Patents by Inventor Wen-Hsiung Yang
Wen-Hsiung Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12001571Abstract: A method of operating a user device includes: receiving a command from a user to power on the user device, wherein the user device includes information on a restricted zone associated with the user device; detecting, by a monitoring entity of the user device without involvement of any device external to the user device, whether the user device is located within the restricted zone in response to the user device being powered on and before an operating system of the user device is executed; and granting access of the user to the user device by the monitoring entity in response to detecting the user device as being within the restricted zone.Type: GrantFiled: November 3, 2022Date of Patent: June 4, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Wen-Chang Kuo, Chiang Kao, Kuo Hsiung Chen, Ho-Han Liu, Ti-Yen Yang, Jo-Chan Liu, Chi-Pin Wang, Yao-Hsiung Chang
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Publication number: 20240153849Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a chip structure including a substrate and a wiring structure over a first surface of the substrate. The semiconductor device structure includes a first seed layer over the wiring structure, a first inner wall of the first enlarged portion, and a second inner wall of the neck portion. The semiconductor device structure includes a second seed layer over a second surface of the substrate, a third inner wall of the second enlarged portion, and the first seed layer over the second inner wall of the neck portion. The second seed layer is in direct contact with the first seed layer.Type: ApplicationFiled: January 2, 2024Publication date: May 9, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ting-Li YANG, Wen-Hsiung LU, Lung-Kai MAO, Fu-Wei LIU, Mirng-Ji LII
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Publication number: 20240124298Abstract: Microelectromechanical devices and methods of manufacture are presented. Embodiments include bonding a mask substrate to a first microelectromechanical system (MEMS) device. After the bonding has been performed, the mask substrate is patterned. A first conductive pillar is formed within the mask substrate, and a second conductive pillar is formed within the mask substrate, the second conductive pillar having a different height from the first conductive pillar. The mask substrate is then removed.Type: ApplicationFiled: January 10, 2023Publication date: April 18, 2024Inventors: Yun-Chung Wu, Jhao-Yi Wang, Hao Chun Yang, Pei-Wei Lee, Wen-Hsiung Lu
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Patent number: 11942398Abstract: A semiconductor device includes a substrate, at least one via, a liner layer and a conductive layer. The substrate includes an electronic circuitry. The at least one via passes through the substrate. The at least one via includes a plurality of concave portions on a sidewall thereof. The liner layer fills in the plurality of concave portions of the at least one via. The conductive layer is disposed on the sidewall of the at least one via, covers the liner layer, and extends onto a surface of the substrate. The thickness of the conductive layer on the sidewall of the at least one via is varied.Type: GrantFiled: August 30, 2021Date of Patent: March 26, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ting-Li Yang, Wen-Hsiung Lu, Jhao-Yi Wang, Fu Wei Liu, Chin-Yu Ku
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Publication number: 20240083742Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, through holes passing through the circuit substrate to the recess, a first conductive layer disposed on a front side of the circuit substrate, and a second conductive layer disposed on an inner wall of the recess. The first conductive layer extends into the through holes and the second conductive layer extends into the through holes and coupled to the first conductive layer.Type: ApplicationFiled: November 15, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ting-Li YANG, Kai-Di WU, Ming-Da CHENG, Wen-Hsiung LU, Cheng Jen LIN, Chin Wei KANG
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Patent number: 9668381Abstract: A channel diversion device includes a supporting structure, a piercing hole structure, a guiding baffle and a collecting mask. An electronic component can be accommodated inside the supporting structure. The supporting structure includes a first structural layer and a second structural layer. An opening is formed on the second structural layer. The piercing structure is formed on a lateral wall of the first structural layer, and the guiding baffle is disposed by a side of the opening on the second structural layer. The collecting mask is disposed by the first structural layer to cover the piercing hole structure, and a direction of an outlet of the collecting mask is substantially different from a direction of the opening on the second structural layer.Type: GrantFiled: November 14, 2013Date of Patent: May 30, 2017Assignee: Wistron CorporationInventors: Shih-Huai Cho, Wen-Hsiung Yang
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Patent number: 9235242Abstract: A heat dissipating module having enhanced heat dissipating efficiency is disclosed. The heat dissipating module includes a heat dissipating member, a base and an air guiding member. The heat dissipating member is installed on a first electronic component for dissipating heat generated by the first electronic component. The base is installed on a side of the heat dissipating member, and the air guiding member is connected to the base. The air guiding member and the base cooperatively guide an air flow passing through the heat dissipating member to a second electronic component located on a side of the first electronic component.Type: GrantFiled: August 20, 2012Date of Patent: January 12, 2016Assignee: Wistron CorporationInventors: Wen-Hsiung Yang, Shih-Huai Cho, Hua Chen
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Publication number: 20140262151Abstract: A channel diversion device includes a supporting structure, a piercing hole structure, a guiding baffle and a collecting mask. An electronic component can be accommodated inside the supporting structure. The supporting structure includes a first structural layer and a second structural layer. An opening is formed on the second structural layer. The piercing structure is formed on a lateral wall of the first structural layer, and the guiding baffle is disposed by a side of the opening on the second structural layer. The collecting mask is disposed by the first structural layer to cover the piercing hole structure, and a direction of an outlet of the collecting mask is substantially different from a direction of the opening on the second structural layer.Type: ApplicationFiled: November 14, 2013Publication date: September 18, 2014Applicant: Wistron CorporationInventors: Shih-Huai Cho, Wen-Hsiung Yang
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Patent number: 8743537Abstract: An airflow adjustment device is disclosed. The airflow adjustment device is used for a blade server provided for plugging in an interface card, and the interface card includes a bracket. The airflow adjustment device is installed in the blade server, and the airflow adjustment device includes a top cover, a plurality of sidewalls, a bracket plate, and at least one deflector. The bracket plate is used for sheltering the bracket, and air enters the blade server through the at least one deflector and at least one gap area formed by the bracket plate and at least one of the plurality of sidewalls whereby the flow resistance of the blade server is not affected by the type of the bracket.Type: GrantFiled: June 7, 2012Date of Patent: June 3, 2014Assignee: Wistron CorporationInventors: Wen-Hsiung Yang, Wei-Chung Hsiao, Shih-Huai Cho, Ming-Chang Wu
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Publication number: 20130250517Abstract: A heat dissipating module having enhanced heat dissipating efficiency is disclosed. The heat dissipating module includes a heat dissipating member, a base and an air guiding member. The heat dissipating member is installed on a first electronic component for dissipating heat generated by the first electronic component. The base is installed on a side of the heat dissipating member, and the air guiding member is connected to the base. The air guiding member and the base cooperatively guide an air flow passing through the heat dissipating member to a second electronic component located on a side of the first electronic component.Type: ApplicationFiled: August 20, 2012Publication date: September 26, 2013Inventors: Wen-Hsiung Yang, Shih-Huai Cho, Hua Chen
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Publication number: 20130033815Abstract: An airflow adjustment device is disclosed. The airflow adjustment device is used for a blade server provided for plugging in an interface card, and the interface card includes a bracket. The airflow adjustment device is installed in the blade server, and the airflow adjustment device includes a top cover, a plurality of sidewalls, a bracket plate, and at least one deflector. The bracket plate is used for sheltering the bracket, and air enters the blade server through the at least one deflector and at least one gap area formed by the bracket plate and at least one of the plurality of sidewalls whereby the flow resistance of the blade server is not affected by the type of the bracket.Type: ApplicationFiled: June 7, 2012Publication date: February 7, 2013Inventors: Wen-Hsiung Yang, Wei-Chung Hsiao, Shih-Huai Cho, Ming-Chang Wu
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Publication number: 20020076301Abstract: A rivet comprises an elongated male rivet part, and an elongated female rivet part. The male rivet part provides an elongated engaging post. The elongated female rivet part provides an elongated engaging post with an elongated inner bore for fitting with the engaging post on the male rivet part by way of pressing. A work piece such as a handle provides an elongated counter bore to be passed through by the female rivet part such that the work piece and another work piece can be fastened together by the rivet firmly.Type: ApplicationFiled: December 14, 2000Publication date: June 20, 2002Inventor: Wen-Hsiung Yang
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Patent number: D467364Type: GrantFiled: February 5, 2002Date of Patent: December 17, 2002Assignee: TYC Brother Industrial Co., Ltd.Inventor: Wen-Hsiung Yang
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Patent number: D469897Type: GrantFiled: June 25, 2002Date of Patent: February 4, 2003Assignee: TYC Brother Industrial Co., Ltd.Inventors: Feng-Chih Liao, Wen-Hsiung Yang