Patents by Inventor Wen-Shu Cheng

Wen-Shu Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure including through via structures
    Patent number: 11923310
    Abstract: A package structure and method for forming the same are provided. The package structure includes a first through via structure formed in a substrate and a semiconductor die formed below the first through via structure. The package structure further includes a conductive structure formed in a passivation layer over the substrate. The conductive structure includes a first via portion and a second via portion, the first via portion is directly over the first through via structure, and there is no conductive material directly below and in direct contact with the second via portion.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Kai Cheng, Tsung-Shu Lin, Tsung-Yu Chen, Hsien-Pin Hu, Wen-Hsin Wei
  • Adhesive tape cutter
    Patent number: 6799623
    Abstract: An adhesive tape cutter includes a control mechanism, an operation mechanism located on the control mechanism and a dispensing mechanism connecting to the control mechanism and located above the operation mechanism. The control mechanism has a protective mechanism, a wiper and a cutting mechanism. When the tape cutter is not in use, the protective mechanism is extended over the cutting mechanism outside the tape cutter to avoid hurting users.
    Type: Grant
    Filed: June 13, 2003
    Date of Patent: October 5, 2004
    Assignee: Tai-Ray Industries Ltd.
    Inventor: Wen-Shu Cheng