Patents by Inventor Wen Ching Lai

Wen Ching Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11963385
    Abstract: The disclosure provides a local stretch packaging structure, including a substrate, a flexible electronic element, a plurality of light-emitting display elements, and a packaging layer. The flexible electronic element is disposed on the substrate. These light-emitting display elements are disposed on the flexible electronic element. The packaging layer includes a packaging area and a non-packaging area. The packaging area covers the upper surface and sidewalls of these light-emitting display elements. The non-packaging area is directly covered the flexible electronic element that is not disposed with these light-emitting display elements.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: April 16, 2024
    Assignees: Interface Technology (ChengDu) Co., Ltd., Interface Optoelectronics (ShenZhen) Co., Ltd., General Interface Solution Limited
    Inventors: Wen-You Lai, Ping-Hsiang Kao, Po-Lun Chen, Chun-Ta Chen, Po-Ching Lin, Ya-Chu Hsu
  • Publication number: 20240090230
    Abstract: A memory array and an operation method of the memory array are provided. The memory array includes first and second ferroelectric memory devices formed along a gate electrode, a channel layer and a ferroelectric layer between the gate electrode and the channel layer. The ferroelectric memory devices include: a common source/drain electrode and two respective source/drain electrodes, separately in contact with a side of the channel layer opposite to the ferroelectric layer, wherein the common source/drain electrode is disposed between the respective source/drain electrodes; and first and second auxiliary gates, capacitively coupled to the channel layer, wherein the first auxiliary gate is located between the common source/drain electrode and one of the respective source/drain electrodes, and the second auxiliary gate is located between the common source/drain electrode and the other respective source/drain electrode.
    Type: Application
    Filed: January 9, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Ling Lu, Chen-Jun Wu, Ya-Yun Cheng, Sheng-Chih Lai, Yi-Ching Liu, Yu-Ming Lin, Feng-Cheng Yang, Chung-Te Lin
  • Publication number: 20240074063
    Abstract: A photosensitive assembly includes a circuit board and a photosensitive chip disposed on the circuit board. A first direction is defined as a direction from the circuit board to the photosensitive chip. The circuit board is convex in the first direction or an opposite direction of the first direction. The photosensitive chip is in the first direction or the opposite direction of the first direction. A bending direction of the circuit board is the same as a bending direction of the photosensitive chip.
    Type: Application
    Filed: November 22, 2022
    Publication date: February 29, 2024
    Inventors: WEN-CHING LAI, WAN-LI ZHANG, ZHI-WEI LI, YA-JIE NIU
  • Patent number: 11830899
    Abstract: An image capture device includes a sensing component, a filter layer, and a micromotor. The sensing component includes a plurality of sensing units arranged in an array. The filter layer is disposed on one side of the sensing component and includes a plurality of filter units arranged in an array. The micromotor includes a stator and a mover, the sensing component is fixed on the stator, the filter layer is fixed on the mover. The micromotor is used to drive the filter layer to move relative to the sensing component, such that the plurality of sensing units is moved to a one-to-one corresponding position relative to the plurality of filter units.
    Type: Grant
    Filed: November 30, 2022
    Date of Patent: November 28, 2023
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
    Inventors: Wen-Ching Lai, Jie Ren
  • Publication number: 20230204485
    Abstract: An optical particle detection system includes a light source, a lens group, an absorber, a microscope group, a filter, an image sensor, and a host. Laser is emitted from the light source, the lens group is configured to reflect and expand the laser light. The absorber absorbs a plurality of particles and presents the particles to an optical path of the laser light expanded by the lens group. The microscope group amplifies an image of the particles. The filter filters the laser light from the microscope group. The image sensor converts the laser light filtered by the filter into an electrical signal and the host analyzes the electrical signal and determines quality and components of at least one target particle in the particles.
    Type: Application
    Filed: March 1, 2022
    Publication date: June 29, 2023
    Inventors: WEN-CHING LAI, YU-AN CHO, YA-JIE NIU
  • Publication number: 20230171478
    Abstract: An electronic device includes a camera module comprising a circuit board, a lens, a first IC chip, and at least one metal column. The lens is mounted on the circuit board. The first IC chip and the metal column are arranged on a surface of the circuit board away from the lens. An attachment includes a body and a second IC chip. The first IC chip and the second IC chip can communicate with each other. The circuit board includes a first surface closed to the attachment. The metal column is arranged on the first surface, and the body includes a second surface close to the camera module. The body further includes at least a connecting channel. The metal column is located in the connecting channel to realize the electrical connection between the camera module and the attachment.
    Type: Application
    Filed: January 18, 2022
    Publication date: June 1, 2023
    Inventors: YE-QUANG CHEN, CHIA-WENG HSU, WEN-CHING LAI, WAN-LI ZHANG
  • Publication number: 20230060674
    Abstract: A dual-lens camera system includes a first lens, a second lens, an image sensor corresponding to a position of the first lens, and a reflecting assembly. The reflecting assembly includes a first reflecting member and a second reflecting member corresponding to a position of the second lens. The first reflecting member is movable between a first position at which an optical path from the first lens to the image sensor is blocked but an optical path from the second reflecting member to the image sensor is not blocked, and a second position at which the optical path from the first lens to the image sensor is not blocked but the optical path from the second reflective member to the image sensor is blocked. Only one image sensor is used in the dual-lens camera system, which saves cost and takes up less internal space of the electronic device.
    Type: Application
    Filed: June 8, 2022
    Publication date: March 2, 2023
    Inventors: WEN-CHING LAI, CHAO-YU QIN, ZHI-WEI LI
  • Patent number: 11499966
    Abstract: A digitally encoded microflake includes a polymer layer, which has a top surface and a bottom surface substantially parallel to the top surface. At least one of the top surface and the bottom surface is to be coupled to target-specific probes for bonding with a target analyte. The microflake is identified by a binary sequence of bits encoded by an edge outline on a plane substantially parallel to the top surface and the bottom surface. The bits in the binary sequence are encoded at respective predefined locations surrounding the edge outline.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: November 15, 2022
    Assignee: WinMEMS Technologies Co., Ltd.
    Inventors: Chih-Hsiang Lai, Wen-Ching Lai
  • Publication number: 20220276236
    Abstract: A digitally encoded microflake includes a polymer layer, which has a top surface and a bottom surface substantially parallel to the top surface. At least one of the top surface and the bottom surface is to be coupled to target-specific probes for bonding with a target analyte. The microflake is identified by a binary sequence of bits encoded by an edge outline on a plane substantially parallel to the top surface and the bottom surface. The bits in the binary sequence are encoded at respective predefined locations surrounding the edge outline.
    Type: Application
    Filed: May 12, 2022
    Publication date: September 1, 2022
    Inventors: Chih-Hsiang LAI, Wen-Ching LAI
  • Patent number: 11381766
    Abstract: A lens module reducing flare and having no dark edges includes a bracket and a sensor. The bracket includes a supporting portion, a first receiving groove, and a second receiving groove. The supporting portion is formed at a junction between the first receiving groove and the second receiving groove. The supporting portion comprises an arc surface. The sensor is received in the first receiving groove. The sensor includes a photosensitive area and a non-photosensitive area surrounding the photosensitive area. The arc surface faces the sensor. A center of a circle of the arc surface falls within the non-photosensitive area. Light reflected by the arc surface falls outside the sensor.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: July 5, 2022
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
    Inventors: Zhi-Fei Zhao, Wen-Ching Lai
  • Patent number: 11366109
    Abstract: A digitally encoded microflake includes a polymer layer, which has a top surface and a bottom surface substantially parallel to the top surface. At least one of the top surface and the bottom surface is to be coupled to target-specific probes for bonding with a target analyte. The microflake is identified by a binary sequence of bits encoded by an edge outline on a plane substantially parallel to the top surface and the bottom surface. The bits in the binary sequence are encoded at respective predefined locations surrounding the edge outline.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: June 21, 2022
    Assignee: WinMEMS Technologies Co., Ltd.
    Inventors: Chih-Hsiang Lai, Wen-Ching Lai
  • Patent number: 11333533
    Abstract: A grating measuring module includes a light source, a collimating device, a first grating, a second grating, and an image sensing chip. The first grating is arranged on an optical path of the collimating device and the second grating is arranged on an optical path of the first grating. Each of the two gratings comprises a first pattern and a plurality of second patterns locating at the both sides of the first pattern. The first and second gratings can each be attached to an object which may be displaced in relation to another object, so allowing light of a certain pattern to pass depending on the magnitude of the displacement. The image sensing chip arranged on an optical path from the second grating receives light emitted from the light source and forms an image from which a displacement can be calculated and displayed.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: May 17, 2022
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
    Inventors: Wen-Ching Lai, Chao-Yu Qin, Yu-An Cho
  • Publication number: 20210285800
    Abstract: A grating measuring module includes a light source, a collimating device, a first grating, a second grating, and an image sensing chip. The first grating is arranged on an optical path of the collimating device and the second grating is arranged on an optical path of the first grating. Each of the two gratings comprises a first pattern and a plurality of second patterns locating at the both sides of the first pattern. The first and second gratings can each be attached to an object which may be displaced in relation to another object, so allowing light of a certain pattern to pass depending on the magnitude of the displacement. The image sensing chip arranged on an optical path from the second grating receives light emitted from the light source and forms an image from which a displacement can be calculated and displayed.
    Type: Application
    Filed: April 7, 2020
    Publication date: September 16, 2021
    Inventors: WEN-CHING LAI, CHAO-YU QIN, YU-AN CHO
  • Publication number: 20210127078
    Abstract: A lens module reducing flare and having no dark edges includes a bracket and a sensor. The bracket includes a supporting portion, a first receiving groove, and a second receiving groove. The supporting portion is formed at a junction between the first receiving groove and the second receiving groove. The supporting portion comprises an arc surface. The sensor is received in the first receiving groove. The sensor includes a photosensitive area and a non-photosensitive area surrounding the photosensitive area. The arc surface faces the sensor. A center of a circle of the arc surface falls within the non-photosensitive area. Light reflected by the arc surface falls outside the sensor.
    Type: Application
    Filed: January 13, 2020
    Publication date: April 29, 2021
    Inventors: ZHI-FEI ZHAO, WEN-CHING LAI
  • Publication number: 20200182867
    Abstract: A digitally encoded microflake includes a polymer layer, which has a top surface and a bottom surface substantially parallel to the top surface. At least one of the top surface and the bottom surface is to be coupled to target-specific probes for bonding with a target analyte. The microflake is identified by a binary sequence of bits encoded by an edge outline on a plane substantially parallel to the top surface and the bottom surface. The bits in the binary sequence are encoded at respective predefined locations surrounding the edge outline.
    Type: Application
    Filed: October 15, 2019
    Publication date: June 11, 2020
    Inventors: Chih-Hsiang LAI, Wen-Ching LAI
  • Patent number: 8471948
    Abstract: A camera module includes a printed circuit board (PCB), an image sensor fixed to the PCB, a lens holder fixed to the PCB and covering the image sensor, a lens barrel coupled to the lens holder, and a lens received in the lens barrel. The lens holder includes an inner sensor cover and an outer sensor cover surrounding the inner sensor cover. The image sensor, the inner sensor cover, the lens barrel and the lens define an enclosed space. The inner sensor cover and the outer sensor cover define an intermediate space. The inner sensor cover defines an inner dissipation hole communicating the enclosed space with the intermediate space. The outer sensor cover defines an outer dissipation hole that communicates the intermediate space with the outside of the outer sensor cover. The inner dissipation hole and the outer dissipation hole are misaligned to prevent the ingress of light and dust.
    Type: Grant
    Filed: May 23, 2011
    Date of Patent: June 25, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Sheng-Hung Hou, Wen-Ching Lai
  • Publication number: 20120212664
    Abstract: A camera module includes a printed circuit board (PCB), an image sensor fixed to the PCB, a lens holder fixed to the PCB and covering the image sensor, a lens barrel coupled to the lens holder, and a lens received in the lens barrel. The lens holder includes an inner sensor cover and an outer sensor cover surrounding the inner sensor cover. The image sensor, the inner sensor cover, the lens barrel and the lens define an enclosed space. The inner sensor cover and the outer sensor cover define an intermediate space. The inner sensor cover defines an inner dissipation hole communicating the enclosed space with the intermediate space. The outer sensor cover defines an outer dissipation hole that communicates the intermediate space with the outside of the outer sensor cover. The inner dissipation hole and the outer dissipation hole are misaligned to prevent the ingress of light and dust.
    Type: Application
    Filed: May 23, 2011
    Publication date: August 23, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHENG-HUNG HOU, WEN-CHING LAI
  • Publication number: 20120212067
    Abstract: A portable complex power supply apparatus includes a portable case in which a hand generator, a power input connection member, a power control circuit element, a power storage unit, and an output connector are disposed or contained. Thus, the portable complex power supply apparatus is capable of supplying electric power everywhere by manpower or a power generator connected therewith, storing the electric power, and outputting the electric power to an electrical device with varies kinds of power specifications, so as to provide convenience in supplying electric power.
    Type: Application
    Filed: January 6, 2012
    Publication date: August 23, 2012
    Applicant: SUNWELL DYNAMICS RESOURCES CORP.
    Inventor: WEN-CHING LAI
  • Patent number: 8049815
    Abstract: A camera module includes an image sensor, a substrate, a lens part, a lens holder, and a voice-coil motor (VCM). The image sensor is supported on and electrically connected to the substrate. The lens holder has a bottom end and an upper end opposite to the bottom end. The image sensor is accommodated within the lens holder. The lens part includes a lens barrel which has an upper portion and a bottom portion and is disposed on the lens holder. The VCM includes a winding coiling around the upper portion and a set of permanent magnetic members fixedly fixed and surrounding the winding. The outer diameter of the upper portion is smaller than that of the bottom portion. The VCM is configured for driving the lens part to move toward to or away from the image sensor.
    Type: Grant
    Filed: December 10, 2008
    Date of Patent: November 1, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Fu-Min Huang, Wen-Ching Lai, Sheng-Hung Hou
  • Patent number: 7924344
    Abstract: An exemplary objective holder for engaging with a PCB substrate having an image sensor and several passive components arranged thereon, includes a base and several continuously connected walls extending from the base. The walls enclose a chamber thereamong for receiving the image sensor and define notches therein for receiving the passive components.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: April 12, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Su-Jen Cheng, Wen-Ching Lai, Wen-Chang Chen