Abstract: A copolymer is formed by reacting a composition I, which includes (a) a first epoxy compound having a chemical structure of wherein R1 is single bond, —O—, (b) a second epoxy compound that is different from (a) the first epoxy compound, and (c) a curing agent. The copolymer can be mixed with inorganic powder to form a composite material.

Abstract: A copolymer is formed by reacting (A) aromatic monomer, an oligomer thereof, or a polymer thereof, with (B) aliphatic monomer, an oligomer thereof, or a polymer thereof. The aromatic monomer has a chemical structure of in which each of R1 is independently H or CH3, and n=1-4.

Abstract: A resin composition is provided, which includes 1 part by weight of a thermally conductive resin, 0.001 to 0.05 parts by weight of radical initiator, and 0.05 to 0.30 parts by weight of crosslinking agent. The chemical structure of the thermally conductive resin is in which R1 is —CH2—, —C(?O)—, or —(CH2)—(C6H5)—, and R2 is H or CH3.

Abstract: A resin composition is provided, which includes 1 part by weight of a thermally conductive resin, 0.001 to 0.05 parts by weight of radical initiator, and 0.05 to 0.30 parts by weight of crosslinking agent. The chemical structure of the thermally conductive resin is in which R1 is —CH2—, —C(?O)—, or —(CH2)—(C6H5)—, and R2 is H or CH3.

Abstract: A substrate assembly containing a conductive film and a fabrication method thereof are provided. The substrate assembly includes a polymer substrate, a surface treatment layer formed on the polymer substrate and a conductive film formed on the surface treatment layer, wherein the conductive film is formed by sintering a metal conductive ink and the surface treatment layer is formed from a composite material of an auxiliary filler and a polymer. The auxiliary filler in the surface treatment layer can deliver energy into the metal conductive ink for sintering the conductive metal ink.