Patents by Inventor Wen-Kuang Tai

Wen-Kuang Tai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11975243
    Abstract: The present disclosure is relates to a TPU ball structure and a manufacturing method thereof. The TPU ball structure includes a ball bladder layer, a yarn layer and a surface layer. The ball bladder layer is made of TPU material. The yarn layer is made of TPU material, and the yarn layer is disposed to cover the ball bladder layer. The surface layer is made of TPU material, and the surface layer is disposed to cover the yarn layer. The above layers of the TPU ball structure are made of TPU material to satisfy a requirement for environmental protection, and are recyclable. There is no need to use adhesive to adhere the above layers of the TPU ball structure. Therefore, the peeling strength between the layers of the TPU ball structure can be increased so that the whole peeling strength of the TPU ball structure can be increased.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: May 7, 2024
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chih-Yi Lin, Kuo-Kuang Cheng, Chi-Chin Chiang, Wen-Hsin Tai
  • Patent number: 11912837
    Abstract: The present disclosure provides a thin film including a first thermoplastic polyolefin (TPO) elastomer which is anhydride-grafted. The present disclosure further provides a method for manufacturing the thin film, a laminated material and a method for adhesion.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: February 27, 2024
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chih-Yi Lin, Kuo-Kuang Cheng, Chi-Chin Chiang, Wen-Hsin Tai, Ming-Chen Chang
  • Publication number: 20110264256
    Abstract: A process control method is provided for controlling a tool which processes a deposition process on a plurality of wafers for a process time. The process control method comprises receiving a quantity of the wafers and calculating a deposition compensation time necessary for the deposition process performed on the wafers by the tool according to the quantity of the wafers and a deposition loading effect coefficient corresponding to the deposition process. The deposition loading effect coefficient is retrieved from a database according to a process program of the deposition process. According to the deposition compensation time, the process time is adjusted to be an adjusted process time. The deposition process is performed on the wafers for the adjusted process time by the tool.
    Type: Application
    Filed: April 22, 2010
    Publication date: October 27, 2011
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Yu-Chin Cheng, Wen-Kuang Tai
  • Patent number: 6045619
    Abstract: A horizontal-type silicon-nitride furnace (HOSINF) having two tubes is provided. The HOSINF includes an outer tube and an inner tube. One end of the outer tube is coupled to a pump. The other end of the outer tube can be well sealed by a door through a flange. The inner tube is located inside the outer tube. The inner tube has a closed end and an opened end, in which the opened end is near to the door, and the closed end is near to the pump. The inner tube includes a first gas inlet and a second gas inlet. Desired reaction gases are flushed into the inner tube from the first inlet and the second inlet. The inner tube surrounds a paddle carrying several wafers, on which a silicon nitride layer is to be formed. The paddle is mounted on the door. A heater is located on a side periphery of the outer tube.
    Type: Grant
    Filed: December 15, 1998
    Date of Patent: April 4, 2000
    Assignee: United Microelectronics Corp.
    Inventors: Wen-Kuang Tai, Kuo-Tung Chu, Kuo-Liang Huang
  • Patent number: 5595605
    Abstract: The invention disclosed an efficient apparatus for solving the problem of unstable growth rate of oxide occurred when the procedure of wet oxidation is processed first and immediately followed by a procedure of dry oxidation. The invention involves in implementing as many insulating sleeves as required for wrapping around inlet pipes of a horizontal driven field oxidation tube to prevent water vapor from remaining in the inlet pipes so as to stabilize the growth rate of oxide.
    Type: Grant
    Filed: October 11, 1995
    Date of Patent: January 21, 1997
    Assignee: United Microelectronics Corp.
    Inventors: Wen-Kuang Tai, Ching-Li Shih