Abstract: A chip package structure including a heat dissipation base, a first redistribution layer, a second redistribution layer, at least one chip, at least one metal stack, a plurality of conductive structures, and an encapsulant is provided. The second redistribution layer is disposed on the heat dissipation base and thermally coupled to the heat dissipation base. The chip, the metal stack, and the conductive structures are disposed between the second redistribution layer and the first redistribution layer. An active surface of the chip is electrically connected to the first redistribution layer and an inactive surface of the chip is thermally coupled to the second redistribution layer via the metal stack. The first redistribution layer is electrically connected to the second redistribution layer via the conductive structures. The encapsulant is filled between the second redistribution layer and the first redistribution layer. A manufacturing method of a chip package structure is also provided.

Abstract: A method includes forming a first conductive feature, depositing a passivation layer on a sidewall and a top surface of the first conductive feature, etching the passivation layer to reveal the first conductive feature, and recessing a first top surface of the passivation layer to form a step. The step comprises a second top surface of the passivation layer. The method further includes forming a planarization layer on the passivation layer, and forming a second conductive feature extending into the passivation layer to contact the first conductive feature.

Abstract: An external device is used with a backend host operated with an operating system. The external device has a program and receives incoming data. The external device is operated with the backend host according to an operating method including the following steps. Firstly, the external device is connected to the backend host, and the external device is recognized by the operating system. Then, the external device is reconnected to the backend host to have the operating system recognize the external device as a memory device when the external device is unrecognizable by the operating system, so that the program is accessible and executable by the operating system to control the external device, or the external device converts the incoming data into at least one data file complying with the access format of a certain program in the operating system.

Abstract: An external device is used with a backend host operated with an operating system. The external device has a program and receives incoming data. The external device is operated with the backend host according to an operating method including the following steps. Firstly, the external device is connected to the backend host, and the external device is recognized by the operating system. Then, the external device is reconnected to the backend host to have the operating system recognize the external device as a memory device when the external device is unrecognizable by the operating system, so that the program is accessible and executable by the operating system to control the external device, or the external device converts the incoming data into at least one data file complying with the access format of a certain program in the operating system.

Abstract: A semiconductor package with a heat sink, a method for fabricating the same and a stiffener for the semiconductor package are proposed. At least one chip and the stiffener surrounding the chip are mounted on a substrate, and the heat sink is respectively attached to a non-active surface of the chip and the stiffener. A plurality of penetrating openings are formed on the stiffener, and an adhesive is filled in the penetrating openings to enhance the bonding strength of the heat sink and the stiffener, thereby inhibiting the heat sink and the stiffener from coming off.