Patents by Inventor Wen-Ling Lui

Wen-Ling Lui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6765081
    Abstract: A thermal responsive, water soluble polymer. The polymer comprises the co-polymerization product of: (a) 5˜95 wt % of N-isopropyl acrylamide (NIP); (b) 0.1˜80 wt % of 1-vinyl-2-pyrrolidinone (VPD); and optionally, (c) 0.1˜30 wt % of acrylic acid (AA). As the proportion of component (b) VPD increases, the Lower Critical Solution Temperature (LCST) and water solubility of the polymer increases. On the other hand, as the proportion of component (c) AA increases, the Lower Critical Solution Temperature (LCST) decreases and the COOH reactive groups increases, which impart high reactivity to the copolymer. By adjusting the proportion of the monomers, a broad range of LCST can be manipulated from about 20 to 80° C.
    Type: Grant
    Filed: May 2, 2002
    Date of Patent: July 20, 2004
    Assignee: Industrial Technology Research Institute
    Inventors: Chih-Hsiang Lin, In-Mau Chen, Wen-Ling Lui
  • Publication number: 20030120028
    Abstract: A thermal responsive, water soluble polymer. The polymer comprises the co-polymerization product of: (a) 5˜95 wt % of N-isopropyl acrylamide (NIP); (b) 0.1˜80 wt % of 1-vinyl-2-pyrrolidinone (VPD); and optionally, (c) 0.1˜30 wt % of acrylic acid (AA). As the proportion of component (b) VPD increases, the Lower Critical Solution Temperature (LCST) and water solubility of the polymer increases. On the other hand, as the proportion of component (c) AA increases, the Lower Critical Solution Temperature (LCST) decreases and the COOH reactive groups increases, which impart high reactivity to the copolymer. By adjusting the proportion of the monomers, a broad range of LCST can be manipulated from about 20 to 80° C.
    Type: Application
    Filed: May 2, 2002
    Publication date: June 26, 2003
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chih-Hsiang Lin, In-Mau Chen, Wen-Ling Lui
  • Patent number: 6498226
    Abstract: This invention provides cycloaliphatic polyimide having the following formula (I): wherein 1 and n are integers from 4 to 7; m is an integer from 0 to 2; p is an integer from 1 to 8; polycyclic aliphatic compound R reprents C1-8 cycloalkyl, cycloalkenyl, cycloalkynyl, norbornenyl, decalinyl, adamantanyl, or cubanyl. That cycloaliphatic polyimide can be a through transparent film, their thermal stability is over 430° C. and dielectric constant is about 2.7.
    Type: Grant
    Filed: May 3, 2001
    Date of Patent: December 24, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Kung-Lung Cheng, Shu-Chen Lin, Wen-Ling Lui, Chih-Hsiang Lin, Wei-Ling Lin, Woan-Shiow Tzeng
  • Publication number: 20020120090
    Abstract: This invention provides cycloaliphatic polyimide having the following formula (I): 1
    Type: Application
    Filed: May 3, 2001
    Publication date: August 29, 2002
    Applicant: Industrial Technology Research Institute
    Inventors: Kung-Lung Cheng, Shu-Chen Lin, Wen-Ling Lui, Chih-Hsiang Lin, Wei-Ling Lin, Woan-Shiow Tzeng
  • Patent number: 6355739
    Abstract: The present invention discloses a resin composition reclaimed from compact disk waste having improved mechanical characteristics. The resin composition in accordance with the present invention comprises (a) compact disk waste comprising polycarbonate (PC) as a primary component; and (b) a coupling agent containing two or more reactive functional groups. Optionally, the resin composition of the present invention may further comprise (c) an impact-resistant thermoplastic resin, engineering plastic grade PC or waste thereof, or recycled bottle grade PC.
    Type: Grant
    Filed: April 3, 2000
    Date of Patent: March 12, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Shih-Jung Tsai, Hsin-Ching Kao, Wen-Ling Lui