Patents by Inventor Weiyun JI

Weiyun JI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240076493
    Abstract: A composition including particular amounts of a polyetherimide or a poly(arylene ether sulfone) and an inorganic filler is described herein. Molded samples of the composition can exhibit an advantageous combination of properties, and the composition can be used in various articles. Methods of making the composition are also described.
    Type: Application
    Filed: November 23, 2021
    Publication date: March 7, 2024
    Inventors: Weiyun JI, Zheng WANG, Liang SHEN, Siguang JIANG, Gabrie HOOGLAND, Hariharan RAMALINGAM
  • Publication number: 20220332893
    Abstract: A thermoplastic composition includes 25 to 95 weight percent of a poly(etherimide); 5 to 70 weight percent of a polymer different from the poly(etherimide) that is partially miscible with the poly(etherimide); and 1 to 15 weight percent of a mineral filler having an average particle size of 0.1 to 10 micrometers; wherein each weight percent is based on the total weight of the composition. The thermoplastic composition can be prepared by melt-mixing the components of the composition. Articles including the composition are also described.
    Type: Application
    Filed: September 4, 2020
    Publication date: October 20, 2022
    Inventors: Mian DAI, Weiyun JI, Liang SHEN
  • Publication number: 20220289974
    Abstract: An article includes a composition including a high heat amorphous thermoplastic polymer having a glass transition temperature of greater than 180° C.; a poly(phenylene ether) oligomer; a flow promoter comprising a polyester, a poly (carbonate-ester), an aromatic poly ketone, poly(phenylene sulfide), or a combination thereof; and a mineral filler, wherein particular amounts of each component can be as defined herein. The article further includes a metal layer disposed on a surface of the composition. The articles of the present disclosure can be especially useful in consumer electronics applications.
    Type: Application
    Filed: July 17, 2020
    Publication date: September 15, 2022
    Inventors: Weiyun JI, Liang SHEN, Mian DAI, Chao LIU, Lijuan WANG