Patents by Inventor Wen Feng Lee
Wen Feng Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240170314Abstract: A display device manufacturing apparatus includes a working platform, a transferring station including a transferring gantry and a transferring welding device, a defect inspecting station including an inspecting gantry and a defect inspecting device, and a mending station including a mending gantry and a mending device. The working platform includes a plurality of pairs of conveying paths, and a plurality of carriers disposed on the plurality of pairs of conveying paths. The transferring gantry, inspecting gantry and mending gantry are disposed on the working platform and stride over the conveying paths.Type: ApplicationFiled: November 15, 2023Publication date: May 23, 2024Inventors: TSAN-JEN CHEN, WEN-I LEE, TZU-HUNG HSU, QING-FENG PAN
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Publication number: 20240143045Abstract: An independent graphics card system comprises an expansion motherboard, a system power supply, at least one expansion graphics card and a fan assembly. The system power supply is electrically connected to the expansion motherboard. The at least one expansion graphics card is plugged into the expansion motherboard through an adapter card. The at least one expansion graphics card is parallel with the expansion motherboard. The fan assembly dissipates heat of the at least one expansion graphics card.Type: ApplicationFiled: October 18, 2023Publication date: May 2, 2024Inventors: SUNG-HSIEN LEE, WEN-KE WU, ZHI-FENG WEI, BIAO ZENG
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Publication number: 20240131819Abstract: A thermally conductive board includes a first metal layer, a second metal layer, and a thermally conductive layer. The material of the first metal layer includes copper, and the first metal layer has a first top surface and a first bottom surface opposite to the first top surface. A first metal coating layer covers the first bottom surface. The material of the second metal layer includes copper, and the second metal layer has a second top surface and a second bottom surface opposite to the second top surface. A second metal coating layer covers the second top surface and faces the first metal coating layer. The thermally conductive layer is an electrically insulator laminated between the first metal coating layer and the second metal coating layer.Type: ApplicationFiled: May 3, 2023Publication date: April 25, 2024Inventors: KAI-WEI LO, WEN-FENG LEE, HSIANG-YUN YANG, KUO-HSUN CHEN
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Publication number: 20240079524Abstract: A semiconductor device comprises a first semiconductor structure, a second semiconductor structure located on the first semiconductor structure, and an active layer located between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure has a first conductivity type, and includes a plurality of first layers and a plurality of second layers alternately stacked. The second semiconductor structure has a second conductivity type opposite to the first conductivity type. The plurality of first layers and the plurality of second layers include indium and phosphorus, and the plurality of first layers and the plurality of second layers respectively have a first indium atomic percentage and a second indium atomic percentage. The second indium atomic percentage is different from the first indium atomic percentage.Type: ApplicationFiled: September 6, 2023Publication date: March 7, 2024Inventors: Wei-Jen HSUEH, Shih-Chang LEE, Kuo-Feng HUANG, Wen-Luh LIAO, Jiong-Chaso SU, Yi-Chieh LIN, Hsuan-Le LIN
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Patent number: 11511521Abstract: An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm2.Type: GrantFiled: May 3, 2021Date of Patent: November 29, 2022Assignee: POLYTRONICS TECHNOLOGY CORP.Inventors: Feng-Chun Yu, Kai-Wei Lo, Wen Feng Lee, Ru-Yi Cai
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Publication number: 20220270950Abstract: An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm2.Type: ApplicationFiled: May 3, 2021Publication date: August 25, 2022Inventors: Feng-Chun YU, Kai-Wei LO, Wen Feng LEE, Ru-Yi CAI
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Publication number: 20220266572Abstract: An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm2.Type: ApplicationFiled: October 28, 2021Publication date: August 25, 2022Inventors: Feng-Chun YU, Kai-Wei LO, Wen Feng LEE, Ru-Yi CAI
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Patent number: 10892072Abstract: A PTC device comprises a laminated substrate, a first PTC material layer, a second PTC material layer, a first metal layer and a second metal layer. The laminated substrate comprises a first conductive layer, a second conductive layer and an insulating layer laminated between the first and second conductive layers. The first PTC material layer is disposed on the first conductive layer, and the second PTC material layer is disposed on the second conductive layer. The first metal layer is disposed on the first PTC material layer, and the second metal layer is disposed on the second PTC material layer. The insulating layer has a through hole filled with PTC material to form a PTC connecting member of which one end connects to the first PTC material layer and another end connects to the second PTC material layer.Type: GrantFiled: April 9, 2020Date of Patent: January 12, 2021Assignee: POLYTRONICS TECHNOLOGY CORP.Inventors: Chun-Teng Tseng, Yao-Te Chang, Wen Feng Lee
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Patent number: 10614935Abstract: A PTC device comprises a current and temperature sensing element, a first insulating layer, a second insulating layer, a first electrode layer and a second electrode layer. The current and temperature sensing device is a laminated structure comprising a first conductive layer, a second conductive layer and a PTC material layer. The first and second conductive layers are disposed on first and second surfaces of the PTC material layer, respectively. The second surface is opposite to the first surface. The first and second insulating layers are disposed on the first and second conductive layers, respectively. The first electrode layer is disposed on the first insulating layer and electrically connects to the first conductive layer. The second electrode layer is disposed on the second insulating layer and electrically connects to the second conductive layer. Corners of the current and temperature sensing device are provided with insulating members.Type: GrantFiled: March 1, 2019Date of Patent: April 7, 2020Assignee: POLYTRONICS TECHNOLOGY CORP.Inventors: Chun Teng Tseng, David Shau Chew Wang, Wen Feng Lee
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Publication number: 20200105443Abstract: A PTC device comprises a current and temperature sensing element, a first insulating layer, a second insulating layer, a first electrode layer and a second electrode layer. The current and temperature sensing device is a laminated structure comprising a first conductive layer, a second conductive layer and a PTC material layer. The first and second conductive layers are disposed on first and second surfaces of the PTC material layer, respectively. The second surface is opposite to the first surface. The first and second insulating layers are disposed on the first and second conductive layers, respectively. The first electrode layer is disposed on the first insulating layer and electrically connects to the first conductive layer. The second electrode layer is disposed on the second insulating layer and electrically connects to the second conductive layer. Corners of the current and temperature sensing device are provided with insulating members.Type: ApplicationFiled: March 1, 2019Publication date: April 2, 2020Inventors: Chun Teng TSENG, David Shau Chew WANG, Wen Feng LEE
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Patent number: 10096407Abstract: A surface mountable over-current protection device comprises a PTC material layer, first and second conductive layers, left and right electrodes, left and right conductive members, and left and right insulating members. The PTC material layer comprises a left notch at a left end and a right notch at a right end. The first conductive layer comprises a primary portion disposed on an upper surface of the PTC material layer and a secondary portion extending over the left notch, and the second conductive layer comprises a primary portion disposed on a lower surface of the PTC material layer and a secondary portion extending over the underside of the right notch. The left conductive member connects to the left electrode and the first conductive layer and isolates from the second conductive layer. The right conductive member connects to the right electrode and the second conductive layer and isolates from the first conductive layer.Type: GrantFiled: February 21, 2017Date of Patent: October 9, 2018Assignee: POLYTRONICS TECHNOLOGY CORP.Inventors: Chun Teng Tseng, Wen Feng Lee, Yung Hsien Chang, Yao Te Chang
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Publication number: 20180033527Abstract: A surface mountable over-current protection device comprises a PTC material layer, first and second conductive layers, left and right electrodes, left and right conductive members, and left and right insulating members. The PTC material layer comprises a left notch at a left end and a right notch at a right end. The first conductive layer comprises a primary portion disposed on an upper surface of the PTC material layer and a secondary portion extending over the left notch, and the second conductive layer comprises a primary portion disposed on a lower surface of the PTC material layer and a secondary portion extending over the underside of the right notch. The left conductive member connects to the left electrode and the first conductive layer and isolates from the second conductive layer. The right conductive member connects to the right electrode and the second conductive layer and isolates from the first conductive layer.Type: ApplicationFiled: February 21, 2017Publication date: February 1, 2018Inventors: Chun Teng TSENG, Wen Feng LEE, Yung Hsien CHANG, Yao Te CHANG
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Patent number: 9307646Abstract: An over-current protection device adapted to be soldered onto a circuit board comprises a PTC material layer, a first electrode foil, a second electrode foil, a bonding section and a metal connecting member. The PTC material layer has opposite first and second surfaces. The first electrode foil is in physical contact with the first surface, and the second electrode foil electrically connects to the second surface. Both the second electrode foil and the bonding section are disposed on bottom of the device, and the bonding section is separated from the second electrode foil. The metal connecting member is disposed on the lateral surface of the device. The second electrode foil is adapted to be soldered onto an electrode section of the circuit board. The bonding section and the metal connecting member connect to corresponding joint section of the circuit board.Type: GrantFiled: October 8, 2014Date of Patent: April 5, 2016Assignee: POLYTRONICS TECHNOLOGY CORP.Inventors: Chun Teng Tseng, Chi Jen Su, Wen Feng Lee
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Patent number: 9224525Abstract: An over-current protection device, which can be surface-mounted and stand upright on a circuit board and withstand 60 to 600 volts, comprises a PTC device, first and second electrodes. The PTC device is a laminated structure comprising first and second conductive layers and a PTC material layer. The first and second conductive layers are in physical contact with first and second planar surfaces of the PTC material layer, respectively. The first electrode is disposed on the first conductive layer. The second electrode is disposed on the second conductive layer and is separated from the first electrode. The first electrode, the second electrode and the PTC device commonly form an end surface which is substantially perpendicular to the first and second planar surfaces. The first electrode and the second electrode at the end surface serve as interfaces electrically connecting to the circuit board.Type: GrantFiled: September 4, 2013Date of Patent: December 29, 2015Assignee: POLYTRONICS TECHNOLOGY CORP.Inventors: Tong Cheng Tsai, Wen Feng Lee, Chun Teng Tseng, Chi Jen Su, Yi An Sha
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Publication number: 20150146334Abstract: An over-current protection device adapted to be soldered onto a circuit board comprises a PTC material layer, a first electrode foil, a second electrode foil, a bonding section and a metal connecting member. The PTC material layer has opposite first and second surfaces. The first electrode foil is in physical contact with the first surface, and the second electrode foil electrically connects to the second surface. Both the second electrode foil and the bonding section are disposed on bottom of the device, and the bonding section is separated from the second electrode foil. The metal connecting member is disposed on the lateral surface of the device. The second electrode foil is adapted to be soldered onto an electrode section of the circuit board. The bonding section and the metal connecting member connect to corresponding joint section of the circuit board.Type: ApplicationFiled: October 8, 2014Publication date: May 28, 2015Applicant: Polytronics Technology Corp.Inventors: Chun Teng TSENG, Chi Jen Su, Wen Feng Lee
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Patent number: 9041507Abstract: A surface mountable over-current protection device comprises one PTC material layer, first and second conductive layers, first and second electrodes, and an insulating layer. The PTC material layer comprises crystalline polymer and conductive filler dispersed therein. The first and second conductive layers are disposed on first and second planar surfaces of the PTC material layer, respectively. The first and second electrodes are electrically connected to the first and second conductive layers. The insulating layer is disposed between the first and the second electrodes for insulation. At the melting point of the crystalline polymer, the CTE of the crystalline polymer is greater than 100 times the CTE of the first or second conductive layer, and the first and/or second conductive layers has a thickness which is large enough to obtain a resistance jump value R3/Ri less than 1.4.Type: GrantFiled: June 5, 2013Date of Patent: May 26, 2015Assignee: POLYTRONICS TECHNOLOGY CORP.Inventors: David Shau Chew Wang, Wen Feng Lee, En Tien Yang, Chun Teng Tseng, Yi An Sha
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Patent number: 8941462Abstract: An over-current protection device has a PTC device, first and second electrodes and an insulation layer. The PTC device comprises first and second electrically conductive members and a PTC layer laminated between the first and second electrically conductive members. The first and second electrodes are electrically connected to the first and second electrically conductive members, respectively. The insulation layer is disposed on a surface of the first electrically conductive member. The device is a stack structure extending along a first direction, and comprises at least one hole extending along a second direction substantially perpendicular to the first direction. The value of the covered area of the hole divided by the area of the form factor of the over-current protection device is not less than 2%, and the value of the thickness of the device divided by the number of the PTC devices is less than 0.7 mm.Type: GrantFiled: April 19, 2013Date of Patent: January 27, 2015Assignee: Polytronics Technology Corp.Inventors: Wen Feng Lee, Kuo Hsun Chen, Chun Teng Tseng, Yi An Sha, Ming Hsun Lu
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Publication number: 20140209365Abstract: An over-current protection device, which can be surface-mounted and stand upright on a circuit board and withstand 60 to 600 volts, comprises a PTC device, first and second electrodes. The PTC device is a laminated structure comprising first and second conductive layers and a PTC material layer. The first and second conductive layers are in physical contact with first and second planar surfaces of the PTC material layer, respectively. The first electrode is disposed on the first conductive layer. The second electrode is disposed on the second conductive layer and is separated from the first electrode. The first electrode, the second electrode and the PTC device commonly form an end surface which is substantially perpendicular to the first and second planar surfaces. The first electrode and the second electrode at the end surface serve as interfaces electrically connecting to the circuit board.Type: ApplicationFiled: September 4, 2013Publication date: July 31, 2014Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: Tong Cheng TSAI, Wen Feng LEE, Chun Teng TSENG, Chi Jen SU, Yi An SHA
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Publication number: 20140146432Abstract: A surface mountable over-current protection device comprises one PTC material layer, first and second conductive layers, first and second electrodes, and an insulating layer. The PTC material layer comprises crystalline polymer and conductive filler dispersed therein. The first and second conductive layers are disposed on first and second planar surfaces of the PTC material layer, respectively. The first and second electrodes are electrically connected to the first and second conductive layers. The insulating layer is disposed between the first and the second electrodes for insulation. At the melting point of the crystalline polymer, the CTE of the crystalline polymer is greater than 100 times the CTE of the first or second conductive layer, and the first and/or second conductive layers has a thickness which is large enough to obtain a resistance jump value R3/Ri less than 1.4.Type: ApplicationFiled: June 5, 2013Publication date: May 29, 2014Inventors: DAVID SHAU CHEW WANG, WEN FENG LEE, EN TIEN YANG, CHUN TENG TSENG, YI AN SHA
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Publication number: 20140035719Abstract: An over-current protection device has a PTC device, first and second electrodes and an insulation layer. The PTC device comprises first and second electrically conductive members and a PTC layer laminated between the first and second electrically conductive members. The first and second electrodes are electrically connected to the first and second electrically conductive members, respectively. The insulation layer is disposed on a surface of the first electrically conductive member. The device is a stack structure extending along a first direction, and comprises at least one hole extending along a second direction substantially perpendicular to the first direction. The value of the covered area of the hole divided by the area of the form factor of the over-current protection device is not less than 2%, and the value of the thickness of the device divided by the number of the PIC devices is less than 0.7 mm.Type: ApplicationFiled: April 19, 2013Publication date: February 6, 2014Applicant: POLYTRONICS TECHNOLOGY CORP.Inventors: Wen Feng LEE, Kuo Hsun Chen, Chun Teng Tseng, Yi An Sha, Ming Hsun Lu