Patents by Inventor Wen-Hung Chang
Wen-Hung Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978511Abstract: A phase-change memory (PCM) cell is provided to include a first electrode, a second electrode, and a phase-change feature disposed between the first electrode and the second electrode. The phase-change feature is configured to change its data state based on a write operation performed on the PCM cell. The write operation includes a reset stage and a set stage. In the reset stage, a plurality of reset current pulses are applied to the PCM cell, and the reset current pulses have increasing current amplitudes. In the set stage, a plurality of set current pulses are applied to the PCM cell, and the set current pulses exhibit an increasing trend in current amplitude. The current amplitudes of the set current pulses are smaller than those of the reset current pulses.Type: GrantFiled: January 21, 2022Date of Patent: May 7, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yung-Huei Lee, Chun-Wei Chang, Jian-Hong Lin, Wen-Hsien Kuo, Pei-Chun Liao, Chih-Hung Nien
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Publication number: 20240136423Abstract: A method for fabricating high electron mobility transistor (HEMT) includes the steps of: forming a buffer layer on a substrate; forming a first barrier layer on the buffer layer; forming a first hard mask on the first barrier layer; removing the first hard mask and the first barrier layer to form a recess; forming a second barrier layer in the recess; and forming a p-type semiconductor layer on the second barrier layer.Type: ApplicationFiled: December 25, 2023Publication date: April 25, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chun-Ming Chang, Che-Hung Huang, Wen-Jung Liao, Chun-Liang Hou
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Publication number: 20240128291Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer has two adhering surfaces having a same area and a middle cross section located at a middle position between the two adhering surfaces. An area of the middle cross section is 115% to 200% of an area of any one of the two adhering surfaces. The adhesive layer can provide for light to travel therethrough, and enables the light therein to change direction and to attenuate. The sensor chip, the adhesive layer, and the light-permeable layer are embedded in the encapsulant, and an outer surface of the light-permeable layer is at least partially exposed from the encapsulant.Type: ApplicationFiled: June 6, 2023Publication date: April 18, 2024Inventors: CHIA-SHUAI CHANG, CHIEN-HUNG LIN, WEI-LI WANG, WEN-FU YU, BAE-YINN HWANG
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Publication number: 20240128353Abstract: A method for fabricating high electron mobility transistor (HEMT) includes the steps of: forming a buffer layer on a substrate; forming a first barrier layer on the buffer layer; forming a first hard mask on the first barrier layer; removing the first hard mask and the first barrier layer to form a recess; forming a second barrier layer in the recess; and forming a p-type semiconductor layer on the second barrier layer.Type: ApplicationFiled: December 25, 2023Publication date: April 18, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chun-Ming Chang, Che-Hung Huang, Wen-Jung Liao, Chun-Liang Hou
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Publication number: 20240128233Abstract: A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a fixing adhesive layer disposed on the substrate, a sensor chip adhered to the fixing adhesive layer, an annular adhering layer disposed on the sensor chip, a light-permeable sheet adhered to the annular adhering layer, and a plurality of metal wires that are electrically coupled to the substrate and the sensor chip. The size of the light-permeable sheet is smaller than that of the sensor chip.Type: ApplicationFiled: June 6, 2023Publication date: April 18, 2024Inventors: CHIA-SHUAI CHANG, WEN-FU YU, BAE-YINN HWANG, WEI-LI WANG, CHIEN-HUNG LIN
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Publication number: 20240120337Abstract: A semiconductor device structure includes a first dielectric wall, a plurality of first semiconductor layers vertically stacked and extending outwardly from a first side of the first dielectric wall, each first semiconductor layer has a first width, a plurality of second semiconductor layers vertically stacked and extending outwardly from a second side of the first dielectric wall, each second semiconductor layer has a second width, a plurality of third semiconductor layers disposed adjacent the second side of the first dielectric wall, each third semiconductor layer has a third width greater than the second width, a first gate electrode layer surrounding at least three surfaces of each of the first semiconductor layers, the first gate electrode layer having a first conductivity type, and a second gate electrode layer surrounding at least three surfaces of each of the second semiconductor layers, the second gate electrode layer having a second conductivity type opposite the first conductivity type.Type: ApplicationFiled: January 15, 2023Publication date: April 11, 2024Inventors: Ta-Chun LIN, Chih-Hung HSIEH, Chun-Sheng LIANG, Wen-Chiang HONG, Chun-Wing YEUNG, Kuo-Hua PAN, Chih-Hao CHANG, Jhon Jhy LIAW
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Publication number: 20240114698Abstract: A semiconductor device includes a substrate, a bottom electrode, a ferroelectric layer, a noble metal electrode, and a non-noble metal electrode. The bottom electrode is over the substrate. The ferroelectric layer is over the bottom electrode. The noble metal electrode is over the ferroelectric layer. The non-noble metal electrode is over the noble metal electrode.Type: ApplicationFiled: December 1, 2023Publication date: April 4, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Tzu-Yu CHEN, Sheng-Hung SHIH, Fu-Chen CHANG, Kuo-Chi TU, Wen-Ting CHU, Alexander KALNITSKY
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Patent number: 11925912Abstract: The disclosure features a system that includes a plurality of material tanks, each of which includes at least one material for forming a chemical composition and includes a first recirculation loop; at least one mixing tank in which the materials from the material tanks are mixed to form a chemical composition, the mixing tank including a second recirculation loop; and at least one holding tank configured to continuously receive the chemical composition from the mixing tank, the holding tank including a third recirculation loop. The system may further include a plurality of fluid flow controller units and be configured to form material and chemical composition flows in an in-process steady state.Type: GrantFiled: December 7, 2018Date of Patent: March 12, 2024Assignee: Fujifilm Electronic Materials U.S.A., Inc.Inventors: Shih-Pin Chou, Wen-Hung Chang, Deepak Mahulikar, Tamas Varga, Abhudaya Mishra
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Publication number: 20190105620Abstract: This disclosure features methods of forming chemical compositions. The method includes (1) mixing a plurality of continuous material flows in a mixing tank to form a chemical composition, each continuous material flow including at least one component of the composition; and (2) moving a continuous flow of the chemical composition to a packaging station downstream of the mixing tank. The mixing and moving steps are performed continuously. This disclosure also features systems that can be used to perform such methods.Type: ApplicationFiled: December 7, 2018Publication date: April 11, 2019Inventors: Shih-Pin Chou, Wen-Hung Chang, Deepak Mahulikar, Tamas Varga, Abhudaya Mishra
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Patent number: 10159949Abstract: This disclosure features methods of forming chemical compositions. The method includes (1) mixing a plurality of continuous material flows in a mixing tank to form a chemical composition, each continuous material flow including at least one component of the composition; and (2) moving a continuous flow of the chemical composition to a packaging station downstream of the mixing tank. The mixing and moving steps are performed continuously. This disclosure also features systems that can be used to perform such methods.Type: GrantFiled: February 14, 2017Date of Patent: December 25, 2018Assignee: Fujifilm Planar Solutions, LLCInventors: Shih-Pin Chou, Wen-Hung Chang, Deepak Mahulikar, Tamas Varga, Abhudaya Mishra
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Publication number: 20170259229Abstract: This disclosure features methods of forming chemical compositions. The method includes (1) mixing a plurality of continuous material flows in a mixing tank to form a chemical composition, each continuous material flow including at least one component of the composition; and (2) moving a continuous flow of the chemical composition to a packaging station downstream of the mixing tank. The mixing and moving steps are performed continuously. This disclosure also features systems that can be used to perform such methods.Type: ApplicationFiled: February 14, 2017Publication date: September 14, 2017Inventors: Shih-Pin Chou, Wen-Hung Chang, Deepak Mahulikar, Tamas Varga, Abhudaya Mishra
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Patent number: 9419878Abstract: A network controller for delay measurement in SDN and related delay measurement system and delay measurement method are provided. A probe packet is used to record the transmission of the probe packet between the network controller and network switches, to calculate a transport delay time between the network switches and hop delay time between the network switches, to obtain the delay of each link in the transmission path, which helps in finding out a critical hop in the SDN transmission path. Through the delay measurement mechanism according to the present disclosure, the critical hop will become a reference based on which a network manager adjusts a network framework, or a basis taken by an SDN control system to select a path.Type: GrantFiled: July 21, 2014Date of Patent: August 16, 2016Assignee: Industrial Technology Research InstituteInventors: Tai-Hua Hsiao, Wen-Hung Chang
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Publication number: 20150163114Abstract: A network controller for delay measurement in SDN and related delay measurement system and delay measurement method are provided. A probe packet is used to record the transmission of the probe packet between the network controller and network switches, to calculate a transport delay time between the network switches and hop delay time between the network switches, to obtain the delay of each link in the transmission path, which helps in finding out a critical hop in the SDN transmission path. Through the delay measurement mechanism according to the present disclosure, the critical hop will become a reference based on which a network manager adjusts a network framework, or a basis taken by an SDN control system to select a path.Type: ApplicationFiled: July 21, 2014Publication date: June 11, 2015Applicant: Industrial Technology Research InstituteInventors: Tai-Hua Hsiao, Wen-Hung Chang
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Publication number: 20040203407Abstract: A radio computer monitor transmitting receiving control apparatus is constructed to include at least one receiving module respectively installed in a respective audio video signal output device, for example, a computer monitor, television, liquid crystal display, or organic light emitting diode display controlled by a remote controller, and a radio transmitting control module connected to an audio video signal source, which can be a host computer or set-top-box, and adapted for transmitting signal data received from the remote controller through one receiving module to the audio video signal source and transmitting audio video output signal from the audio video signal source to each receiving module for output through each monitor in which one of the at least one receiving module is installed.Type: ApplicationFiled: June 13, 2002Publication date: October 14, 2004Inventor: Wen-Hung Chang
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Patent number: D1027976Type: GrantFiled: May 24, 2021Date of Patent: May 21, 2024Assignee: VIVOTEK INC.Inventors: Kuan-Hung Chen, Kai-Sheng Chuang, Chia-Chi Chang, Yu-Fang Huang, Kai-Ting Yu, Wen-Chun Chen, Shu-Jung Hsu, Tsao-Wei Hung