wei Du, Weidong Ma
  • Publication number: 20180191132
    Abstract: A wavelength-tunable external cavity laser comprises a semiconductor optical amplifier chip and a laser external cavity, the laser external cavity comprising a grid filter, a phase adjustor and a silicon-based micro-ring chip, the grid filter and the silicon-based micro-ring chip constituting a wavelength-tunable optical filter which implements wavelength tuning by spectral tuning of the grid filter and/or the silicon-based micro-ring chip. A micro-ring filter in the silicon-based micro-ring chip of the tunable external-cavity laser is manufactured by adopting a mature silicon light technology, which can greatly reduce a manufacturing difficulty of the adjustable filter, and reduce the manufacturing cost of a device. An existing external-cavity adjustable technology platform may be used for smooth transition, so as to improve the degree of integration of this type of device and simplify a preparation process.
    Type: Application
    Filed: December 15, 2015
    Publication date: July 5, 2018
    Applicant: Accelink Technologies Co., Ltd.
    Inventors: Shenglei Hu, Yanfeng Fu, Yi Tang, Di Zhang, Shiyu Li, Xuesheng Tang, Kun Qian, Weidong Ma, Qianggao Hu
  • Patent number: D1010603
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: January 9, 2024
    Assignee: SHENZHEN AWP TECHNOLOGY CO., LTD.
    Inventors: Tijun Bie, Long Chen, Weidong Ma