Patents by Inventor Wen-Chen HSU

Wen-Chen HSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096834
    Abstract: A method is provided. The method includes determining a first bump map indicative of a first set of positions of bumps. The method includes determining, based upon the first bump map, a first plurality of bump densities associated with a plurality of regions of the first bump map. The method includes smoothing the first plurality of bump densities to determine a second plurality of bump densities associated with the plurality of regions of the first bump map. The method includes determining, based upon the second plurality of bump densities, a second bump map indicative of the first set of positions of the bumps and a set of sizes of the bumps.
    Type: Application
    Filed: March 27, 2023
    Publication date: March 21, 2024
    Inventors: Shih Hsuan HSU, Chan-Chung CHENG, Chun-Chen LIU, Cheng-Hung CHEN, Peng-Ren CHEN, Wen-Hao CHENG, Jong-l MOU
  • Publication number: 20170361454
    Abstract: A tool box contains: a first accommodation part, a second accommodation part covering with or uncovering from the first accommodation part, and at least one housing portion arranged on the first accommodation part and the second accommodation part so as to mount at least one holder, respectively. The first accommodation part or the second accommodation part includes at least one engagement portion, and each of the at least one holder has at least one contacting portion so as to retain with the at least one engagement portion of the first accommodation part or the second accommodation part. Thereby, multiple tools are removed from or secured on the at least one holder easily.
    Type: Application
    Filed: June 16, 2016
    Publication date: December 21, 2017
    Inventor: Wen-Chen HSU