Abstract: An information exhibition system includes an exhibition cabinet and a least one information display device. The exhibition cabinet is used to exhibit at least one object. The information display device is positioned on the exhibition cabinet. The information display device includes a display panel and an illumination module. The display panel includes a front surface and a back surface opposite to the front surface. The front surface shows information. The illumination module is positioned on the back surface of the display panel, so that the light can be emitted into the display panel through the back surface and also illuminate the object on the backside of the display panel.

Abstract: A lamp structure includes a base, a side-emitting light source, first and second reflecting portions. The base includes a central protrusion portion extending from the base. The side-emitting light source is disposed on a side surface of the central protrusion portion and configured to emit a light beam. The first reflecting portion includes a first reflective curved surface, and a portion of the light beam is reflected thereby and then is directly emitted out. The first reflecting portion is disposed between the central protrusion portion and the second reflecting portion. The second reflecting portion includes a second reflective curved surface adjacent to the first reflective curved surface, and the other portion of the light beam is reflected thereby and then is directly or indirectly emitted out. The first reflective curved surface has a radius of curvature less than that of the second reflective curved surface.

Abstract: An information exhibition system includes an exhibition cabinet and a least one information display device. The exhibition cabinet is used to exhibit at least one object. The information display device is positioned on the exhibition cabinet. The information display device includes a display panel and an illumination module. The display panel includes a front surface and a back surface opposite to the front surface. The front surface shows information. The illumination module is positioned on the back surface of the display panel, so that the light can be emitted into the display panel through the back surface and also illuminate the object on the backside of the display panel.

Abstract: A light emitting diode includes a casing, a frame in the casing, one or a plurality of light emitting chip, and a packaging polymer; the frame being provided 5 with a placement area to receive placement of the light emitting chip, and an electrode area separated from the placement area; a sectional fall being disposed at where appropriately on the placement area to increase contact area between the frame and the casing and improve the relative stability between the casing and the frame.

Abstract: An LED package including a lead-frame, at least an LED chip and an encapsulant is provided. The lead-frame has a roughened surface, the LED chip is disposed on the lead-frame and electrically connected to the lead-frame, and the roughened surface is suitable to scatter the light emitted from the LED chip. In addition, the encapsulant encapsulates the LED chip and a part of the lead-frame, and the rest part of the lead-frame is exposed out of the encapsulant.

Abstract: A light emitting diode includes a casing, a frame in the casing, one or a plurality of light emitting chip, and a packaging polymer; the frame being provided 5 with a placement area to receive placement of the light emitting chip, and an electrode area separated from the placement area; a sectional fall being disposed at where appropriately on the placement area to increase contact area between the frame and the casing and improve the relative stability between the casing and the frame.

Abstract: A light emitting diode includes a casing, a frame in the casing, one or a plurality of light emitting chip, and a packaging polymer; the frame being provided with a placement area to receive placement of the light emitting chip, and an electrode area separated from the placement area; a sectional fall being disposed at where appropriately on the placement area to increase contact area between the frame and the casing and improve the relative stability between the casing and the frame.

Abstract: An LED package including a lead-frame, at least an LED chip and an encapsulant is provided. The lead-frame has a roughened surface, the LED chip is disposed on the lead-frame and electrically connected to the lead-frame, and the roughened surface is suitable to scatter the light emitted from the LED chip. In addition, the encapsulant encapsulates the LED chip and a part of the lead-frame, and the rest part of the lead-frame is exposed out of the encapsulant.

Abstract: An LED package including a lead-frame, at least an LED chip and an encapsulant is provided. The lead-frame has a roughened surface, the LED chip is disposed on the lead-frame and electrically connected to the lead-frame, and the roughened surface is suitable to scatter the light emitted from the LED chip. In addition, the encapsulant encapsulates the LED chip and a part of the lead-frame, and the rest part of the lead-frame is exposed out of the encapsulant.

Abstract: A forming mold of a light-emitting member includes a frame, an upper mold and a lower mold, and the frame is provided with carriers, pins and supporting portions. The upper and lower molds match with each other to provide a forming space for the base of the light-emitting member. The forming space contains the carriers and a part of the supporting portions. One or more projections are disposed at the position where the brinks of the upper and lower molds contact the supporting portions. After injection molding, the burrs formed by a plastic material along the supporting portions can be concealed in the recesses that are formed corresponding to each of the projections, thereby reducing the influence of the burrs on the external size of the base.

Abstract: A frame structure includes a first metallic frame, a second metallic frame, and a plastic housing. The first metallic frame has extension portions extending outwardly, and the first metallic frame is separately positioned from the second metallic frame. The first metallic frame and the second metallic frame respectively have different electrical polarities. The plastic housing is connected with the first metallic frame and the second metallic frame, and the plastic housing and the two extension portions form a receiving space so the two extension portions are positioned at two ends of the plastic housing. The plastic housing receives the LED die and a packaging layer. The extension portions expose out of the plastic housing or are nestled within the plastic housing.

Abstract: A forming mold of a light-emitting member according to the present invention at least comprises: a frame, an upper mold and a lower mold, and the frame is provided with carriers, pins and supporting portions. The upper and lower molds match with each other to provide a forming space for the base of the light-emitting member. The forming space contains the carriers and a part of the supporting portions. One or more projections are disposed at the position where the brinks of the upper and lower molds contact the supporting portions. After injection molding, the burrs formed by a plastic material along the supporting portions can be concealed in the recesses that are formed corresponding to each of the projections, thereby reducing the influence of the burrs on the external size of the base.

Abstract: An optical film includes a number of phosphor layers. The phosphor layers are stacked together, and each of the phosphor layers is excited by an exciting light source and respectively emits a secondary light beam. The secondary light beams emitted by the phosphor layers are in different wavelength ranges.

Abstract: A package structure including a first lead, a second lead, an encapsulant, a light-emitting device and an electrostatic discharge (ESD) protection device is provided. The second lead is disposed beside the first lead, and parts of the first lead and the second lead are encapsulated by the encapsulant. The encapsulant has a first cavity and a second cavity. Parts of the first lead and the second lead are exposed by the first cavity and the other parts of the first lead and the second lead are exposed by the second cavity. The light-emitting device is disposed inside the first cavity and electrically connected to the first lead and the second lead. The ESD protection device is disposed inside the second cavity and electrically connected to the first lead and the second lead.

Abstract: A high-powered diode holder and a package thereof are disclosed. The high-powered diode holder includes a base and a plurality of metal electrodes. The base is made of ceramic. In the interior part of one end of the base, there is a functional area that is indented inwards. In the functional area, there are a plurality of through-hole units and a plurality of conducting areas whose polarities are different. The second end of the base is connected with a heat-conducting base. The metal electrodes are individually connected with the base, and the metal electrodes are electrically connected with the corresponding conducting areas respectively. In the functional area, there are a plurality of LED chips that correspond to the through-hole units respectively. The LED chips and the conducting areas are connected with conducting-wires respectively, and a package resin element covers the functional areas of the base.

Abstract: A light-emitting diode (LED) package structure including an encapsulant, a carrier, and an LED chip is provided. The encapsulant has a cavity located in a front end of the encapsulant. The carrier includes a die pad, a heat spreader, and a plurality of leads. The die pad is disposed on the encapsulant and located in the cavity. The heat spreader is connected with the die pad, and passes through the encapsulant to extend outside the cavity, and further extends toward a rear end of the encapsulant. The leads pass through the encapsulant and extend outside the cavity. The LED chip is disposed on the die pad, and is electrically connected to the leads. Heat generated when the LED chip emits light is conducted to the heat spreader via the die pad, so as to conduct the heat outside the encapsulant, and to further reduce the temperature of the LED chip.

Abstract: An LED package including a lead-frame, at least an LED chip and an encapsulant is provided. The lead-frame has a roughened surface, the LED chip is disposed on the lead-frame and electrically connected to the lead-frame, and the roughened surface is suitable to scatter the light emitted from the LED chip. In addition, the encapsulant encapsulates the LED chip and a part of the lead-frame, and the rest part of the lead-frame is exposed out of the encapsulant.

Abstract: A light emitting diode includes a casing, a frame in the casing, one or a plurality of light emitting chip, and a packaging polymer; the frame being provided with a placement area to receive placement of the light emitting chip, and an electrode area separated from the placement area; a sectional fall being disposed at where appropriately on the placement area to increase contact area between the frame and the casing and improve the relative stability between the casing and the frame.

Abstract: A package structure including a first lead, a second lead, an encapsulant, a light-emitting device and an electrostatic discharge (ESD) protection device is provided. The second lead is disposed beside the first lead, and parts of the first lead and the second lead are encapsulated by the encapsulant. The encapsulant has a first cavity and a second cavity. Parts of the first lead and the second lead are exposed by the first cavity and the other parts of the first lead and the second lead are exposed by the second cavity. The light-emitting device is disposed inside the first cavity and electrically connected to the first lead and the second lead. The ESD protection device is disposed inside the second cavity and electrically connected to the first lead and the second lead.

Abstract: A light-emitting diode (LED) package structure including an encapsulant, a carrier, and an LED chip is provided. The encapsulant has a cavity located in a front end of the encapsulant. The carrier includes a die pad, a heat spreader, and a plurality of leads. The die pad is disposed on the encapsulant and located in the cavity. The heat spreader is connected with the die pad, and passes through the encapsulant to extend outside the cavity, and further extends toward a rear end of the encapsulant. The leads pass through the encapsulant and extend outside the cavity. The LED chip is disposed on the die pad, and is electrically connected to the leads. Heat generated when the LED chip emits light is conducted to the heat spreader via the die pad, so as to conduct the heat outside the encapsulant, and to further reduce the temperature of the LED chip.