Abstract: The present invention provides a voltage control method for controlling a power supply. The voltage control method comprises the following steps: obtaining a present output voltage value associated with a present gain value; obtaining a predetermined output voltage value associated with a predetermined duty ratio; calculating a target gain value, corresponding to the predetermined duty ratio, according to a gain value formula; performing a weight calculation on the present gain value and the target gain value for generating a buffer gain value; and setting an output voltage command according to the buffer gain value. Wherein the buffer gain value is between the present gain value and the target gain value.

Abstract: A semiconductor package device is provided. The semiconductor package device includes a chip and a redistribution layer disposed on the chip and electrically connected to the chip. The redistribution layer includes a plurality of first metal lines and a plurality of second metal lines, wherein at least one of the second metal lines is disposed between two adjacent first metal lines. The included angle between the at least one of the second metal lines and the two adjacent first metal lines is greater than or equal to 0 degrees and less than or equal to 10 degrees. The first width of one of the two adjacent first metal lines is greater than the second width of the at least one of the second metal lines.

Abstract: An automatic document feeder includes a feeding path, a pickup roller assembly arranged at an upstream of the feeding path for feeding documents into the feeding path, an ejecting tray arranged at a downstream of the feeding path for loading the ejected documents, a paper feeding roller assembly arranged in the feeding path, a paper ejecting roller assembly arranged at the downstream of the feeding path, an anti-drawing arm arranged between the paper ejecting roller assembly and the ejecting tray, and a paper feeding motor. The paper feeding motor drives the pickup roller assembly, the paper feeding roller assembly and the paper ejecting roller assembly.

Abstract: A semiconductor device includes a first region and a second region, and the second region surrounds the first region. The semiconductor device includes at least one electronic unit, a redistribution structure, a plurality of first pads, and a plurality of second pads. The redistribution structure may be electrically connected to at least one electronic unit. A plurality of first pads are arranged on the redistribution structure and correspondingly to the first region. There is a first pitch between two adjacent first pads. A plurality of second pads are arranged on the redistribution structure and correspondingly to the second region. There is a second pitch between two adjacent second pads, so that the first pitch is smaller than the second pitch.

Abstract: A photoelectric conversion compound is provided. The photoelectric conversion compound has a structure represented by formula (I): wherein D represents an inorganic luminescent group; each of R1, R2, and R3 independently represents a hydrogen atom or a C1-6 alkyl group; R4 represents a single bond or a C1-6 alkylene group; m represents an integer of 1-10; k represents an integer of 1-1,000; and n represents an integer of 1-10,000.

Abstract: A solar cell module is provided. The solar cell module includes a first substrate, a second substrate opposite the first substrate, a cell unit disposed between the first and second substrates, a first thermosetting resin layer disposed between the cell unit and the first substrate, a first thermoplastic resin layer disposed between the cell unit and the first thermosetting resin layer, a second thermosetting resin layer disposed between the cell unit and the second substrate, and a second thermoplastic resin layer disposed between the cell unit and the second thermosetting resin layer.

Abstract: A solar cell module is provided. The solar cell module includes a first substrate, a second substrate opposite to the first substrate, a cell unit disposed between the first and second substrates, a first thermosetting resin layer disposed between the cell unit and the first substrate, a first thermoplastic resin layer disposed between the cell unit and the first thermosetting resin layer, a second thermosetting resin layer disposed between the cell unit and the second substrate, and a second thermoplastic resin layer disposed between the cell unit and the second thermosetting resin layer, wherein at least one of the first thermoplastic resin layer and the second thermoplastic resin layer contains 0.1% to 10% of light diffusion particles.

Abstract: A solar cell module is provided. The solar cell module includes a first substrate, a second substrate opposite the first substrate, a cell unit disposed between the first and second substrates, a first thermosetting resin layer disposed between the cell unit and the first substrate, a first thermoplastic resin layer disposed between the cell unit and the first thermosetting resin layer, a second thermosetting resin layer disposed between the cell unit and the second substrate, and a second thermoplastic resin layer disposed between the cell unit and the second thermosetting resin layer.

Abstract: A module structure includes a front sheet, a back sheet opposite to the front sheet, and a solar cell disposed between the front sheet and the back sheet. A first encapsulation film is disposed between the solar cell and the front sheet, and a second encapsulation film is disposed between the solar cell and the back sheet. The first encapsulation film and the second encapsulation film include an encapsulation material, which includes a resin and a fluorescent molecule. The fluorescent molecule includes a fluorescent group bonded to a polyhedral oligomeric silsesquioxane.

Abstract: An anthraquinone compound is provided. The anthraquinone compound has the following formula (I): wherein one of R1, R2, and R3 is —NH—(CH2)m—CH3, and the other two are each independently selected from hydrogen or C1-4 alkyl group; and n and m are each independently an integer from 4 to 17.

Abstract: A wavelength-converting polymer, a method for fabricating the same and a wavelength-converting device employing the same are provided. The wavelength-converting polymer has a chemical structure represented by formula (I): In formula (I), B and D are the same or different and independently include hydrogen, C1-8 alkyl group, C1-8 alkoxy group, aryloxy group, carboxyl group, —COOK, —COONa or —NH2, or B and D are connected to form a heteroaromatic ring, wherein Z is hydrogen, C1-8 alkyl group, cycloalkyl group or aryloxy group, X1-X4 are the same or different and independently include hydrogen, halogen, C1-8 alkyl group or C1-8 alkoxy group, R is C1-8 alkyl group with or without substitution, and n is an integer of 5 to 1,000.

Abstract: A module structure is provided, which includes a front sheet, a back sheet opposite the front sheet, and a solar cell disposed between the front sheet and the back sheet. A first encapsulate film is disposed between the solar cell and the front sheet, and a second encapsulate film disposed between the solar cell and the back sheet. One or both of the front sheet and the second sheet includes a support layer and a light conversion layer on the support layer, wherein the light conversion layer includes a fluorescent molecule and hydrogenated styrene elastomer resin. The light conversion layer is disposed between the support layer and the solar cell.

Abstract: A module structure is provided, which includes a front sheet, a back sheet opposite the front sheet, and a solar cell disposed between the front sheet and the back sheet. A first encapsulate film is disposed between the solar cell and the front sheet, and a second encapsulate film disposed between the solar cell and the back sheet. One or both of the front sheet and the second sheet includes a support layer and a light conversion layer on the support layer, wherein the light conversion layer includes a fluorescent molecule and hydrogenated styrene elastomer resin. The light conversion layer is disposed between the support layer and the solar cell.

Abstract: Disclosed is a module structure including a front sheet, a back sheet, and an optoelectronic device disposed between the front sheet and the back sheet. A first packaging layer is disposed between the optoelectronic device and the front sheet. The back sheet is a layered structure of a hydrogenated styrene elastomer resin layer and a polyolefin layer, wherein the hydrogenated styrene elastomer resin layer is disposed between the optoelectronic device and the polyolefin layer.

Abstract: A wavelength-converting polymer, a method for fabricating the same and a wavelength-converting device employing the same are provided. The wavelength-converting polymer has a chemical structure represented by formula (I): In formula (I), B and D are the same or different and independently include hydrogen, C1-8 alkyl group, C1-8 alkoxy group, aryloxy group, carboxyl group, —COOK, —COONa or —NH2, or B and D are connected to form a heteroaromatic ring, wherein Z is hydrogen, C1-8 alkyl group, cycloalkyl group or aryloxy group, X1-X4 are the same or different and independently include hydrogen, halogen, C1-8 alkyl group or C1-8 alkoxy group, R is C1-8 alkyl group with or without substitution, and n is an integer of 5 to 1,000.

Abstract: A motherboard with an electrostatic discharge protection (ESD) function including a first electrode, a second electrode, an isolation region and an energy storage unit is disclosed. The first electrode receives a grounding level. The second electrode includes at least one solder pad to fix an input/output port thereon. The isolation region is disposed between the first and the second electrodes. The energy storage unit is coupled between the first and the second electrodes and disposed across the isolation region.

Abstract: A clipping device includes a first clip jaw, a second clip jaw and a spring unit. Each clip jaw has a retaining seat, a restricting slab, and a crevice formed between these. An edge surface of the retaining seat extends to form a flange. The spring unit is disposed in the retaining seats of the first clip jaw and the second clip jaw. The flange of the first clip jaw is movably disposed in the crevice of the second clip jaw, and the flange of the second clip jaw is movably disposed in the crevice of the first clip jaw. The flanges and crevices restrict the motion between the first clip jaw and the second clip jaw, such that the clipping device of the present disclosure does not need a traditional fixture shaft and encloses the spring unit within the first clip jaw and the second clip jaw.

Abstract: A motherboard with an electrostatic discharge protection (ESD) function including a first electrode, a second electrode, an isolation region and an energy storage unit is disclosed. The first electrode receives a grounding level. The second electrode includes at least one solder pad to fix an input/output port thereon. The isolation region is disposed between the first and the second electrodes. The energy storage unit is coupled between the first and the second electrodes and disposed across the isolation region.

Abstract: A clipping device includes a first clip jaw, a second clip jaw and a spring unit. Each clip jaw has a retaining seat, a restricting slab, and a crevice formed between these. An edge surface of the retaining seat extends to form a flange. The spring unit is disposed in the retaining seats of the first clip jaw and the second clip jaw. The flange of the first clip jaw is movably disposed in the crevice of the second clip jaw, and the flange of the second clip jaw is movably disposed in the crevice of the first clip jaw. The flanges and crevices restrict the motion between the first clip jaw and the second clip jaw, such that the clipping device of the present disclosure does not need a traditional fixture shaft and encloses the spring unit within the first clip jaw and the second clip jaw.

Abstract: Disclosed is a module structure including a front sheet, a back sheet, and an optotronic device disposed between the front sheet and the back sheet. A first encapsulate layer is disposed between the optotronic device and the front sheet. A second encapsulate layer is disposed between the optotronic device and the back sheet. The back sheet is a layered structure of a hydrogenated styrene elastomer resin layer and a polyolefin layer, wherein the hydrogenated styrene elastomer resin layer is disposed between the second encapsulate layer and the polyolefin layer.