Abstract: The present invention provides a method and apparatus for a memory build-in self-diagnosis and repair with syndrome identification. It uses a fail-pattern identification and a syndrome-format structure to identify faulty rows, faulty columns and single faulty word in the memory during the testing process, then exports the syndrome information. Based on the syndrome information, a redundancy analysis algorithm is applied to allocate the spare memory elements repairing the faulty memory cells. It has a sequencer with enhanced fault syndrome identification, a build-in redundancy-analysis circuit with improved redundancy utilization, and an address reconfigurable circuit with reduced timing penalty during normal access. The invention reduces the occupation time and the required capture memory space in the automatic test equipment. It also increases the repair rate and reduces the required area overhead.

Abstract: A fixing auxiliary device includes a main body, at least an extension arm and an adhesive element. The main body has a first portion in contact with a connecting portion of a circuit board and a second portion coupled to an extension plate of a metallic assembly. The at least an extension arm extends from an edge of the main body and is bent toward one side of the main body so as to clamp the extension plate of the metallic assembly. The adhesive element is used for bonding the first portion of the main body onto the connecting portion of the circuit board.

Abstract: A fixing auxiliary device includes a main body, at least an extension arm and an adhesive element. The main body has a first portion in contact with a connecting portion of a circuit board and a second portion coupled to an extension plate of a metallic assembly. The at least an extension arm extends from an edge of the main body and is bent toward one side of the main body so as to clamp the extension plate of the metallic assembly. The adhesive element is used for bonding the first portion of the main body onto the connecting portion of the circuit board.

Abstract: A wrapper testing circuit and method thereof for System-On-a-Chip is provided for electrical tests of core circuits of an integrated circuit. The testing circuit includes a decoding logic with an encoding table for receiving test signals and delivering control signals in response to the test signals according to the table; a plurality of registers for saving the control signals temporarily and delivering the control signals to the core circuits; a bypass circuit for delivering the test signals; and an instruction register for saving the test signals temporarily and refreshing the data in the registers and the bypass circuits after the decoding logic issues the control signals. The encoding of the control signals is completed in one period. Compared with the serial encoding in the prior art, test time is reduced.

Abstract: A temperature-homogenizing device for uniformly dissipating heat generated from electronic components in an electronic device to a housing of the electronic device includes a first and a second higher thermally conductive layers and a first lower thermally conductive layer. The first lower thermally conductive layer is disposed between the first and the second higher thermally conductive layers, and made of a material or a medium having a lower thermal conductivity than each of the first and the second higher thermally conductive layers. By means of this temperature-homogenizing device, the heat is homogeneously distributed throughout the first and the second higher thermally conductive layers at a higher thermal conduction rate and transferred through the first lower thermally conductive layer at a lower thermal conduction rate so as to maintain homogeneous temperature distribution on the housing.

Abstract: An electronic device with a heat-dissipation structure is disclosed. The electronic device comprises a housing, a printed circuit board assembly, and a heat sink. The printed circuit board assembly is disposed in an interior of the housing, and the printed circuit board assembly forms a high-temperatured heat flow area and a low-temperatured heat flow area in the electronic device. The heat sink is disposed between the printed circuit board assembly and the housing and in the low-temperatured heat flow area for balancing heat flow and homogenizing temperature of the electronic device to enhance heat-dissipation efficiency.

Abstract: The present invention provides a method and apparatus for a memory build-in self-diagnosis and repair with syndrome identification. It uses a fail-pattern identification and a syndrome-format structure to identify faulty rows, faulty columns and single faulty word in the memory during the testing process, then exports the syndrome information. Based on the syndrome information, a redundancy analysis algorithm is applied to allocate the spare memory elements repairing the faulty memory cells. It has a sequencer with enhanced fault syndrome identification, a build-in redundancy-analysis circuit with improved redundancy utilization, and an address reconfigurable circuit with reduced timing penalty during normal access. The invention reduces the occupation time and the required capture memory space in the automatic test equipment. It also increases the repair rate and reduces the required area overhead.

Abstract: The present invention is to provide a case comprising a structure for fastening a sliding button having a fixing member and a manipulating member together forming an L-shaped member, two spaced ribs provided on an inner surface of the manipulating member above the fixing member, and a projection provided on an outer surface of the manipulating member and adapted to insert through an opening of the case and project therefrom to outside of the case while placing the sliding button in the case; and a circuit board threadedly secured to a bottom of the case for clamping the fixing member and thus fastening the sliding button.

Abstract: The present invention discloses an antenna with a fixed base rotary positioning structure, which can be placed on a table or hung on a wall, comprising: a fixed base; a protrusion disposed on the fixed base and having an open end on one side; a chamber enclosed by the rest of three sides; a pivotal axial hole and an arc groove being correspondingly disposed on both sides of the inner wall of the protrusion, such that the pivotal axial hole and the arc groove precisely and pivotally coupling the pivotal axis and the protruded fixing point to the two corresponding sides at one end of the antenna, and the antenna using such pivotal axis as the rotary axis to adjust the antenna to any angle by the open end of the protrusion.

Abstract: The present invention is to provide a dual-purpose position structure used as a hook and a dock comprising a base and another base, wherein the base is sheathed into the another base along a guiding track and two sides of a sliding trench of the base by using a guiding trench and two sides of a sliding plate of the another base, the another base is adjusted by engaging between a saw-toothed part of an elastic arm and a saw-toothed surface of the guiding track to form a dock with a size-adjustable containing space for setting an electronic apparatus therein or being hanged inversely on an office partition as a hook. At least one buckling device located on the supporting plate of the another base can be assembled with at least another buckling device located on a surface of the electronic apparatus.

Abstract: IC with built-in self-test and design method thereof. The IC comprises an SD-ADC and a Dft circuit. The Dft circuit uses a digital stimulus signal to solve the deadlock problem of the on-chip analog testing and avoid thermal noise. Moreover, according to the design method of the IC, circuits having different specification can use the Dft circuit without performance degradation for original SD-ADC.

Abstract: A built-in jitter measurement circuit for a VCO (voltage-controlled oscillator) and a PLL (phase-locked loop) is disclosed. The circuit includes a divider for dividing frequency of a signal, a time to digital converter (TDC) for converting the period of the divided signal into digital values, a variance calculator for calculating variance of the period of the divided signal, a mean calculator for calculating mean value of the period of the divided signal, a encoder and counter for encoding and calculating the period of the divided signal, and a state controller as a controller for all other components. The circuit disclosed utilizes output clock of an opened-loop circuit to be measured and a divider for increasing jitter of the original signal. By measuring the bandwidth of a closed-loop circuit, accordingly, jitter of output clock of an opened-loop or an closed-loop circuit is measured by correlating the measured bandwidth and the jitter values from extrapolation.

Abstract: IC with built-in self-test and design method thereof. The IC comprises an SD-ADC and a Dft circuit. The Dft circuit uses a digital stimulus signal to solve the deadlock problem of the on-chip analog testing and avoid thermal noise. Moreover, according to the design method of the IC, circuits having different specification can use the Dft circuit without performance degradation for original SD-ADC.

Abstract: The present invention discloses an antenna with a fixed base rotary positioning structure, which can be placed on a table or hung on a wall, comprising: a fixed base; a protrusion disposed on the fixed base and having an open end on one side; a chamber enclosed by the rest of three sides; a pivotal axial hole and an arc groove being correspondingly disposed on both sides of the inner wall of the protrusion, such that the pivotal axial hole and the arc groove precisely and pivotally coupling the pivotal axis and the protruded fixing point to the two corresponding sides at one end of the antenna, and the antenna using such pivotal axis as the rotary axis to adjust the antenna to any angle by the open end of the protrusion.

Abstract: A charger capable of providing illumination light is disclosed. The charger comprises a main body to be coupled with a power source for charging an electronic apparatus, an illumination device disposed on the main body for providing illumination light, and a control switch disposed on the main body and electrically coupled with the illumination device for controlling the illumination device to illuminate light.

Abstract: A built-in jitter measurement circuit for a VCO (voltage-controlled oscillator) and a PLL (phase-locked loop) is disclosed. The circuit includes a divider for dividing frequency of a signal, a time to digital converter (TDC) for converting the period of the divided signal into digital values, a variance calculator for calculating variance of the period of the divided signal, a mean calculator for calculating mean value of the period of the divided signal, a encoder and counter for encoding and calculating the period of the divided signal, and a state controller as a controller for all other components. The circuit disclosed utilizes output clock of an opened-loop circuit to be measured and a divider for increasing jitter of the original signal. By measuring the bandwidth of a closed-loop circuit, accordingly, jitter of output clock of an opened-loop or an closed-loop circuit is measured by correlating the measured bandwidth and the jitter values from extrapolation.

Abstract: A temperature-homogenizing device for uniformly dissipating heat generated from electronic components in an electronic device to a housing of the electronic device includes a first and a second higher thermally conductive layers and a first lower thermally conductive layer. The first lower thermally conductive layer is disposed between the first and the second higher thermally conductive layers, and made of a material or a medium having a lower thermal conductivity than each of the first and the second higher thermally conductive layers. By means of this temperature-homogenizing device, the heat is homogeneously distributed throughout the first and the second higher thermally conductive layers at a higher thermal conduction rate and transferred through the first lower thermally conductive layer at a lower thermal conduction rate so as to maintain homogeneous temperature distribution on the housing.

Abstract: A circuit board indicator comprises a plurality of lamps with cut and bent terminals, an outer plastic holder and an inner plastic holder. The outer plastic holder contains an accommodating chamber, which has a plurality of rounded holes on a lateral side thereof. The inner plastic holder has a plurality of positioning recesses and each of the positioning recesses has a guiding slot on topside thereof. The terminals of the lamps are guided by the guiding slot and inserted into corresponding positioning recesses. The inner plastic holder further has a plurality of clamping dents to clamp corresponding lamps. The inner plastic holder has barbs on two lateral sides thereof and corresponding to rectangular grooves on the outer plastic holder. The barbs are engaged into corresponding rectangular grooves when the inner plastic holder is assembled to the outer plastic holder.

Abstract: A teaching tool for a robot arm for wafer reaction ovens is provided to anchor the robot arm with respect to a tray located inside a reaction oven. The teaching tool provides an upper flange for maintaining a spacing between a handle of the robot arm and a door of the oven, a position width for keeping the teaching tool aligning with a center line of the tray, and a lower tunnel aligning with the center line for allowing a blade of the robot arm to contact closely and horizontally from a lower position and thus for maintaining a position height between the blade and a floor of the reaction oven. By providing the teaching tool, easy blind calibration with multiple contact points between the robot arm and the oven can be performed so that possible efficiency down and cost up from an ill-calibration can be reduced to a minimum.

Abstract: A circuit board indicator comprises a plurality of lamps with cut and bent terminals, an outer plastic holder and an inner plastic holder. The outer plastic holder contains an accommodating chamber, which has a plurality of rounded holes on a lateral side thereof. The inner plastic holder has a plurality of positioning recesses and each of the positioning recesses has a guiding slot on topside thereof. The terminals of the lamps are guided by the guiding slot and inserted into corresponding positioning recesses. The inner plastic holder further has a plurality of clamping dents to clamp corresponding lamps. The inner plastic holder has barbs on two lateral sides thereof and corresponding to rectangular grooves on the outer plastic holder. The barbs are engaged into corresponding rectangular grooves when the inner plastic holder is assembled to the outer plastic holder.