Abstract: A system for monitoring cell-substrate impedance of excitable cells at millisecond time resolution and methods of assessing cell beating by monitoring cell-substrate impedance of beating cells at millisecond time resolution.

Abstract: In a method of heat sink attachment, a heat-sink tape includes a plurality of heat sinks and a flexible carrier, and a holder is provided to allow the heat sinks on the moving heat-sink tape to peel from the flexible carrier and attach to a heat-sink mounting area of a moving circuit tape automatically and successively.

Abstract: A method for fabricating an integrated circuit is provided. The method includes depositing an etch stop layer over an interconnect layer having a conductive feature; depositing a protective layer over the etch stop layer; depositing a first dielectric layer over the protective layer; etching a via opening in the first dielectric layer, wherein the protective layer has a higher etch resistance to etching the via opening than that of the first dielectric layer; etching a portion of the protective layer exposed by the via opening; etching a portion of the etch stop layer exposed by the via opening, such that the via opening exposes the conductive feature; forming a bottom electrode via in the via opening; and forming a memory stack over the bottom electrode via.

Abstract: Provided is a platinum complex having a structure represented by formula (I): wherein A1 to A3 each independently represent a 5-membered or 6-membered unsaturated ring, A3 is optionally formed between A1 and A2; X1, X2, and X3 each independently represent carbon or nitrogen; R1 represents hydrogen, substituted or unsubstituted C1-C6 alkyl, —CF2H, —CFH2, substituted or unsubstituted C6-C12 aryl or —CmF2m+1, m is an integer of 1 to 5; R2 and R3 each independently represent hydrogen, C1-C12 alkyl, substituted or unsubstituted C1-C6 alkoxyl, substituted or unsubstituted C6-C12 aryl, or —CnF2n+1, n is an integer of 0 to 3; p and q each independently represent an integer of 1 to 2; and when p or q is equal to 2, two R2's or R3's may join to form a C3-C8 aromatic or nitrogen-containing heteroaromatic ring.

Abstract: Often when there is a glare on a display screen the user may be able to mitigate the glare by tilting or otherwise moving the screen or changing their viewing position. However, when driving a car there are limited options for overcoming glares on the dashboard, especially when you are driving for a long distance in the same direction. Embodiments are directed to eliminating such glare. Other embodiments are related to mixed reality (MR) and filling in occluded areas.

Abstract: A flip chip interconnection including a circuit board is disclosed. The circuit board includes a substrate, inner leads, a T-shaped circuit line and a dummy pattern. The inner leads, the T-shaped circuit line and the dummy pattern are located on an inner bonding area of the substrate. The T-shaped circuit line includes a main segment, a branch segment and a connection segment that is connected to the main segment and the branch segment. The main segment and the branch segment are extended along a lateral direction and a longitudinal direction, respectively. The dummy pattern is located between the connection segment and the inner leads.

Abstract: The present disclosure provides compounds that are amylin receptor antagonist compounds, compositions that include the subject compounds, methods for preparing and using the amylin receptor antagonists, and compositions containing the amylin receptor antagonists for treating, preventing, or ameliorating Alzheimer's disease. Aspects of the present disclosure include a method of inhibiting activity of an amylin receptor by administering to a subject in need thereof a therapeutically effective amount of an amylin receptor antagonist.

Abstract: A layout structure of flexible circuit board includes a flexible substrate, a chip and a circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate, the circuit area surrounds the chip mounting area. The chip is mounted on the chip mounting area of the top surface and includes a bump. The circuit layer is disposed on the top surface. A connection portion of the circuit layer extends across a first side of the chip mounting area and into the chip mounting area. A transmission portion of the circuit layer is located on the circuit area and electrically connected to the connection portion. A stress release portion of the circuit layer is located between the transmission portion and a second side of the chip mounting area and is a comb-shaped structure.

Abstract: The invention relates to a display device, applicable to fingerprint image recognition. The display device includes: a substrate, a cover panel, and unit pixels. First, the unit pixels on the display device emit light alternately. When a part of the unit pixels emit light, defined as in a light-emitting state, and when another part of the unit pixels do not emit light, defined as in a sensing state; then, the unit pixels in the light-emitting state are used as the light-emitting area; the unit pixels in the sensing state are used as the sensing area; the unit pixels in the light-emitting area emit incident light to and reflected by a test object; the unit pixels in the sensing area sense the reflected light, and generates an image electrical signal. Therefore, the display device can be used as both a light-emitting element and a sensing element for fingerprint image recognition.

Abstract: A layout structure of flexible circuit board includes a flexible substrate, a chip and a circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate. The chip is mounted on the chip mounting area, a space exists between a first bump and a second bump of the chip, and there are no additional bumps between the first and second bumps. A first inner lead, a second inner lead, a first dummy lead and a second dummy lead of the circuit layer are located on the chip mounting area. The first and second inner leads are electrically connected to the first and second bumps respectively. The first dummy lead is connected to the first inner lead and adjacent to the first bump, and the second dummy lead is connected to the second inner lead and adjacent to the second bump.

Abstract: Often when there is a glare on a display screen the user may be able to mitigate the glare by tilting or otherwise moving the screen or changing their viewing position. However, when driving a car there are limited options for overcoming glares on the dashboard, especially when you are driving for a long distance in the same direction. Embodiments are directed to eliminating such glare. Other embodiments are related to mixed reality (MR) and filling in occluded areas.

Abstract: An image sensing method, applicable to the anti-spoofing recognition of under screen optical fingerprint sensing, is provided, including: dividing the image sensor into sensing blocks, dividing the display area of the display device correspondingly according to the sensing area, and the display area including the light-emitting area; defining the luminous color of each display area and the color coordinate value of each luminous color; each sensing block sensing the light intensity of the image reflected to the sensing block from the display block emitting the light onto the reference object and the test object to be measured; calculating the anti-spoofing reference color information of the reference object and registering in the system; when sensing the fingerprint image, first obtaining the light intensity of each block, then calculating the color information of the test object; and finally, comparing the color information with the registered anti-spoofing reference color information.

Abstract: An optical identification module including a sensor and a collimator is provided. The sensor has a plurality of sensing regions. The collimator is disposed on the plurality of sensing regions, and the collimator includes a transparent substrate, a first light shielding layer, and a plurality of microlenses. The first light shielding layer includes a plurality of first openings. The plurality of microlenses are disposed on a first surface of the transparent substrate, and the plurality of microlenses correspond to the plurality of first openings respectively.

Abstract: A magnetic electric connector and its magnetic terminal. The magnetic electric connector comprises a male connector and a receptacle which are adapted to each other. The male connector comprises an insulator and several first magnetic terminals. The first magnetic terminal comprises a first magnet and a first metallic conducting layer fixed to the outer surface of the first magnet. The receptacle comprises a bench insulator and several second magnetic terminals. The second magnetic terminal comprises a second magnet and a second metallic conducting layer fixed to the outer surface of the second magnet. When the male connector and receptacle are butted, the first magnetic terminal of male connector is adsorbed on the second magnetic terminal of receptacle, forming electrical conduction, implementing charging or transmitting data, they can be localized and fastened without an additional fixing structure, guaranteeing a stable butting of male connector and receptacle.

Abstract: A layout structure of flexible circuit board includes a flexible substrate, a chip and a circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate, the circuit area surrounds the chip mounting area. The chip is mounted on the chip mounting area of the top surface and includes a bump. The circuit layer is disposed on the top surface. A connection portion of the circuit layer extends across a first side of the chip mounting area and into the chip mounting area. A transmission portion of the circuit layer is located on the circuit area and electrically connected to the connection portion. A stress release portion of the circuit layer is located between the transmission portion and a second side of the chip mounting area and is a comb-shaped structure.

Abstract: Systems, apparatuses and methods may provide for technology to improve an appearance of objects that enter a viewable area of a 360-degree video. The technology may include a head mounted display (HMD), a viewport comprising a viewable area within the HMD, and a memory to store objects of interest not currently in the viewable area.

Abstract: A flip chip interconnection including a circuit board is disclosed. The circuit board includes a substrate, inner leads, a T-shaped circuit line and a dummy pattern. The inner leads, the T-shaped circuit line and the dummy pattern are located on an inner bonding area of the substrate. The T-shaped circuit line includes a main segment, a branch segment and a connection segment that is connected to the main segment and the branch segment. The main segment and the branch segment are extended along a lateral direction and a longitudinal direction, respectively. The dummy pattern is located between the connection segment and the inner leads.

Abstract: A fingerprint sensing device including a light guide cover plate, a light source, an image sensor, and a light output element is provided. The light guide cover plate includes a flat plate portion and a light entering portion. The flat plate portion has a first surface and a second surface opposite to each other. The light entering portion is located at the second surface, and has an inclined light incident surface inclined with respect to the first surface and the second surface. The light source is configured to emit a light beam. The light beam is transmitted to the light entering portion and the flat plate portion in sequence via the inclined light incident surface. The light output element is disposed on the second surface, and guides the light beam in the flat plate portion to the image sensor.

Abstract: A chip package includes a circuit board, a chip and an underfill. The circuit board includes a substrate, first circuit lines and second circuit lines. Each of the first circuit lines includes an inner lead and a first line fragment that are disposed on a chip mounting area and an underfill covering area of the substrate, respectively. The second circuit lines are disposed on the chip mounting area and not located between the adjacent inner leads so as to form a wider space between the adjacent first line fragments. The wider space enables the underfill to flow to between the circuit board and the chip and prevents air bubbles from being embedded in the underfill filled between the circuit board and the chip.

Abstract: The present application provides methods and systems for launching an unmanned aerial vehicle (UAV). An exemplary system for launching a UAV includes a detector configured to detect acceleration of the UAV in a launch mode. The exemplary system may also include a memory storing instructions and a processor configured to execute the instructions to cause the system to: obtain a signal configured to notify the UAV to enter the launch mode, determine whether the acceleration of the UAV satisfies a condition corresponding to threshold acceleration in the launch mode, and responsive to the determination that the acceleration of the UAV satisfies the condition, turn on a motor of the UAV.