Abstract: A memory device and method of making the same are disclosed. The memory device includes transistor devices located in both a memory region and a logic region of the device. Transistor devices in the memory region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, a second oxide layer over the first nitride layer, and a second nitride layer over the second oxide layer. Transistor devices in the logic region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, and a second nitride layer over the first nitride layer.

Abstract: A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes at least one electronic component, a heat source, and a heat dissipation element. The heat source is adjacent to the electronic component. The heat dissipation element is disposed adjacent to the heat source and the electronic component. The heat dissipation element includes a heat transmitting structure configured to reduce heat, which is from the heat source, through the heat dissipation element, and transmitting in a direction toward the electronic component.

Abstract: A heat transferring device and a heat transferring component thereof are disclosed. The heat transferring device includes a heat transferring component, a lower plate, a positioning component and at least one support rod. The heat transferring component is in a shape of pouch and includes input end and an output end to allow a fluid to be inputted and outputted. The lower plate includes at least one first perforation. The positioning component is disposed on and surrounding an exterior of the heat transferring component to restrict the shape and a position of the heat transferring component, wherein an end of the sleeve is connected to the lower plate. The support rod is connected to the lower plate. The heat transferring component further includes at least one protrusion on the periphery, and the protrusion is fixed on the support rod or the sleeve through at least one fastener.

Abstract: A semiconductor transistor structure includes a substrate with a first conductivity type, a fin structure grown on the substrate, and a gate on the fin structure. The fin structure includes a first epitaxial layer having a second conductivity type opposite to the first conductivity type, a second epitaxial layer on the first epitaxial layer, and a third epitaxial layer having the second conductivity type on the second epitaxial layer.

Abstract: A transistor structure and a formation method thereof are provided. The transistor structure includes a transistor device, formed on an active region of a semiconductor substrate, and including: a gate structure, disposed on the active region; gate spacers, formed along opposite sidewalls of the gate structure; source/drain structures, formed in recesses of the active region at opposite sides of the gate structure; and buried isolation structures, separately extending along bottom sides of the source/drain structures. Further, a channel portion of the active region between the source/drain structures is strained as a result of a strained etching stop layer lying above or dislocation stressors formed in the source/drain structures.

Abstract: A memory device and a manufacturing method thereof are provided. The memory device includes an access transistor defined within an active region of a semiconductor substrate and a storage capacitor disposed on the access transistor. A recessed gate structure of the access transistor extends into the active region from above the active region. Source/drain contacts of the access transistor are disposed on the active region at opposite sides of the recessed gate structure. The storage capacitor includes: a composite bottom electrode, formed by alternately stacked first conductive layers and second conductive layers, wherein each second conductive layer is sandwiched between a pair of the first conductive layers, and tunnels laterally extend through the second conductive layers, respectively; a capacitor dielectric layer, covering inner and outer surfaces of the composite bottom electrode; and a top electrode, in contact with the composite bottom electrode through the capacitor dielectric layer.

Abstract: In some embodiments, an image sensor is provided. The image sensor includes a photodetector disposed in a semiconductor substrate. A wave guide filter having a substantially planar upper surface is disposed over the photodetector. The wave guide filter includes a light filter disposed in a light filter grid structure. The light filter includes a first material that is translucent and has a first refractive index. The light filter grid structure includes a second material that is translucent and has a second refractive index less than the first refractive index.

Abstract: The present disclosure provides a heat transferring device and a heat transferring component thereof. The heat transferring device includes a heat transferring component, a lower plate and a positioning component. The heat transferring component is in a shape of pouch and includes at least one input end and at least one output end to allow a fluid to be inputted and outputted. The lower plate includes at least one first perforation. The positioning component is disposed on an exterior of the heat transferring component. An end of the positioning component is connected to the lower plate.

Abstract: A processor of a computer-aided design system reads and executes a software stored in a memory to input first digital data of a first component of the composite object, input second digital data of a second component of the composite object, analyze the first digital data and the second digital data with first criterion to obtain a plurality of first surfaces and a plurality of second surfaces respectively, calculate a distance between one of the plurality of the first surfaces and one of the plurality of the second surfaces, and output a first result when the distance is greater than or equal to the first threshold; otherwise, output a second result.

Abstract: One or more implementations of the subject technology may enable a bond-on-pad (BoP) substrate technology that can eliminate the need to utilize a solder-on-pad (SoP) process. Unlike an SoP process, a BoP Process does not require a solder bump to be formed on a bump pad to attach a joint to a bump pad. The size of an opening on a bump pad for a BoP process may be larger than that of an SoP process. A BoP process may use a solder mask having multiple thicknesses and may be thinner near the bump pads. A BoP process may use a joint having a copper pillar and a solder cap. A BoP process can be used with an underfill or a molding compound technology.

Abstract: A flexible substrate structure including a flexible substrate, a first dielectric layer, a metal-containing layer and a second dielectric layer is provided. The first dielectric layer is located on the flexible substrate. The metal-containing layer has a reflectivity greater than 15% and a heat transfer coefficient greater than 2 W/m-K. The metal-containing layer is disposed between the first dielectric layer and the second dielectric layer, and the second dielectric layer is an inorganic material layer. A flexible transistor including the above-mentioned flexible substrate structure and a method for fabricating the same are also provided.

Abstract: A shock-resistance testing apparatus includes a support base, a first rotating component and a controller provided on the support base. A second rotating component is coupled to one side of the first rotating component. A testing board is placed on the first rotating component. A falling board is placed on the testing board. The controller controls the first rotating component to drive the second rotating component rotating from one side of the testing board to another side of the testing board. The controller controls the second rotating component to lift the testing board. The controller controls the second rotating component to move away from the testing board so that the testing board falls.

Abstract: A flexible substrate structure including a flexible substrate, a first dielectric layer, a metal-containing layer and a second dielectric layer is provided. The first dielectric layer is located on the flexible substrate. The metal-containing layer has a reflectivity greater than 15% and a heat transfer coefficient greater than 2 W/m-K. The metal-containing layer is disposed between the first dielectric layer and the second dielectric layer, and the second dielectric layer is an inorganic material layer. A flexible transistor including the above-mentioned flexible substrate structure and a method for fabricating the same are also provided.

Abstract: A chipset with light energy harvester, includes a substrate, a functional element layer, and a light energy harvesting layer, both are stacked vertically on the substrate, and an interconnects connected between the functional element layer and the light energy harvesting layer.

Abstract: A test device for testing an electronic device has a base, a first mounting plane, a first support element, a plurality of second support elements, a plurality of test elements, and a control unit. The first mounting plane is mounted on the base. The first support element is slidable on the first mounting plane, the second support elements are slidable on the first support element, and the test elements are slidable on the second support elements. The control unit electrically coupled to the test elements controls the test elements to provide impact force on the electronic device.

Abstract: A shock-resistance testing apparatus includes a support base, a first rotating component and a controller provided on the support base. A second rotating component is coupled to one side of the first rotating component. A testing board is placed on the first rotating component. A falling board is placed on the testing board. The controller controls the first rotating component to drive the second rotating component rotating from one side of the testing board to another side of the testing board. The controller controls the second rotating component to lift the testing board. The controller controls the second rotating component to move away from the testing board so that the testing board falls.

Abstract: A chipset with light energy harvester, includes a substrate, a functional element layer, and a light energy harvesting layer, both are stacked vertically on the substrate, and an interconnects connected between the functional element layer and the light energy harvesting layer.

Abstract: A transistor device structure includes a substrate, a first polycrystalline semiconductor thin film and a first transistor unit. The first polycrystalline semiconductor thin film is disposed on the substrate. A grain diameter of the first polycrystalline semiconductor thin film is greater than 1 micrometer and a thickness of the first polycrystalline semiconductor thin film is less than three hundredths of the grain diameter. The first transistor unit is disposed on the first polycrystalline semiconductor thin film and includes a first gate dielectric layer and a first gate structure. The first gate dielectric layer is disposed on a surface of the first polycrystalline thin film semiconductor. The first gate structure is disposed on a surface of the first gate dielectric layer.

Abstract: A transistor device structure includes a substrate, a first transistor layer and a second transistor layer. The second transistor layer is disposed between the substrate and the first transistor layer. The first transistor layer includes an insulating structure and a first transistor unit. The insulating structure is disposed on the second transistor layer and has a protruding portion. The first transistor unit includes a gate structure, a source/drain structure, an embedded source/drain structure and a channel. The source/drain structure is disposed beside the gate structure and over the insulating structure. The embedded source/drain structure is disposed underneath the source/drain structure and in the insulating structure. The channel is defined between the protruding portion and the gate structure.

Abstract: A transistor device structure includes a substrate, a first polycrystalline semiconductor thin film and a first transistor unit. The first polycrystalline semiconductor thin film is disposed on the substrate. A grain diameter of the first polycrystalline semiconductor thin film is greater than 1 micrometer and a thickness of the first polycrystalline semiconductor thin film is less than three hundredths of the grain diameter. The first transistor unit is disposed on the first polycrystalline semiconductor thin film and includes a first gate dielectric layer and a first gate structure. The first gate dielectric layer is disposed on a surface of the first polycrystalline thin film semiconductor. The first gate structure is disposed on a surface of the first gate dielectric layer.