Patents by Inventor Wen-Chih Shen

Wen-Chih Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11894308
    Abstract: The present disclosure provides a semiconductor substrate, including a first dielectric layer with a first surface and a second surface, a first conductive via extending between the first surface and the second surface, a first patterned conductive layer on the first surface, and a second patterned conductive layer on the second surface. The first conductive via includes a bottom pattern on the first surface and a second patterned conductive layer on the second surface. The bottom pattern has at least two geometric centers corresponding to at least two geometric patterns, respectively, and a distance between one geometric center and an intersection of the two geometrical patterns is a geometric radius. A distance between the at least two geometric centers is greater than 1.4 times the geometric radius. A method for manufacturing the semiconductor substrate described herein and a semiconductor package structure having the semiconductor substrate are also provided.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: February 6, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Sheng-Ming Wang, Tien-Szu Chen, Wen-Chih Shen, Hsing-Wen Lee, Hsiang-Ming Feng
  • Patent number: 11099058
    Abstract: An electronic scale calibrating method for an electronic scale is provided. The electronic scale includes a weighing pan, a memory unit, a first weight sensor and a second weight sensor. The weighing pan has a placement region. The first weight sensor and the second weight sensor are symmetric with respect to the placement region. Firstly, two standard samples are placed in the placement region simultaneously. Then, the first weight sensor and the second weight sensor sense the two standard samples to obtain a first read value and a second read value, respectively. Then, a first parameter, a second parameter, a first calibration coefficient and a second calibration coefficient are defined according to the first read value and the second read value. Then, a calibration formula is generated and stored in the memory unit.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: August 24, 2021
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Pei-Ming Chang, Wen-Chih Shen
  • Publication number: 20210091006
    Abstract: The present disclosure provides a semiconductor substrate, including a first dielectric layer with a first surface and a second surface, a first conductive via extending between the first surface and the second surface, a first patterned conductive layer on the first surface, and a second patterned conductive layer on the second surface. The first conductive via includes a bottom pattern on the first surface and a second patterned conductive layer on the second surface. The bottom pattern has at least two geometric centers corresponding to at least two geometric patterns, respectively, and a distance between one geometric center and an intersection of the two geometrical patterns is a geometric radius. A distance between the at least two geometric centers is greater than 1.4 times the geometric radius. A method for manufacturing the semiconductor substrate described herein and a semiconductor package structure having the semiconductor substrate are also provided.
    Type: Application
    Filed: December 1, 2020
    Publication date: March 25, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Sheng-Ming WANG, Tien-Szu CHEN, Wen-Chih SHEN, Hsing-Wen LEE, Hsiang-Ming FENG
  • Publication number: 20210063239
    Abstract: Disclosures of the present invention describe a method for calibrating laser power. During a laser power calibration of a laser optics product, reference intensity data and reference power data are adopted for generating a reference trend line with a R2 value that is equal to 1. As such, real intensity data that have a residual value smaller than a threshold value are adopted for generating a first trend line in combination with real power data. Moreover, the real intensity data that have a residual value greater than the threshold value are utilized for generating a second trend line in combination with corresponding real power data. Consequently, under an assistance of a predict trend line constituted by the first trend line and the second trend line, the laser power calibration is therefore completed after the laser optics product successively emits a laser beam by a few times.
    Type: Application
    Filed: October 22, 2019
    Publication date: March 4, 2021
    Inventors: SHIH-CHIEH HSU, WEI-LUNG HUANG, PEI-MING CHANG, PAO-CHUNG CHAO, WEN-CHIH SHEN
  • Publication number: 20210026461
    Abstract: Disclosures of the present invention describe an independent inputting device with self-learning function. During a user inputting a vocabulary word and/or a sentence, this independent inputting device can forecast what vocabulary word is that the user desires to input in case of a number of inputted letters of the vocabulary word reaching a threshold integer (?N). Consequently, this independent inputting device automatically completes the inputting of those un-inputted letters of the vocabulary word, such that the user does no longer continue the inputting of those un-inputted letters of the vocabulary word. As such, when the user adopts one input method to edit a program code, write an article or a letter, or make statistical forms, inputting speed of the typed vocabulary words can be apparently increased by this independent inputting device, thereby largely enhancing the user's work efficiency.
    Type: Application
    Filed: October 3, 2019
    Publication date: January 28, 2021
    Inventors: SHIH-CHIEH HSU, WEN-CHIH SHEN, WEI-LUNG HUANG, PEI-MING CHANG, PAO-CHUNG CHAO
  • Patent number: 10854550
    Abstract: The present disclosure provides a semiconductor substrate, including a first dielectric layer with a first surface and a second surface, a first conductive via extending between the first surface and the second surface, a first patterned conductive layer on the first surface, and a second patterned conductive layer on the second surface. The first conductive via includes a bottom pattern on the first surface and a second patterned conductive layer on the second surface. The bottom pattern has at least two geometric centers corresponding to at least two geometric patterns, respectively, and a distance between one geometric center and an intersection of the two geometrical patterns is a geometric radius. A distance between the at least two geometric centers is greater than 1.4 times the geometric radius. A method for manufacturing the semiconductor substrate described herein and a semiconductor package structure having the semiconductor substrate are also provided.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: December 1, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Sheng-Ming Wang, Tien-Szu Chen, Wen-Chih Shen, Hsing-Wen Lee, Hsiang-Ming Feng
  • Publication number: 20200217710
    Abstract: An electronic scale calibrating method for an electronic scale is provided. The electronic scale includes a weighing pan, a memory unit, a first weight sensor and a second weight sensor. The weighing pan has a placement region. The first weight sensor and the second weight sensor are symmetric with respect to the placement region. Firstly, two standard samples are placed in the placement region simultaneously. Then, the first weight sensor and the second weight sensor sense the two standard samples to obtain a first read value and a second read value, respectively. Then, a first parameter, a second parameter, a first calibration coefficient and a second calibration coefficient are defined according to the first read value and the second read value. Then, a calibration formula is generated and stored in the memory unit.
    Type: Application
    Filed: April 25, 2019
    Publication date: July 9, 2020
    Inventors: Pei-Ming Chang, Wen-Chih Shen
  • Publication number: 20190096814
    Abstract: The present disclosure provides a semiconductor substrate, including a first dielectric layer with a first surface and a second surface, a first conductive via extending between the first surface and the second surface, a first patterned conductive layer on the first surface, and a second patterned conductive layer on the second surface. The first conductive via includes a bottom pattern on the first surface and a second patterned conductive layer on the second surface. The bottom pattern has at least two geometric centers corresponding to at least two geometric patterns, respectively, and a distance between one geometric center and an intersection of the two geometrical patterns is a geometric radius. A distance between the at least two geometric centers is greater than 1.4 times the geometric radius. A method for manufacturing the semiconductor substrate described herein and a semiconductor package structure having the semiconductor substrate are also provided.
    Type: Application
    Filed: August 22, 2018
    Publication date: March 28, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Sheng-Ming WANG, Tien-Szu CHEN, Wen-Chih SHEN, Hsing-Wen LEE, Hsiang-Ming FENG
  • Publication number: 20050040200
    Abstract: A tool case device includes a retaining member attached to a base member of a case, one or more pockets attached to the case and each having an opening to receive a tool. The tool includes a pair of levers having a middle pivotal shaft, each of the levers includes a handle on one end and a tool member on the other end. Another retaining member is attached to the middle portion of the pocket, to selectively engage with the retaining member of the base member. The retaining members are located between the handles of the levers, to detachably retain the tool in the pocket, and may be quickly disengaged from each other when the tool is pulled out of the pocket.
    Type: Application
    Filed: August 19, 2003
    Publication date: February 24, 2005
    Inventor: Wen-Chih Shen
  • Publication number: 20040221457
    Abstract: A machete sheath includes a first sheet and a second sheet securely connected to the first sheet. An L-shaped opening is defined between the first and second halves and an extension plate is formed on the peripheral edge of the second sheet along the L-shaped opening.
    Type: Application
    Filed: May 6, 2003
    Publication date: November 11, 2004
    Inventor: Wen-Chih Shen