Abstract: A method for manufacturing an antenna includes steps as follows. First, a substrate is provided, wherein a surface of the substrate has an antenna region. Then, the surface of the substrate is electroless plated with a metal medium, so that the surface is covered with the metal medium. Then, the metal medium is covered with a resist. Then, a portion of the resist in the antenna region is removed. Then, the antenna region is electroplated with metal material to form an antenna main body. Then, a remaining portion of the resist is removed, and excluding a portion of the metal medium in the antenna region, the other portion of the metal medium is also removed from the substrate.

Abstract: A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and disposing a plating resist material on the non-conductive frame, removing a part of the plating resist material within a predetermined region on the non-conductive frame and forming a roughened surface on the non-conductive frame within the predetermined region by laser marking, forming a medium layer on the roughened surface, wherein the medium layer comprises Pd or Ag, removing the plating resist material on the non-conductive frame, and forming a metal layer on the medium layer.

Abstract: An antenna module is disclosed, including a housing, an antenna disposed through the housing, a first member fixed to the housing, and a fastener. The housing comprises a flexible cantilever having a nub engaged in a through hole of the antenna. The fastener is disposed through first member and fixed to the antenna.

Abstract: A method for manufacturing an antenna includes steps as follows. First, a substrate is provided, wherein a surface of the substrate has an antenna region. Then, the surface of the substrate is electroless plated with a metal medium, so that the surface is covered with the metal medium. Then, the metal medium is covered with a resist. Then, a portion of the resist in the antenna region is removed. Then, the antenna region is electroplated with metal material to form an antenna main body. Then, a remaining portion of the resist is removed, and excluding a portion of the metal medium in the antenna region, the other portion of the metal medium is also removed from the substrate.

Abstract: A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and forming a photosensitive medium layer on the non-conductive frame, wherein the medium layer comprises a catalyzer for electroless deposition; applying a light beam through a transparent portion of a mask to the medium layer, such that a part of the medium layer is solidified within a predetermined region on the non-conductive frame; removing a part of the medium layer outside of the predetermined region; and forming a metal layer on the medium layer within the predetermined region.

Abstract: A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and disposing a plating resist material on the non-conductive frame, removing a part of the plating resist material within a predetermined region on the non-conductive frame and forming a roughened surface on the non-conductive frame within the predetermined region by laser marking, forming a medium layer on the roughened surface, wherein the medium layer comprises Pd or Ag, removing the plating resist material on the non-conductive frame, and forming a metal layer on the medium layer.

Abstract: An antenna module is disclosed, including an electronic element, an antenna and a connecting element. The antenna includes a hole. The connecting element includes a first connecting portion, a propping portion and a second connecting portion. The first connecting portion passes through the hole and is fixed to the antenna by the propping portion. The second connecting portion is electrically connected to the electronic element.

Abstract: A structure of an antenna is disclosed. The antenna comprises a flexible antenna, a first foam material, a second foam material, a cover plate and a housing. The first foam material and the second foam material together enwrap the flexible antenna. The cover plate and the first foam material match correspondingly. The housing matches with the second foam material, and the housing is joined with the cover plate. The strength of the cover plate and the housing are enhanced respectively by the first and the second foam material to prevent bending and distortion.

Abstract: An electronic device comprises a housing, a circuit board, a cover and a switch. The housing comprises an opening receiving a card. The circuit board is disposed in the housing. The cover is disposed on the housing corresponding to the opening. The switch is disposed on the circuit board, wherein when the cover is moved, the cover actuates the switch to control the circuit board.

Abstract: An antenna module is disclosed, including a housing, an antenna disposed through the housing, a first member fixed to the housing, and a fastener. The housing comprises a flexible cantilever having a nub engaged in a through hole of the antenna. The fastener is disposed through first member and fixed to the antenna.

Abstract: An antenna module is disclosed, including an electronic element, an antenna and a connecting element. The antenna includes a hole. The connecting element includes a first connecting portion, a propping portion and a second connecting portion. The first connecting portion passes through the hole and is fixed to the antenna by the propping portion. The second connecting portion is electrically connected to the electronic element.

Abstract: A card-receiving device for containing a card comprises a chassis, a tray and a stopper. The tray is disposed on the chassis and moveable between a first position and a second position, wherein the card is disposed on the tray, and moves from the first position to the second position by the tray. When the tray moves to the second position from the first position, the stopper abuts and stops the card.

Abstract: An electronic device comprises a housing, a circuit board, a cover and a switch. The housing comprises an opening receiving a card. The circuit board is disposed in the housing. The cover is disposed on the housing corresponding to the opening. The switch is disposed on the circuit board, wherein when the cover is moved, the cover actuates the switch to control the circuit board.

Abstract: A card-receiving device for containing a card comprises a chassis, a tray and a stopper. The tray is disposed on the chassis and moveable between a first position and a second position, wherein the card is disposed on the tray, and moves from the first position to the second position by the tray. When the tray moves to the second position from the first position, the stopper abuts and stops the card.