Patents by Inventor Wen-An Wu

Wen-An Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11935957
    Abstract: Semiconductor device structures having gate structures with tunable threshold voltages are provided. Various geometries of device structure can be varied to tune the threshold voltages. In some examples, distances from tops of fins to tops of gate structures can be varied to tune threshold voltages. In some examples, distances from outermost sidewalls of gate structures to respective nearest sidewalls of nearest fins to the respective outermost sidewalls (which respective gate structure overlies the nearest fin) can be varied to tune threshold voltages.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Chiang Wu, Wei-Chin Lee, Shih-Hang Chiu, Chia-Ching Lee, Hsueh Wen Tsau, Cheng-Yen Tsai, Cheng-Lung Hung, Da-Yuan Lee, Ching-Hwanq Su
  • Publication number: 20240085678
    Abstract: Various embodiments of the present disclosure are directed towards a camera module comprising flat lenses. Flat lenses have reduced thicknesses compared to other types of lenses, whereby the camera module may have a small size and camera bumps may be omitted or reduced in size on cell phones and the like incorporating the camera module. The flat lenses are configured to focus visible light into a beam of white light, split the beam into sub-beams of red, green, and blue light, and guide the sub-beams respectively to separate image sensors for red, green, and blue light. The image sensors generate images for corresponding colors and the images are combined into a full-color image. Optically splitting the beam into the sub-beams and using separate image sensors for the sub-beams allows color filters to be omitted and smaller pixel sensors. This, in turn, allows higher quality imaging.
    Type: Application
    Filed: May 8, 2023
    Publication date: March 14, 2024
    Inventors: Jung-Huei Peng, Chun-Wen Cheng, Yi-Chien Wu, Tsun-Hsu Chen
  • Publication number: 20240089333
    Abstract: A method that includes collecting, by a computer, social network posts by social network friends of a user containing images. The method further includes identifying, by the computer, images within the social network posts containing the user through facial image recognition based on an image of the user in a user social network profile and determining, by the computer, information from the identified images containing the user within the social network posts for inclusion in the user social network profile. The method may further include updating, by the computer, the profile information of the user social network profile to include the information from the identified images containing the user within the social network posts.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Inventors: Wen Wang, Yan Bin Fu, Shuang Yin Liu, Yi Wu, Qing Jun Gao
  • Publication number: 20240084407
    Abstract: The invention provides a transgenic Glycine max event MON87751, plants, plant cells, seeds, plant parts, progeny plants, and commodity products comprising event MON87751. The invention also provides polynucleotides specific for event MON87751, plants, plant cells, seeds, plant parts, and commodity products comprising polynucleotides for event MON87751. The invention also provides methods related to event MON87751.
    Type: Application
    Filed: August 11, 2023
    Publication date: March 14, 2024
    Inventors: Kim A. Beazley, Wen C. Burns, Robert H. Cole, II, Ted C. MacRae, John A. Miklos, Lisa G. Ruschke, Kairong Tian, Liping Wei, Kunsheng Wu
  • Publication number: 20240084533
    Abstract: The present disclosure provides a soft ground cleaning vehicle, including a main body frame; wherein each of both sides of the main body frame is arranged with a screw propulsion mechanism, and a lower portion of each of the both sides of the main body frame is arranged with a bottom frame; a power assembly is arranged on the bottom frame, and an extension frame is arranged on a lower portion of the bottom frame; the extension frame is arranged with a rotation assembly; a plastic track is arranged on the power assembly and the rotation assembly; a plurality of stand plates are arranged on an outer strip surface of the plastic track.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: QI QIU, HAO CHEN, MINGBIN GONG, YANGFANG WU, PENGFEI WANG, WEN YU, JUN ZHANG
  • Patent number: 11926238
    Abstract: Disclosed is an apparatus for charging a battery comprising a first charging device configured to communicate with at least one second charging device, the first charging device and the at least one second charging device configured to charge the battery, and comprising a first controller configured to control the first charging device, wherein the first controller determines the number of the at least one second charging devices by communicating with a second controller.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: March 12, 2024
    Assignee: MINE MOBILITY RESEARCH CO., LTD.
    Inventors: Somphote Ahunai, Wen Wu Pan, Cao Kai Zheng, Gang Liu, Jian Hua Li, Xiao Meng Deng, Zhao Hui Peng
  • Patent number: 11926633
    Abstract: The present disclosure relates to a JAK inhibitor upadacitinib intermediate and a preparation method therefor, and to a preparation method for a JAK inhibitor upadacitinib. The upadacitinib intermediate of the present application is as shown in Formula (II) or Formula (III), wherein, R is a protective group of nitrogen atoms, and R1 is an open-chain or cyclic amine group. Compared with the prior art, the method for the synthesis of upadacitinib of the present application, significantly reduces cost, is environmentally-friendly. And the quality of the final product is well controlled.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: March 12, 2024
    Assignee: SUZHOU PENGXU PHARMATECH CO., LTD
    Inventors: Peng Wang, Pixu Li, Qiang Wei, Wen Cheng, Hao Wu
  • Publication number: 20240079253
    Abstract: A transfer system adaptable to performing levelling alignment includes a transfer head that picks up micro devices, the transfer head having a plurality of pick-up heads protruded from a bottom surface of the transfer head; and a levelling fixture configured to perform levelling alignment for the transfer head, the levelling fixture having a plurality of cavities that are concave downwards to correspondingly accommodate the pick-up heads respectively.
    Type: Application
    Filed: October 31, 2023
    Publication date: March 7, 2024
    Inventors: Biing-Seng Wu, Chun-Jen Weng, Chao-Wen Wu
  • Patent number: 11921551
    Abstract: A card riser for an information handling system includes a bottom surface, multiple connector slots in physical communication with the bottom surface, and a locking mechanism in physical communication with the bottom surface. Each connector slot is configured to receive a corresponding connector of a different one of multiple cards. When the locking mechanism is in an unlocked position, a different one of the cards is inserted within a different one of the connector slots. When the locking mechanism is in a locked position, the locking mechanism is placed in physical communication with each of the cards to securely hold the cards within the card riser.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: March 5, 2024
    Assignee: Dell Products L.P.
    Inventors: Hung Wen Wu, Liang-Chun Ma, Hsiang-Yin Hung
  • Publication number: 20240071909
    Abstract: A semiconductor package is provided. The semiconductor package includes an encapsulating layer, a semiconductor die formed in the encapsulating layer, and an interposer structure covering the encapsulating layer. The interposer structure includes an insulating base having a first surface facing the encapsulating layer, and a second surface opposite the first surface. The interposer structure also includes insulating features formed on the first surface of the insulating base and extending into the encapsulating layer. The insulating features is arranged in a matrix and faces a top surface of the semiconductor die. The interposer structure further includes first conductive features formed on the first surface of the insulating base and extending into the encapsulating layer. The first conductive features surround the matrix of the insulating features.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Wen WU, Techi WONG, Po-Hao TSAI, Po-Yao CHUANG, Shih-Ting HUNG, Shin-Puu JENG
  • Publication number: 20240068124
    Abstract: An apparatus for producing silicon carbide crystal is provided and includes a composite structure formed by a plurality of graphite layers and silicon carbide seed crystals, wherein a density or thickness of each layer of graphite is gradually adjusted to reduce a difference of a thermal expansion coefficient and Young's modulus between the graphite layers and silicon carbide. The composite structure can be stabilized on a top portion or an upper cover of a crucible made of graphite, thereby preventing the silicon carbide crystal from falling off.
    Type: Application
    Filed: August 23, 2023
    Publication date: February 29, 2024
    Inventors: CHIH-LUNG LIN, PO-FEI YANG, CHIE-SHENG LIU, CHUNG-HAO LIN, HSIN-CHEN YEH, HAO-WEN WU
  • Publication number: 20240069550
    Abstract: A method for processing abnormality of material pushing robot, a device, a server, and a storage medium, the method includes: transmitting abnormality alarm information to a target user and obtaining real-time video data transmitted from the material pushing robot when receiving abnormality information of the material pushing robot; receiving a remote monitoring request which is transmitted from the target user based on the abnormality alarm information, and transmitting the real-time video data to a remote control terminal according to the remote monitoring request, and to cause the remote control terminal to determine a current position and a restoring position of the material pushing robot according to the real-time video data, and to generate a remote movement command according to the current position and the restoring position; and receiving a remote control command returned by the remote control terminal, and transmitting the remote movement command to the material pushing robot.
    Type: Application
    Filed: May 13, 2021
    Publication date: February 29, 2024
    Inventors: Di Wu, GEN-YUAN WANG, WEN-QUAN ZHAO
  • Patent number: 11914941
    Abstract: Systems, methods, and devices are described herein for integrated circuit (IC) layout validation. A plurality of IC patterns are collected which include a first set of patterns capable of being manufactured and a second set of patterns incapable of being manufactured. A machine learning model is trained using the plurality of IC patterns. The machine learning model generates a prediction model for validating IC layouts. The prediction model receives data including a set of test patterns comprising scanning electron microscope (SEM) images of IC patterns. Design violations associated with an IC layout are determined based on the SEM images and the plurality of IC patterns. A summary of the design violations is provided for further characterization of the IC layout.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Rachid Salik, Chin-Chang Hsu, Cheng-Chi Wu, Chien-Wen Chen, Wen-Ju Yang
  • Patent number: 11915512
    Abstract: A three-dimensional sensing system includes a plurality of scanners each emitting a light signal to a scene to be sensed and receiving a reflected light signal, according to which depth information is obtained. Only one scanner executes transmitting corresponding light signal and receiving corresponding reflected light signal at a time.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: February 27, 2024
    Assignee: Himax Technologies Limited
    Inventors: Ching-Wen Wang, Cheng-Che Tsai, Ting-Sheng Hsu, Min-Chian Wu
  • Patent number: 11901279
    Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes a semiconductor die, an encapsulant and a redistribution structure. The encapsulant laterally encapsulates the semiconductor die. The redistribution structure is disposed on the encapsulant and electrically connected with the semiconductor die, wherein the redistribution structure comprises a first conductive via, a first conductive wiring layer and a second conductive via stacked along a stacking direction, the first conductive via has a first terminal surface contacting the first conductive wiring layer, the second conductive via has a second terminal surface contacting the first conductive wiring layer, an area of a first cross section of the first conductive via is greater than an area of the first terminal surface of the first conductive via, and an area of a second cross section of the second conductive via is greater than an area of the second terminal surface of the second conductive via.
    Type: Grant
    Filed: March 14, 2023
    Date of Patent: February 13, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Ting Hung, Meng-Liang Lin, Shin-Puu Jeng, Yi-Wen Wu, Po-Yao Chuang
  • Patent number: 11901277
    Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes a semiconductor die, an encapsulant and a redistribution structure. The encapsulant laterally encapsulates the semiconductor die. The redistribution structure is disposed on the encapsulant and electrically connected with the semiconductor die, wherein the redistribution structure comprises a first conductive via, a first conductive wiring layer and a second conductive via stacked along a stacking direction, the first conductive via has a first terminal surface contacting the first conductive wiring layer, the second conductive via has a second terminal surface contacting the first conductive wiring layer, an area of a first cross section of the first conductive via is greater than an area of the first terminal surface of the first conductive via, and an area of a second cross section of the second conductive via is greater than an area of the second terminal surface of the second conductive via.
    Type: Grant
    Filed: July 3, 2022
    Date of Patent: February 13, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Ting Hung, Meng-Liang Lin, Shin-Puu Jeng, Yi-Wen Wu, Po-Yao Chuang
  • Publication number: 20240031602
    Abstract: Conventional intra-prediction uses pixels from left and upper neighbour blocks to predict a macroblock (MB). Thus, the MBs must be sequentially processed, since reconstructed left and upper MBs must be available for prediction. In an improved method for encoding Intra predicted MBs, a MB is encoded in two steps: first, a first portion of the MB is encoded independently, without references outside the MB. Pixels of the first portion can be Intra predicted using DC mode. Then, the first portion is reconstructed. The remaining pixels of the MB, being a second portion, are intra predicted from the reconstructed pixels of the first portion and then reconstructed. The first portion comprises at least one column or one row of pixels of the MB. The encoding is applied to at least two Intra predicted MBs per slice, or per picture if no slices are used.
    Type: Application
    Filed: September 14, 2023
    Publication date: January 25, 2024
    Inventor: Yu Wen WU
  • Patent number: 11876135
    Abstract: Epitaxial source/drain structures for enhancing performance of multigate devices, such as fin-like field-effect transistors (FETs) or gate-all-around (GAA) FETs, and methods of fabricating the epitaxial source/drain structures, are disclosed herein. An exemplary device includes a dielectric substrate. The device further includes a channel layer, a gate disposed over the channel layer, and an epitaxial source/drain structure disposed adjacent to the channel layer. The channel layer, the gate, and the epitaxial source/drain structure are disposed over the dielectric substrate. The epitaxial source/drain structure includes an inner portion having a first dopant concentration and an outer portion having a second dopant concentration that is less than the first dopant concentration. The inner portion physically contacts the dielectric substrate, and the outer portion is disposed between the inner portion and the channel layer. In some embodiments, the outer portion physically contacts the dielectric substrate.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: January 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chen-Ming Lee, I-Wen Wu, Po-Yu Huang, Fu-Kai Yang, Mei-Yun Wang
  • Publication number: 20240008433
    Abstract: An aeroponic system with uninterrupted operation and energy saving comprises a first nutrient solution storage tank, a second nutrient solution storage tank, a gas storage tank, an air compressor and a planting module; compresses air in the gas storage tank mainly through the air compressor, and transports a nutrient solution stored in the second nutrient solution storage tank to the planting module for watering by gas pressure, the excess nutrient solution dripped after watering is recycled to the first nutrient solution storage tank, and is finally transported back to the second nutrient solution storage tank to complete a circulating supply system. Since operation is carried out through a high-pressure gas stored in the gas storage tank, an object of uninterrupted operation and energy saving can be achieved.
    Type: Application
    Filed: August 24, 2022
    Publication date: January 11, 2024
    Inventor: CHIN WEN WU
  • Patent number: D1016008
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: February 27, 2024
    Assignee: ABB E-MOBILITY B.V
    Inventors: Ganxing Zheng, Yun Wu, Wen Zhou