Patents by Inventor Wen-Li Adam Chen

Wen-Li Adam Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140329103
    Abstract: A multilayer polyolefin film useful for packaging contains a core layer including from 20% to 100% by weight of the core layer of a polyethylene homopolymer having a density of between about 0.94 and about 0.97; an ethylene/alpha-olefin copolymer having a density of between about 0.94 and about 0.97; polypropylene; or a mixture thereof; from 0% to 80% by weight of the core layer of linear low density polyethylene, low density polyethylene, a copolymer of ethylene and vinyl acetate; or a mixture thereof; and a skin layer laminated to the core layer. The skin layer is a layer of linear low density polyethylene, low density polyethylene, a copolymer of ethylene and vinyl acetate; or a mixture thereof. At least one of the core layer and the skin layer includes at least 20% modern carbon. If desired, two skin layers may be laminated to opposing surfaces of the core layer.
    Type: Application
    Filed: April 30, 2014
    Publication date: November 6, 2014
    Applicant: Avery Dennison Corporation
    Inventors: Vadim ZAIKOV, Wen-Li (Adam) A. Chen
  • Patent number: 8080506
    Abstract: The present invention relates to reactive purge compound for cleaning polymer processing equipment wherein the reactive purge compound that includes i) at least about 50 wt.% of a polymeric carrier component based on the total weight of the reactive purge compound; and ii) a chain scission catalyst component dispersed in the polymeric carrier component; wherein a) the chain scission catalyst component includes a chain scission catalyst selected from the group consisting of at least one alkali metal hydroxide, at least one alkaline earth metal hydroxide, and any combination thereof; b) the reactive purge compound further comprises a water generating component; or c) both (a) and (b); wherein the reactive purge compound is a feedstock material in the form of a plurality of pellets, granules, rods, powder or other particles.
    Type: Grant
    Filed: July 14, 2009
    Date of Patent: December 20, 2011
    Assignee: MSI Technology LLC.
    Inventors: Mitsuzo Shida, Wen-Li Adam Chen
  • Publication number: 20110012275
    Abstract: The present invention relates to reactive purge compound for cleaning polymer processing equipment wherein the reactive purge compound that includes i) at least about 50 wt.% of a polymeric carrier component based on the total weight of the reactive purge compound; and ii) a chain scission catalyst component dispersed in the polymeric carrier component; wherein a) the chain scission catalyst component includes a chain scission catalyst selected from the group consisting of at least one alkali metal hydroxide, at least one alkaline earth metal hydroxide, and any combination thereof; b) the reactive purge compound further comprises a water generating component; or c) both (a) and (b); wherein the reactive purge compound is a feedstock material in the form of a plurality of pellets, granules, rods, powder or other particles.
    Type: Application
    Filed: July 14, 2009
    Publication date: January 20, 2011
    Applicant: MSI Technology LLC.
    Inventors: Mitsuzo Shida, Wen-Li Adam Chen