Abstract: A first electrostatic discharge measurement is received from a first sensor. The first sensor utilizes a wireless network to send the first measurement from a first stage of the assembly line of electronic components susceptible to electrostatic discharge damage. A second electrostatic discharge measurement is received from a second sensor. The second sensor utilizes the wireless network to send the second measurement from a second stage of the assembly line. An electrostatic discharge history is updated for the first assembly stage based on the first electrostatic discharge measurement. The electrostatic discharge history is updated for the second assembly stage based on the second electrostatic discharge measurement. A potential electrostatic danger condition is determined based on the electrostatic discharge history.

Abstract: An apparatus and method for press-fitting a connector to a circuit board is provided. The apparatus has a universal press block fixedly connected to a machine press head. A bottom plate of the universal press block has multiple locating holes. A locating block is fixedly connected to the bottom plate. A press block is fixedly connected to the locating block at a predetermined position suitable for press-fitting the connector. The press block has a press block head, a press block body and a sensor provided between the head and the body. The press block head is movable to contact the connector to apply a pressing force to the connector. The sensor detects the pressing force and generates a signal indicative of the pressing force. The press block body receives the signal from the sensor and controls the movement of the press block head based on the signal.

Abstract: A first electrostatic discharge measurement is received from a first sensor. The first sensor utilizes a wireless network to send the first measurement from a first stage of the assembly line of electronic components susceptible to electrostatic discharge damage. A second electrostatic discharge measurement is received from a second sensor. The second sensor utilizes the wireless network to send the second measurement from a second stage of the assembly line. An electrostatic discharge history is updated for the first assembly stage based on the first electrostatic discharge measurement. The electrostatic discharge history is updated for the second assembly stage based on the second electrostatic discharge measurement. A potential electrostatic danger condition is determined based on the electrostatic discharge history.

Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

Abstract: A method of testing a printed circuit board (PCB) with an in-circuit test (ICT) probe having an improved probe-to-via contact is provided. The ICT probe includes a tip attached to a spindle; a housing having a cavity, a portion of the spindle insertable into the cavity; and a heating element wrapped helically around the spindle, the heating element coupled to the housing. The probe is contacted with a surface of a flux layer of a test via of the PCB, said contact compressing the heating element and recessing the insertable portion of the spindle into the cavity. The tip of the probe is heated with the heating element to a temperature capable of at least partially melting the flux layer, the tip at least partially penetrating the flux layer to contact a surface of a solder plugging the test via.

Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

Abstract: A method of testing a printed circuit board (PCB) with an in-circuit test (ICT) probe having an improved probe-to-via contact is provided. The ICT probe includes a tip attached to a spindle; a housing having a cavity, a portion of the spindle insertable into the cavity; and a heating element wrapped helically around the spindle, the heating element coupled to the housing. The probe is contacted with a surface of a flux layer of a test via of the PCB, said contact compressing the heating element and recessing the insertable portion of the spindle into the cavity. The tip of the probe is heated with the heating element to a temperature capable of at least partially melting the flux layer, the tip at least partially penetrating the flux layer to contact a surface of a solder plugging the test via.

Abstract: An electric heater, and an apparatus, a heating and air conditioning system and a vehicle, each comprising the electric heater, are provided. The electric heater comprises an outer frame; a heating core configured to connect to a power source and disposed within the outer frame; and a sealing-waterproof glue member disposed within the outer frame and configured to encase at least one end of the heating core. The heating core further comprises: a plurality of heat dissipating components and heating components arranged alternately, and each of the heat dissipating component is coupled with a heating component via a thermal conductor. Each of the heating components further comprises a core tube and a positive temperature coefficient thermistor disposed in the core tube.

Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

Abstract: A first electrostatic discharge measurement is received from a first sensor. The first sensor utilizes a wireless network to send the first measurement from a first stage of the assembly line of electronic components susceptible to electrostatic discharge damage. A second electrostatic discharge measurement is received from a second sensor. The second sensor utilizes the wireless network to send the second measurement from a second stage of the assembly line. An electrostatic discharge history is updated for the first assembly stage based on the first electrostatic discharge measurement. The electrostatic discharge history is updated for the second assembly stage based on the second electrostatic discharge measurement. A potential electrostatic danger condition is determined based on the electrostatic discharge history.

Abstract: A first electrostatic discharge measurement is received from a first sensor. The first sensor utilizes a wireless network to send the first measurement from a first stage of the assembly line of electronic components susceptible to electrostatic discharge damage. A second electrostatic discharge measurement is received from a second sensor. The second sensor utilizes the wireless network to send the second measurement from a second stage of the assembly line. An electrostatic discharge history is updated for the first assembly stage based on the first electrostatic discharge measurement. The electrostatic discharge history is updated for the second assembly stage based on the second electrostatic discharge measurement.

Abstract: A power adapter is provided for a computer including a power port and a housing defining an aperture. The power adapter includes a power head, a lock head disposed on the power head and a main housing including a body affixed to a security element, wiring for supplying power to the computer extending through the body to the power head and a lock system selectively actuatable with a key to orient the lock head in first and second orientations. The first orientation is characterized in that the power head is movable relative to the aperture for power head insertion into and removal from the power port. The second orientation is characterized in that the power head is immovable relative to the aperture.

Abstract: A power adapter is provided for a computer including a power port and a housing defining an aperture. The power adapter includes a power head, a lock head disposed on the power head and a main housing including a body affixed to a security element, wiring for supplying power to the computer extending through the body to the power head and a lock system selectively actuatable with a key to orient the lock head in first and second orientations. The first orientation is characterized in that the power head is movable relative to the aperture for power head insertion into and removal from the power port. The second orientation is characterized in that the power head is immovable relative to the aperture.

Abstract: A positive temperature coefficient heating assembly includes a heating core including a first metal electrode plate, a second metal electrode plate and a plurality of PTC ceramic chips; an insulating layer coated on the heating core; and a metal tube; the PTC ceramic chip includes a positive electrode layer, a negative electrode layer, and a ceramic sintered layer; a plurality of first limit grooves are formed in the first metal electrode plate, a plurality of second limit grooves are formed in the second metal electrode plate, a first end of each of the PTC ceramic chips is embedded in one of the first limit grooves, and a second end of each of the PTC ceramic chips is embedded in one of the second limit grooves.

Abstract: A temperature triggering ejector system for lock pin soldering type component is provided. There is provided a temperature triggering ejector system for a lock pin soldering type component, lock pins of said component are fixed in through holes of a circuit board and solder is filled in the through holes after soldering, said system comprising: an ejector that is located at one side of the circuit board that is opposed to said component, and has ejector pins aligned with the through holes of the circuit board and a cylinder that drives the ejector pins; a temperature sensor for sensing the temperature of said solder being heated; a controller for driving the ejector pins of the ejector within a solder melting temperature range based on the temperature sensed by the temperature sensor, to eject the lock pins of said component from said circuit board.

Abstract: Aspects of this disclosure relate to a method of compiling high-level software instructions to generate low-level software instructions. In an example, the method includes identifying, with a computing device, a set of high-level (HL) control flow (CF) instructions having one or more associated texture load instructions, wherein the set of HL CF instructions comprises one or more branches. The method also includes converting, with the computing device, the identified set of HL CF instructions to low-level (LL) instructions having a predicate structure. The method also includes outputting the converted (LL) instructions having the predicate structure.

Abstract: The invention relates to solution-processable, p-type, low-optical gap oligothiophene compounds for use in solar cell application, comprising at least one thiophene-containing group, at least one electron-withdrawing dicyanovinyl or tricyanovinyl group, and at least one electron-donating diphenylaminofluorenyl or N-alkylcarbazole group.

Abstract: The invention relates to solution-processable, p-type, low-optical gap oligothiophene compounds for use in solar cell application, comprising at least one thiophene-containing group, at least one electron-withdrawing dicyanovinyl or tricyanovinyl group, and at least one electron-donating diphenylaminofluorenyl or N-alkylcarbazole group.