Patents by Inventor Weihua Sonya Dai

Weihua Sonya Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040096621
    Abstract: Improvements in creating resilient high denier polypropylene yarns are provided. Generally, high denier polypropylene yarns exhibit poor resiliency (such as crush resistance, for example, when utilized as carpet face yarns) that effectively prevents widespread use in articles that require high degrees of resiliency. As a result, higher cost, but more resilient, yarns, such as polyesters or polyamides, have found greater acceptance in such end-use articles. Furthermore, previous attempts at texturing high denier polypropylene fibers have failed to attain suitable resilience levels therein is insufficient to permit proper return to initial shape and/or length after impact.
    Type: Application
    Filed: November 17, 2002
    Publication date: May 20, 2004
    Inventors: Weihua Sonya Dai, Brian G. Morin