Abstract: A high density epoxy ring probe card includes a unitary printed circuit board having a central opening adapted to receive a preformed epoxy ring array of probes. The board has a multiplicity of conductive traces, there being a first set of traces formed on a lower major surface thereof and a second set of traces formed on an upper major surface thereof and interleaved radially vertically with respect to the first set; there being in total number at least as many traces as there are probes of said probe card. Feed through connectors are provided for feeding a connection for each upper trace through the printed circuit board to an inner annular region on the lower major surface of the printed circuit board adjacent said opening. The probes are epoxed to the ring in two interleaved and vertically separated rows, with the lower row being connected directly to the first set and with the upper row being connected to the second set via the lower surface of the printed circuit board.

Abstract: A high density epoxy ring probe card includes a unitary printed circuit board having a central opening adapted to receive a preformed epoxy ring array of probes. The board has a multiplicity of conductive traces, there being a first set of traces formed on a lower major surface thereof and a second set of traces formed on an upper major surface thereof and interleaved radially vertically with respect to the first set; there being in total number at least as many traces as there are probes of said probe card. Feed through connectors are provided for feeding a connection for each upper trace through the printed circuit board to an inner annular region on the lower major surface of the printed circuit board adjacent said opening. The probes are epoxyed to the ring in two interleaved and vertically separated rows, with the lower row being connected directly to the first set and with the upper row being connected to the second set via the lower surface of the printed circuit board.