Patents by Inventor Wen-Chi Liu
Wen-Chi Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240153979Abstract: A method of manufacturing an image sensor structure includes forming an isolation structure in a substrate to divide the substrate into a first region and a second region, forming a first light sensing region in the first region and a second light sensing region in the second region, forming a first gate structure over the first light sensing region and a second gate structure over the second light sensing region, forming gate spacers on sidewalls of the first and second gate structures, and depositing a blocking layer on sidewalls of the gate spacers. The blocking layer has an opening positioned between the first and second gate structures. A source/drain structure is formed directly under the opening in the blocking layer. The method also includes forming an interlayer dielectric layer over the first and second gate structures and the blocking layer.Type: ApplicationFiled: April 13, 2023Publication date: May 9, 2024Inventors: Wei Long CHEN, Wen-I HSU, Feng-Chi HUNG, Jen-Cheng LIU, Dun-Nian YAUNG
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Publication number: 20240136463Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.Type: ApplicationFiled: December 20, 2023Publication date: April 25, 2024Applicant: EPISTAR CORPORATIONInventors: Yi-Chieh LIN, Shiuan-Leh LIN, Yung-Fu CHANG, Shih-Chang LEE, Chia-Liang HSU, Yi HSIAO, Wen-Luh LIAO, Hong-Chi SHIH, Mei-Chun LIU
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Publication number: 20240120304Abstract: The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a package structure, a circuit structure, a bonding structure and an external element. The circuit structure is disposed on the package structure and is electrically connected to the package structure. The circuit structure has a recess. The bonding structure includes a first bonding pad and a second bonding pad. The second bonding pad is disposed in the recess, and the second bonding pad is disposed on the first bonding pad. The bonding structure is disposed between the circuit structure and the external element. The external element is electrically connected to the circuit structure through the bonding structure. A width of the first bonding pad is smaller than a width of the second bonding pad.Type: ApplicationFiled: November 24, 2022Publication date: April 11, 2024Applicant: Innolux CorporationInventors: Tzu-Sheng Wu, Haw-Kuen Liu, Chung-Jyh Lin, Cheng-Chi Wang, Wen-Hsiang Liao, Te-Hsun Lin
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Patent number: 11951901Abstract: A display system suitable for a vehicle is provided. The display system suitable for the vehicle includes a center console, a processing device, and a display device. The center console is configured to generate a power sequence according to a customization setting, and the power sequence corresponds to content of a data table. The processing device is configured to receive the power sequence and decodes the power sequence through a lookup table to generate a decoding result. The lookup table includes the content of the data table. The display device is coupled to the processing device and is configured to display a display image according to the decoding result.Type: GrantFiled: December 31, 2020Date of Patent: April 9, 2024Assignee: Coretronic CorporationInventors: Jui-Ta Liu, Wen-Chang Chien, Tsung-Hsin Yeh, Shao-Chi Lin
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Publication number: 20130025908Abstract: A conducting wire structure for transmitting electric power is provided, which includes a plurality of first core wires and a plurality of second core wires twisted together with each other, in which each of the first core wires is composed of multiple metal materials, a first metal layer is located at the center of the first core wire and the first metal layer is clad in a second metal layer.Type: ApplicationFiled: July 23, 2012Publication date: January 31, 2013Applicant: FSP TECHNOLOGY INC.Inventors: Wen-Chi Liu, Mao-Kuan Lin
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Patent number: 8106323Abstract: A potential switching apparatus for a power adapter which transforms input power to output power delivered through a power output cord. The potential switch apparatus switches the potential of the output power. It includes a first body and a second body located on the power output cord. The first body has a first contact and a second contact. The second body has a switch element connectable to the first contact to deliver the output power at a first potential and connectable to the second contact to deliver the output power at a second potential. Thus the potential of the output power can be switched. The present invention improves the conventional potential switch device on the power adapter that is too bulky in size.Type: GrantFiled: December 30, 2008Date of Patent: January 31, 2012Assignee: FSP Technology Inc.Inventors: Wen-Chi Liu, Chi-Tsung Liang, Chia-Cheng Liu
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Publication number: 20100163393Abstract: A potential switching apparatus for a power adapter which transforms input power to output power delivered through a power output cord. The potential switch apparatus switches the potential of the output power. It includes a first body and a second body located on the power output cord. The first body has a first contact and a second contact. The second body has a switch element connectable to the first contact to deliver the output power at a first potential and connectable to the second contact to deliver the output power at a second potential. Thus the potential of the output power can be switched. The present invention improves the conventional potential switch device on the power adapter that is too bulky in size.Type: ApplicationFiled: December 30, 2008Publication date: July 1, 2010Inventors: Wen-Chi LIU, Chi-Tsung Liang, Chia-Cheng Liu
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Publication number: 20100062652Abstract: A power adapter with a changeable plug includes a positioning surface and an electric connecting surface connected to an edge of the positioning surface. The plug has a positioning plate and an electric connecting plate corresponding to the positioning surface and the electric connecting surface. The electric connecting surface and the electric connecting plate have a first socket and a second socket, and the plug has a transmission terminal electrically connected to the second socket, such that the power adapter and the plug are disposed on different distal surface through the positioning surface and the electric connecting surface as well as the positioning plate and the electric connecting plate to improve the shortcomings of traditional power adapters having a poor contact when conducting components are worn out or damaged in a process of installing or removing the plug, so as to improve the quality of power transmission.Type: ApplicationFiled: September 5, 2008Publication date: March 11, 2010Inventor: Wen-Chi Liu
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Publication number: 20090168400Abstract: In a light emitting frame and a heat dissipating fan using the light emitting frame, a light emitting element can be installed freely on the heat dissipating fan by a detachable light emitting frame composed of a separate main frame body, and the main frame body has a limit position portion passed through by a same fixing element, such that when the heat dissipating fan is installed to an electronic device, the light emitting frame is fixed. The invention overcomes the shortcomings of a prior art design of integrating the light emitting element with the heat dissipating element. In addition to lowering the manufacturing cost, the invention provides a number of selections for the material of the light emitting element and the light projecting angle.Type: ApplicationFiled: December 27, 2007Publication date: July 2, 2009Inventor: Wen-Chi LIU
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Publication number: 20080030925Abstract: The present invention discloses a power connector used as an electric conducting component between output terminals having an equal electric potential, so that the output terminals having an equal electric potential can share the same electric wire of the same electric potential, so as to save the material cost of wires.Type: ApplicationFiled: August 3, 2006Publication date: February 7, 2008Inventor: Wen-Chi Liu
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Patent number: 6266896Abstract: A shoe sole including a shoe sole casing and a polyurethane foam body encased by the shoe sole casing. The shoe sole casing is made of a material having a high specific gravity. The shoe sole casing has a top layer and a bottom layer with a plurality of through holes formed in the top layer. The polyurethane foam body has an ultra lightweight and a plurality of material-reducing holes corresponding in location to the through holes of the shoe sole casing. The polyurethane foam body is provided with a plurality of through holes, with each having a connection rod extending from the top layer to the bottom layer of the casing therein for placing the polyurethane foam body in the shoe sole casing.Type: GrantFiled: March 20, 2000Date of Patent: July 31, 2001Assignee: Ding Sheug Industry Co., Ltd.Inventor: Wen-Chi Liu