Patents by Inventor Wen-Hsien Chang

Wen-Hsien Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240364001
    Abstract: An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.
    Type: Application
    Filed: July 10, 2024
    Publication date: October 31, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Shao-Tzu TANG, Chih-Hsien CHIU, Wen-Jung TSAI, Ko-Wei CHANG, Chia-Chu LAI
  • Publication number: 20240296890
    Abstract: A memory device and method of making the same are disclosed. The memory device includes transistor devices located in both a memory region and a logic region of the device. Transistor devices in the memory region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, a second oxide layer over the first nitride layer, and a second nitride layer over the second oxide layer. Transistor devices in the logic region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, and a second nitride layer over the first nitride layer.
    Type: Application
    Filed: May 13, 2024
    Publication date: September 5, 2024
    Inventors: Chen-Ming Huang, Wen-Tuo Huang, Yu-Hsiang Yang, Yu-Ling Hsu, Wei-Lin Chang, Chia-Sheng Lin, ShihKuang Yang, Yu-Chun Chang, Hung-Ling Shih, Po-Wei Liu, Shih-Hsien Chen
  • Publication number: 20240297126
    Abstract: An electronic package is provided in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure is embedded in the packaging layer. Therefore, thermal stress is dispersed through the frame body to avoid warpage of the electronic package, so as to facilitate the arrangement of other electronic components around the electronic component.
    Type: Application
    Filed: May 10, 2024
    Publication date: September 5, 2024
    Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Chien-Cheng LIN, Ko-Wei CHANG, Yu-Wei YEH, Shun-Yu CHIEN, Chia-Yang CHEN
  • Publication number: 20240290728
    Abstract: An electronic package and a manufacturing method thereof are provided, in which a cover is disposed on a carrier structure having an electronic element, and the electronic element is covered by the cover. A magnetic conductive member is arranged between the cover and the electronic element, and an air gap is formed between the magnetic conductive member and the cover to enhance the shielding effect of the electronic package.
    Type: Application
    Filed: June 14, 2023
    Publication date: August 29, 2024
    Inventors: Wen-Jung TSAI, Chih-Hsien CHIU, Chien-Cheng LIN, Ming-Fan TSAI, Cheng-You JENG, Hui-Jing CHANG
  • Patent number: 12068535
    Abstract: An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: August 20, 2024
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Shao-Tzu Tang, Chih-Hsien Chiu, Wen-Jung Tsai, Ko-Wei Chang, Chia-Chu Lai
  • Patent number: 12057409
    Abstract: An electronic package and a manufacturing method of the electronic package are provided, in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure nor cover the electronic component is embedded in the packaging layer.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: August 6, 2024
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien Chiu, Wen-Jung Tsai, Chien-Cheng Lin, Ko-Wei Chang, Yu-Wei Yeh, Shun-Yu Chien, Chia-Yang Chen
  • Publication number: 20240257871
    Abstract: A phase-change memory (PCM) cell is provided to include a first electrode, a second electrode, and a phase-change feature disposed between the first electrode and the second electrode. The phase-change feature is configured to change its data state based on a write operation performed on the PCM cell. The write operation includes a reset stage and a set stage. In the reset stage, a plurality of reset current pulses are applied to the PCM cell, and the reset current pulses have increasing current amplitudes. In the set stage, a plurality of set current pulses are applied to the PCM cell, and the set current pulses exhibit an increasing trend in current amplitude. The current amplitudes of the set current pulses are smaller than those of the reset current pulses.
    Type: Application
    Filed: April 11, 2024
    Publication date: August 1, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yung-Huei LEE, Chun-Wei CHANG, Jian-Hong LIN, Wen-Hsien KUO, Pei-Chun LIAO, Chih-Hung NIEN
  • Patent number: 10317185
    Abstract: A silicon steel bars checking device includes a top board, a bottom board, a block unit and multiple bolts. A room is defined between the top board, the bottom board and the block unit. The silicon steel bars are inserted into the room and positioned between the top board, the bottom board and the block unit, and checked their specification. The silicon steel bars are removed from the device without any damage.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: June 11, 2019
    Assignee: NISHOKU TECHNOLOGY INC.
    Inventors: Piao-Fu Chen, Chien-Sheng Tsai, Wen-Hsien Chang
  • Publication number: 20180231362
    Abstract: A silicon steel bars checking device includes a top board, a bottom board, a block unit and multiple bolts. A room is defined between the top board, the bottom board and the block unit. The silicon steel bars are inserted into the room and positioned between the top board, the bottom board and the block unit, and checked their specification. The silicon steel bars are removed from the device without any damage.
    Type: Application
    Filed: August 11, 2017
    Publication date: August 16, 2018
    Inventors: Piao-Fu CHEN, Chien-Sheng TSAI, Wen-Hsien CHANG
  • Patent number: 6595113
    Abstract: A radiating structure of a food processor includes an outer shell and an inner shell disposed in the outer shell with a passage formed in between. The inner shell has vent holes on the top, and has a revolving member disposed above it; the revolving member has blades on a bottom, and is turnable together with the shaft of a motor of the food processor. The motor is disposed in the inner shell, and is connected to a fan disposed right above inlets of a base joined to the inner shell. When the motor is working, air is forced to travel into the inner shell via the inlets by the fan to absorb heat produced by the motor, and is forced to travel through the vent holes and the passage to the atmosphere by the blades of the revolving member, thus dissipating the heat.
    Type: Grant
    Filed: December 12, 2002
    Date of Patent: July 22, 2003
    Inventor: Wen-Hsien Chang
  • Patent number: 6447861
    Abstract: A faery adhesive tape is a transparent or translucent membrane substrate with constant width that is back-coated with glue, and multiple reels are produced and used as a tape. While producing multiple reels, the topic related describing intrigue is printed or tape-fitted at suitable interval on the substrate. The intrigue of said topic is expressed by segment with designs, letters, or excellent pictures and literary composition. Depending on the seriatim torn away of the adhesive tape, it will gradually deepen into the intrigue or gradually disclose the solution, build up the interesting effect of the expectation and pleasant surprise of users, and thus widen the scope of usage of the adhesive tape.
    Type: Grant
    Filed: April 19, 2000
    Date of Patent: September 10, 2002
    Assignee: Four Pillars Enterprise Co., Ltd.
    Inventors: Cheng-Kang Kao, Wen-Hsien Chang, Ko-Hung Hsu
  • Patent number: 5947306
    Abstract: A modular rack is composed of a support tube, a plurality of support arms, and a plurality of trays. The support tube is provided in the wall thereof with a plurality of retaining slots located at various levels of the support tube. The support arms are provided respectively at one end thereof with two retaining protuberances engageable with said retaining slots of the support tube. The trays are fastened respectively with another end of the support arms for holding a flower pot, vase, and the like.
    Type: Grant
    Filed: April 30, 1998
    Date of Patent: September 7, 1999
    Inventor: Wen-Hsien Chang