Patents by Inventor Wen-Chou Wang

Wen-Chou Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package substrate with dual material build-up layers
    Patent number: 8163642
    Abstract: Multi-layered, organic build-up semiconductor package substrates have build-up layers with layers of both fibrous organic dielectric material and non-fibrous organic dielectric material. Non-fibrous dielectric material layers are positioned below the signal metal layers and fibrous dielectric material layers are positioned below the power/ground plane metal layers. The package substrate combines in a single package substrate the advantages of rigidity, strength and relatively low CTE of a fibrous material with the capacity of a non-fibrous material to achieve fine resolution signal metal lines.
    Type: Grant
    Filed: August 12, 2009
    Date of Patent: April 24, 2012
    Assignee: Altera Corporation
    Inventor: Wen-Chou Wang
  • Package substrate with dual material build-up layers
    Patent number: 7602062
    Abstract: Multi-layered, organic build-up semiconductor package substrates have build-up layers with layers of both fibrous organic dielectric material and non-fibrous organic dielectric material. Non-fibrous dielectric material layers are positioned below the signal metal layers and fibrous dielectric material layers are positioned below the power/ground plane metal layers. The package substrate combines in a single package substrate the advantages of rigidity, strength and relatively low CTE of a fibrous material with the capacity of a non-fibrous material to achieve fine resolution signal metal lines.
    Type: Grant
    Filed: August 10, 2005
    Date of Patent: October 13, 2009
    Assignee: Altera Corporation
    Inventor: Wen-Chou Wang
  • METHOD OF FORMING MULTILAYER CIRCUIT STRUCTURE
    Publication number: 20010018796
    Abstract: A method for making a multilayer circuit structure using circuit substrates with apertures at edge regions is disclosed. The method includes using a roller element with teeth. The teeth are used to align the circuit substrates during a lamination process.
    Type: Application
    Filed: August 16, 1999
    Publication date: September 6, 2001
    Inventors: MICHAEL G. LEE, SOLOMON BEILIN, WEN-CHOU WANG