Patents by Inventor Wen-Hsuan Chen

Wen-Hsuan Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12010413
    Abstract: There is provided an optical engine for a navigation device including a first light source, a second light source, a lens, a carrier member and an image sensor. The carrier member has a light holder, a lens holder, an accommodation space and a tilted wall. The first light source is arranged on the light holder of the carrier member, and reflected light associated with the first light source penetrates through the lens to propagate to the image sensor inside the accommodation space. Reflected light associated with the second light source penetrates through the tilted wall of the carrier member to propagate to the image sensor.
    Type: Grant
    Filed: June 15, 2022
    Date of Patent: June 11, 2024
    Assignee: PIXART IMAGING INC.
    Inventors: Yen-Hung Wang, Wen-Yen Su, Hui-Hsuan Chen, Hung-Yu Lai
  • Publication number: 20240170953
    Abstract: An electrostatic discharge protection circuit is provided. The electrostatic discharge protection circuit includes first, second, and third transistors and a discharge circuit. The first transistor has a first gate, a first drain coupled to the bonding pad, and a first source coupled to a first node. The second transistor has a second gate coupled to a power terminal, a second drain coupled to the first gate, and a second source coupled to a ground. The third transistor has a third gate coupled to the power terminal, a third drain coupled to the first node, and a third source coupled to the ground. The discharge circuit is controlled by a driving voltage at the first node. In response to an electrostatic discharge event occurring on the bonding pad, the discharge circuit provides a discharge path between the bonding pad and the ground according to the driving voltage.
    Type: Application
    Filed: November 17, 2022
    Publication date: May 23, 2024
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Chih-Hsuan LIN, Shao-Chang HUANG, Wen-Hsin LIN, Yeh-Ning JOU, Hwa-Chyi CHIOU, Chun-Chih CHEN
  • Publication number: 20240170339
    Abstract: In a method of manufacturing a semiconductor device, an n-type source/drain epitaxial layer and a p-type source/drain epitaxial layer respectively formed, a dielectric layer is formed over the n-type source/drain epitaxial layer and the p-type source/drain epitaxial layer, a first opening is formed in the dielectric layer to expose a part of the n-type source/drain epitaxial layer and a second opening is formed in the dielectric layer to expose a part of the p-type source/drain epitaxial layer, and the n-type source/drain epitaxial layer and the p-type source/drain epitaxial layer respectively recessed. A recessing amount of the n-type source/drain epitaxial layer is different from a recessing amount of the p-type source/drain epitaxial layer.
    Type: Application
    Filed: March 2, 2023
    Publication date: May 23, 2024
    Inventors: Te-Chih Hsiung, Yun-Hua Chen, Yang-Cheng Wu, Sheng-Hsun Fu, Wen-Kuo Hsieh, Chih-Yuan Ting, Huan-Just Lin, Bing-Sian Wu, Yi-Hsuan Chiu
  • Publication number: 20240120203
    Abstract: A method includes forming a dummy gate over a semiconductor fin; forming a source/drain epitaxial structure over the semiconductor fin and adjacent to the dummy gate; depositing an interlayer dielectric (ILD) layer to cover the source/drain epitaxial structure; replacing the dummy gate with a gate structure; forming a dielectric structure to cut the gate structure, wherein a portion of the dielectric structure is embedded in the ILD layer; recessing the portion of the dielectric structure embedded in the ILD layer; after recessing the portion of the dielectric structure, removing a portion of the ILD layer over the source/drain epitaxial structure; and forming a source/drain contact in the ILD layer and in contact with the portion of the dielectric structure.
    Type: Application
    Filed: March 8, 2023
    Publication date: April 11, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Te-Chih HSIUNG, Yun-Hua CHEN, Bing-Sian WU, Yi-Hsuan CHIU, Yu-Wei CHANG, Wen-Kuo HSIEH, Chih-Yuan TING, Huan-Just LIN
  • Publication number: 20240069618
    Abstract: The disclosure provides a power management method. The power management method is applicable to an electronic device. The electronic device is electrically coupled to an adapter, and includes a system and a battery. The adapter has a feed power. The battery has a discharge power. The power management method of the disclosure includes: reading a power value of the battery; determining a state of the system; and discharging power to the system, when the system is in a power-on state and the power value is greater than a charging stopping value, by using the battery, and controlling, according to the discharge power and the feed power, the adapter to selectively supply power to the system. The disclosure further provides an electronic device using the power management method.
    Type: Application
    Filed: April 27, 2023
    Publication date: February 29, 2024
    Inventors: Wen Che CHUNG, Hui Chuan LO, Hao-Hsuan LIN, Chun TSAO, Jun-Fu CHEN, Ming-Hung YAO, Jia-Wei ZHANG, Kuan-Lun CHEN, Ting-Chao LIN, Cheng-Yen LIN, Chunyen LAI
  • Patent number: 11854878
    Abstract: A method of forming a semiconductor device includes forming an opening in a dielectric layer, and forming a barrier layer in the opening. A combined liner layer is formed over the barrier layer by first forming a first liner layer over the barrier layer, and forming a second liner layer over the first liner layer, such that the first liner layer and the second liner layer intermix. A conductive material layer is formed over the combined liner layer, and a thermal process is performed to reflow the conductive material layer.
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING LTD.
    Inventors: Huei-Wen Hsieh, Kai-Shiang Kuo, Cheng-Hui Weng, Chun-Sheng Chen, Wen-Hsuan Chen
  • Patent number: 11676898
    Abstract: A method includes forming an insulating layer over a conductive feature; etching the insulating layer to expose a first surface of the conductive feature; covering the first surface of the conductive feature with a sacrificial material, wherein the sidewalls of the insulating layer are free of the sacrificial material; covering the sidewalls of the insulating layer with a barrier material, wherein the first surface of the conductive feature is free of the barrier material, wherein the barrier material includes tantalum nitride (TaN) doped with a transition metal; removing the sacrificial material; and covering the barrier material and the first surface of the conductive feature with a conductive material.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: June 13, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chia-Pang Kuo, Huan-Yu Shih, Wen-Hsuan Chen, Cheng-Lun Tsai, Ya-Lien Lee, Cheng-Hui Weng, Chun-Chieh Lin, Hung-Wen Su, Yao-Min Liu
  • Publication number: 20220367376
    Abstract: A method includes forming an insulating layer over a conductive feature; etching the insulating layer to expose a first surface of the conductive feature; covering the first surface of the conductive feature with a sacrificial material, wherein the sidewalls of the insulating layer are free of the sacrificial material; covering the sidewalls of the insulating layer with a barrier material, wherein the first surface of the conductive feature is free of the barrier material, wherein the barrier material includes tantalum nitride (TaN) doped with a transition metal; removing the sacrificial material; and covering the barrier material and the first surface of the conductive feature with a conductive material.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 17, 2022
    Inventors: Chia-Pang Kuo, Huan-Yu Shih, Wen-Hsuan Chen, Cheng-Lun Tsai, Ya-Lien Lee, Cheng-Hui Weng, Chun-Chieh Lin, Hung-Wen Su, Yao-Min Liu
  • Publication number: 20220367265
    Abstract: A method of forming a semiconductor device includes forming an opening in a dielectric layer, and forming a barrier layer in the opening. A combined liner layer is formed over the barrier layer by first forming a first liner layer over the barrier layer, and forming a second liner layer over the first liner layer, such that the first liner layer and the second liner layer intermix. A conductive material layer is formed over the combined liner layer, and a thermal process is performed to reflow the conductive material layer.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 17, 2022
    Applicants: Taiwan Semiconductor Manufacturing Co., Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Huei-Wen Hsieh, Kai-Shiang Kuo, Cheng-Hui Weng, Chun-Sheng Chen, Wen-Hsuan Chen
  • Publication number: 20210391275
    Abstract: A method includes forming an insulating layer over a conductive feature; etching the insulating layer to expose a first surface of the conductive feature; covering the first surface of the conductive feature with a sacrificial material, wherein the sidewalls of the insulating layer are free of the sacrificial material; covering the sidewalls of the insulating layer with a barrier material, wherein the first surface of the conductive feature is free of the barrier material, wherein the barrier material includes tantalum nitride (TaN) doped with a transition metal; removing the sacrificial material; and covering the barrier material and the first surface of the conductive feature with a conductive material.
    Type: Application
    Filed: June 11, 2020
    Publication date: December 16, 2021
    Inventors: Chia-Pang Kuo, Huan-Yu Shih, Wen-Hsuan Chen, Cheng-Lun Tsai, Ya-Lien Lee, Cheng-Hui Weng, Chun-Chieh Lin, Hung-Wen Su, Yao-Min Liu
  • Publication number: 20210202310
    Abstract: A method of forming a semiconductor device includes forming an opening in a dielectric layer, and forming a barrier layer in the opening. A combined liner layer is formed over the barrier layer by first forming a first liner layer over the barrier layer, and forming a second liner layer over the first liner layer, such that the first liner layer and the second liner layer intermix. A conductive material layer is formed over the combined liner layer, and a thermal process is performed to reflow the conductive material layer.
    Type: Application
    Filed: October 9, 2020
    Publication date: July 1, 2021
    Inventors: Huei-Wen Hsieh, Kai-Shiang Kuo, Cheng-Hui Weng, Chun-Sheng Chen, Wen-Hsuan Chen
  • Publication number: 20190015891
    Abstract: A preparation method of shuttle spokes that includes these steps: providing a forging die comprising of an upper die and a lower die with the upper die and lower die having a joint angle of the shuttle spoke structure and an arch radius as well as a gap between the upper die and the lower die; inserting the blank of a round spoke into the gap between the upper die and lower die for stamping; using a plurality of nip molding rollers to eliminate the burr at both ends of the shuttle spoke structure; and applying a plurality of straightening rollers to straightness adjustment of the curved spoke body so that when the wheel parts are rolling, less air vortex can minimize air resistance.
    Type: Application
    Filed: July 14, 2017
    Publication date: January 17, 2019
    Inventor: Wen HSUAN CHEN
  • Patent number: 9481201
    Abstract: A spoke includes a spoke body that has two ends respectively forming a terminal section and the threaded section and includes a neck section arranged below the terminal section; a first flattened section set at a location below the neck section; and a second flattened section set at a location below the first flattened section in such a way that the second flattened section and the first flattened section are at different horizontal plane. In assembling the spoke body to a wheel hub and a wheel rim, the combination of the first flattened section and the second flattened section helps set the spoke body at a correct position and direction for assembly and force taking, whereby the first flattened section may absorb torsion and the second flattened section helps transfer tension and allows for change of the angle of bending.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: November 1, 2016
    Assignee: SHA-DAR ACCESSORIES CO., LTD.
    Inventor: Wen-Hsuan Chen
  • Publication number: 20160107479
    Abstract: A spoke includes a spoke body that has two ends respectively forming a terminal section and the threaded section and includes a neck section arranged below the terminal section; a first flattened section set at a location below the neck section; and a second flattened section set at a location below the first flattened section in such a way that the second flattened section and the first flattened section are at different horizontal plane. In assembling the spoke body to a wheel hub and a wheel rim, the combination of the first flattened section and the second flattened section helps set the spoke body at a correct position and direction for assembly and force taking, whereby the first flattened section may absorb torsion and the second flattened section helps transfer tension and allows for change of the angle of bending.
    Type: Application
    Filed: October 17, 2014
    Publication date: April 21, 2016
    Inventor: Wen-Hsuan Chen
  • Publication number: 20140210252
    Abstract: Spoke nipple structure for reducing rupture of spoke thread, which could maintain the straightness of the spoke thread by improving spoke and mated nipple; the spoke comprises: a spoke body as well as head and threaded portion set separately at both ends of the spoke body; the head is pulled or bent in practice to mate with the hub, and the threaded portion is provided with a threaded section of certain length; especially, a cyclic bulge is shaped on the spoke body adjacent to the threaded portion; the max. OD of the bulge is less than or equal to the ID of the nipple's large hole for tight coupling; the locking effect of cyclic bulge could maintain the straightness of the threaded portion and eliminate the bending point formed in the threaded portion of spoke arising from the transversal stress.
    Type: Application
    Filed: January 27, 2013
    Publication date: July 31, 2014
    Inventor: Wen Hsuan Chen
  • Publication number: 20120013171
    Abstract: An anti-shock spoke nipple comprises: a nipple body, having a big opening and a small opening connected with each other, with a groove formed on the side of the small opening; a big opening untapped area, located inside the big opening; a clamping area, located inside the small opening and on the lateral side of the groove; and a small opening tapped area, located inside the small opening and configured between the big opening and the clamping area; wherein, when the spoke goes into the clamping area, threads are formed inside the clamping area to clamp the spoke.
    Type: Application
    Filed: July 17, 2010
    Publication date: January 19, 2012
    Inventor: Wen Hsuan Chen
  • Publication number: 20100310337
    Abstract: A loose resistant bolt structure is disclosed which includes a bolt unit and a buffer portion. The bolt unit includes an intermediate portion, a head portion at an end of the intermediate portion, and a threaded portion at an opposite end of the intermediate portion. The buffer portion surrounds the threaded portion and is located adjacent to an end of the bolt unit to form a distinct pitch on the threaded portion. When the threaded portion engages with a nut, the buffer portion is drawn, shrunk or twisted, producing elastic stress and torsion force, thereby securing the threaded portion to the nut and resisting loose therebetween, and will be able to avoid an inner thread of the nut caused damage during assembly.
    Type: Application
    Filed: June 9, 2009
    Publication date: December 9, 2010
    Inventor: Wen-Hsuan CHEN
  • Publication number: 20090059407
    Abstract: A color wheel includes a motor and a color filter. The motor includes a rotating casing and a rotating shaft protruding outward from a center of a side of the rotating casing. An external thread is formed on the rotating shaft. The color filter defines an internal thread. The color filter is engaged with the motor by engaging the external thread of the rotating shaft with the internal thread of the color filter.
    Type: Application
    Filed: November 20, 2007
    Publication date: March 5, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YU-LUN HO, WEN-HSUAN CHEN
  • Publication number: 20070257089
    Abstract: A method for manufacturing a spoke with diverse diameters is disclosed. A wire is drawn, and at least two rollers sequentially press the wire to form diverse diameters with circular, oval or flat cross section. A multi-layer spoke with diverse diameters and good roundness is achieved. This method is efficient and reduces manufacturing cost.
    Type: Application
    Filed: May 3, 2006
    Publication date: November 8, 2007
    Inventor: Wen-Hsuan Chen
  • Patent number: D1019023
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: March 19, 2024
    Assignee: Amazon Technologies, Inc.
    Inventors: Michael Edward James Paterson, Chia-Wei Chan, Mei Hsuan Chen, Benjamin Wild, Matthew J. England, Wen-Yo Lu, James Siminoff, Mark Siminoff, Yen-Chi Tsai