Patents by Inventor Wen-jyh Wang

Wen-jyh Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240121323
    Abstract: Method for control protocol frame transmission and electronic device are provided. The method comprises following operations. By the electronic device operating in an advanced line encoding mode and having a first burst from the electronic device to the other electronic device, the first burst is closed and a second burst is opened from the electronic device to the other electronic device for request frame transmission, wherein the electronic device operating in the advanced line encoding mode is configured to transmit data by using an advanced line encoding having an effective data rate larger than an effective data rate of 8b/10b encoding. By the electronic device, a request frame is transmitted in the second burst.
    Type: Application
    Filed: October 6, 2023
    Publication date: April 11, 2024
    Applicant: SK hynix Inc.
    Inventors: LAN FENG WANG, WEN JYH LIN
  • Publication number: 20240120304
    Abstract: The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a package structure, a circuit structure, a bonding structure and an external element. The circuit structure is disposed on the package structure and is electrically connected to the package structure. The circuit structure has a recess. The bonding structure includes a first bonding pad and a second bonding pad. The second bonding pad is disposed in the recess, and the second bonding pad is disposed on the first bonding pad. The bonding structure is disposed between the circuit structure and the external element. The external element is electrically connected to the circuit structure through the bonding structure. A width of the first bonding pad is smaller than a width of the second bonding pad.
    Type: Application
    Filed: November 24, 2022
    Publication date: April 11, 2024
    Applicant: Innolux Corporation
    Inventors: Tzu-Sheng Wu, Haw-Kuen Liu, Chung-Jyh Lin, Cheng-Chi Wang, Wen-Hsiang Liao, Te-Hsun Lin
  • Patent number: 6778170
    Abstract: Displaying the images encoded in a display signal which also contains synchronization signals and display enable (DE) signal. The DE signal indicates the time points at which the display data portion of the display signal contains active pixel data elements representing image frames. A display unit generates HDISP and VDISP signals (indicative of the active time in which active pixels and lines are respectively received) based on the DE signal. As the DE signal generally tracks (in the time domain) the active pixel data elements, the active pixel data elements forming image frames are accurately identified, and a superior image quality generally results.
    Type: Grant
    Filed: April 7, 2000
    Date of Patent: August 17, 2004
    Assignee: Genesis Microchip Inc.
    Inventors: Hongjun Shu, Osamu Kobayashi, Wen-jyh Wang