Abstract: A wavelength conversion member includes a substrate, a phosphor layer, and a ventilated blade. The substrate is configured to rotate based on an axis. The phosphor layer is disposed on the substrate. The ventilated blade is disposed on the substrate and has a pore density between 10 ppi and 500 ppi or a volume porosity between 5% and 95%.

Abstract: A wavelength conversion member includes a substrate, a phosphor layer, and a non-ventilated blade. The substrate is configured to rotate based on an axis. The phosphor layer is disposed on the substrate. The non-ventilated blade has a roughness between 5 ?m and 1.25 mm, or a specific surface area of the non-ventilated blade exceeds a geometric area of the non-ventilated blade by more than 10%.

Abstract: A manufacturing method for a micro-needle device includes following steps: a target tissue basic information obtaining step, a micro-needle template obtaining step, a micro-needle material adding step, a micro-needle semi-product obtaining step, and a micro-needle device obtaining step. The inner tissue distribution information is obtained by the application of optical coherence tomography. The micro-needle template is obtained according to the skin surface curvature information and the inner tissue distribution information. The micro-needle template has a plurality of areas and a plurality of mold holes. One or both of the diameter and the depth of the mold hole is determined by the inner tissue distribution information, and the curvature radius of the areas is determined by the skin surface curvature information. The manufacturing method for a micro-needle device is applicable to micro-needles with mixed configurations as well as micro-needles with syringe configurations.

Abstract: A micro-needle device is applicable for a target tissue with a first area having a first parameter and a second area having a second parameter. The micro-needle device includes a substrate and a micro-needle array connected to the substrate. The micro-needle array includes a first micro-needle corresponding to the first area and a second micro-needle corresponding to the second area. One of the surfaces of the substrate having the micro-needle array corresponds to the surface curvature of the target tissue. The first micro-needle has a first configuration corresponding to the first parameter, and the second micro-needle has a second configuration corresponding to the second parameter and different from the first configuration. The configuration includes at least one selected from a group consisting of length, distribution density, diameter, and medicine-carrying amount of micro-needle. A method for manufacturing a micro-needle device and a method for manufacturing a micro-needle mold are also provided.

Abstract: A process for reducing the formation of potential device-contaminating particles in a process chamber, particularly an etch chamber or a pre-clean chamber used to pre-clean substrates prior to a PVD or other process. The process chamber conventionally includes multiple antennae, the purpose of which is to conduct bias power from a bias power source to a substrate supported on a pedestal assembly. According to the process of the invention, the antennae are removed from the pedestal assembly. Accordingly, the antennae, no longer present in the chamber during substrate processing, are capable of neither generating potential device-contaminating particles nor causing electrical arcing between the pedestal assembly and the chamber wall or other elements in the process chamber, leading to operational power loss.

Abstract: A process for reducing the formation of potential device-contaminating particles in a process chamber, particularly an etch chamber or a pre-clean chamber used to pre-clean substrates prior to a PVD or other process. The process chamber conventionally includes multiple antennae, the purpose of which is to conduct bias power from a bias power source to a substrate supported on a pedestal assembly. According to the process of the invention, the antennae are removed from the pedestal assembly. Accordingly, the antennae, no longer present in the chamber during substrate processing, are capable of neither generating potential device-contaminating particles nor causing electrical arcing between the pedestal assembly and the chamber wall or other elements in the process chamber, leading to operational power loss.