Abstract: A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.

Abstract: A phase-change memory (PCM) cell is provided to include a first electrode, a second electrode, and a phase-change feature disposed between the first electrode and the second electrode. The phase-change feature is configured to change its data state based on a write operation performed on the PCM cell. The write operation includes a reset stage and a set stage. In the reset stage, a plurality of reset current pulses are applied to the PCM cell, and the reset current pulses have increasing current amplitudes. In the set stage, a plurality of set current pulses are applied to the PCM cell, and the set current pulses exhibit an increasing trend in current amplitude. The current amplitudes of the set current pulses are smaller than those of the reset current pulses.

Abstract: An independent graphics card system comprises an expansion motherboard, a system power supply, at least one expansion graphics card and a fan assembly. The system power supply is electrically connected to the expansion motherboard. The at least one expansion graphics card is plugged into the expansion motherboard through an adapter card. The at least one expansion graphics card is parallel with the expansion motherboard. The fan assembly dissipates heat of the at least one expansion graphics card.

Abstract: A display panel including a circuit board, a plurality of bonding pads, a plurality of light emitting devices, and a plurality of solder patterns is provided. The bonding pads are disposed on the circuit board, and each includes a first metal layer and a second metal layer. The second metal layer is located between the first metal layer and the circuit board. The first metal layer includes an opening overlapping the second metal layer. A material of the first metal layer is different from a material of the second metal layer. The light emitting devices are electrically bonded to the bonding pads. Each of the solder patterns electrically connects one of the light emitting devices and one of the bonding pads. The solder patterns each contact the second metal layer through the opening of the first metal layer of one of the bonding pads to form a eutectic bonding.

Abstract: A semiconductor package includes a die having a plurality of devices over a first substrate, where the first substrate includes a dopant at a first concentration and the first substrate has a first width along a horizontal direction. The semiconductor package further includes a second substrate fused with the first substrate, where the second substrate includes the dopant at a second concentration greater than the first concentration.

Abstract: The present disclosure provides an image sensing module including a main board and an image sensor. The main board has a first surface and a second surface opposite to each other. The image sensor is disposed on the first surface of the main board and includes a plurality of isolation structures and a photoelectric conversion element between the plurality of isolation structures. A first angle is provided between a light incident surface of the photoelectric conversion element and the first surface of the main board, and a second angle is provided between a light beam incident to the light incident surface of the photoelectric conversion element and a normal vector of the light incident surface. The second angle is about equal to the Brewster angle at the interface of the light beam incident to the light incident surface.

Abstract: A wireless transmission system comprises an antenna component, a wireless module including a processing unit and a power controlling unit, a tuner connected between the antenna component and the wireless module, and a sensor connected to the wireless module. The tuner is configured to adjust an output bad of the power controlling unit according to a received signal strength indication of the wireless transmission system being greater than a predetermined threshold value, such that multiple different load values are provided for the power controlling unit. The sensor is configured to detect and record a current consumption value corresponding to each load value. In response to the wireless module emitting signals via the antenna component, the processing unit selects the load value corresponding to the lowest of the current consumption values and applies the selected load value to the output load of the power controlling unit.

Abstract: A silicon photonics optical transceiver device includes a silicon photonics optical module and a heat conducting housing that accommodates the silicon photonic optical module therein. The heat conducting housing has an inner surface formed with a first heat dissipation portion that wraps around and is in contact with transmitter optical sub-assemblies of the silicon photonics optical module to realize thermal conduction, and a second heat dissipation portion that is in contact with a digital signal processor of the silicon photonics optical module to realize thermal conduction.

Abstract: A wireless transmission system comprises an antenna component, a wireless module including a processing unit and a power controlling unit, a tuner connected between the antenna component and the wireless module, and a sensor connected to the wireless module. The tuner is configured to adjust an output bad of the power controlling unit according to a received signal strength indication of the wireless transmission system being greater than a predetermined threshold value, such that multiple different load values are provided for the power controlling unit. The sensor is configured to detect and record a current consumption value corresponding to each load value. In response to the wireless module emitting signals via the antenna component, the processing unit selects the load value corresponding to the lowest of the current consumption values and applies the selected load value to the output load of the power controlling unit.