Patents by Inventor Wen-Chun Liu

Wen-Chun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame structure
    Patent number: 6204553
    Abstract: A lead frame for a semiconductor package. The lead frame includes a die pad and a plurality of leads. One surface of the die pad supports a silicon chip while the other surface has a plurality of annular grooves all having the same geometric center. The inner lead portion of the leads surrounds the die pad, but the die pad and the leads are on different planar surfaces.
    Type: Grant
    Filed: August 10, 1999
    Date of Patent: March 20, 2001
    Assignee: Walsin Advanced Electronics Ltd.
    Inventors: Wen-Chun Liu, Hui-Ping Liu, Jung-Jie Liou, Yi-Hsiang Pan, Sheng-Tung Tsai
  • Lead frame structure for preventing the warping of semiconductor package body
    Patent number: 6078099
    Abstract: A lead frame structure can prevent the warping of a semiconductor package body. The lead frame has a downset die pad and upset internal leads so that packaging material can be evenly distributed both above and below the lead frame.
    Type: Grant
    Filed: February 16, 1999
    Date of Patent: June 20, 2000
    Assignee: Walsin Advanced Electronics LTD
    Inventors: Wen-Chun Liu, Jung-Jie Liou, Chih-Kung Huang