Patents by Inventor Wen-Ta Tsai
Wen-Ta Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240168254Abstract: An imaging lens assembly includes a lens barrel, optical lens elements, an annular retaining element and a nano-microstructure. The optical lens elements include at least one optical lens element disposed in the lens barrel. The annular retaining element is physically contacted with the optical lens element, and the annular retaining element includes an object-side surface, an image-side surface, an outer diameter surface and a light-through hole. The outer diameter surface is connected to the object-side surface and the image-side surface. The light-through hole is formed by gradually tapering from the object-side surface and the image-side surface towards the optical axis. The nano-microstructure has a plurality of irregular ridged convexes. The nano-microstructure is located between a lens barrel area defined via the lens barrel and a lens element area defined via the optical lens element on a direction vertical to the optical axis.Type: ApplicationFiled: November 15, 2023Publication date: May 23, 2024Inventors: Ssu-Hsin LIU, Heng-Yi SU, Liang-Chieh WENG, Wen-Yu TSAI, Ming-Ta CHOU
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Publication number: 20240134167Abstract: An optical path folding element includes a main body, a light absorption film layer and a matte structure. The main body has optical surface including an incident surface, a reflective surface and an emitting surface. A light enters into the optical folding element through the incident surface. The reflective surface reflects the light so as to change a traveling direction thereof. The light exits the optical folding element through the emitting surface. The light absorbing film layer is configured to reduce reflectance and provided adjacent to at least part of the optical surface, and the light absorbing film layer is in physical contact with the main body. The matte structure is disposed adjacent to at least part of the optical surface. The matte structure provides an undulating profile on a surface of the optical path folding element, and the matte structure is formed in one-piece with the main body.Type: ApplicationFiled: September 24, 2023Publication date: April 25, 2024Applicant: LARGAN PRECISION CO., LTD.Inventors: Ssu-Hsin LIU, Chen Wei FAN, Chien-Hsun WU, Wen-Yu TSAI, Ming-Ta CHOU
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Publication number: 20240111139Abstract: An imaging lens assembly module includes a lens barrel, a catadioptric lens assembly, an imaging lens assembly, a first fixing element and a second fixing element. The lens barrel has a first relying surface and a second relying surface, which face towards an object side of the imaging lens assembly module. The catadioptric lens assembly relies on the first relying surface. The imaging lens assembly is disposed on an image side of the catadioptric lens assembly, and relies on the second relying surface. The first fixing element is for fixing the catadioptric lens assembly to the lens barrel. The second fixing element is for fixing the imaging lens assembly to the lens barrel. The catadioptric lens assembly is for processing at least twice internal reflections of an image light in the imaging lens assembly module, and for providing optical refractive power.Type: ApplicationFiled: September 26, 2023Publication date: April 4, 2024Inventors: Lin-An CHANG, Chung Hao CHEN, Wen-Yu TSAI, Ming-Ta CHOU
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Publication number: 20240093373Abstract: A method for preparing antibacterial stainless steel by surface alloying includes the steps of coating an infiltration promoter layer on a stainless steel surface, coating an antibacterial metal layer on a surface of the infiltration promoter layer, and performing heat treatment of the stainless steel to diffuse an antibacterial metal into the stainless steel. This method can be applied to various types of stainless steel, and the antibacterial metal can be diffused and quenched into the stainless steel, such that the finally formed surface of the stainless steel has an antibacterial alloy layer with a specific thickness to provide better corrosion resistance and antibacterial ability without changing the advantages and properties of the antibacterial metal or stainless steel substrate, and the thickness and concentration of the antibacterial metal layer, and the parameters for heat treatment can be adjusted to control the chemical composition and thickness of the antibacterial alloy layer.Type: ApplicationFiled: November 16, 2022Publication date: March 21, 2024Inventors: WEN-TA TSAI, BERNARD HAOCHIH LIU, ZHI-YAN CHEN, CHONG-CHENG HUANG
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Publication number: 20240077657Abstract: An imaging lens assembly includes a first optical element and a low-reflection layer. The first optical element has a central opening, and includes a first surface, a second surface and a first outer diameter surface. The first outer diameter surface is connected to the first surface and the second surface. The low-reflection layer is located on at least one of the first surface and the second surface, and includes a carbon black layer, a nano-microstructure and a coating layer. The nano-microstructure is directly contacted with and connected to the carbon black layer, and the nano-microstructure is farther from the first optical element than the carbon black layer from the first optical element. The coating layer is directly contacted with and connected to the nano-microstructure, and the coating layer is farther from the first optical element than the nano-microstructure from the first optical element.Type: ApplicationFiled: November 13, 2023Publication date: March 7, 2024Inventors: Wen-Yu TSAI, Heng-Yi SU, Ming-Ta CHOU, Chien-Pang CHANG, Kuo-Chiang CHU
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Publication number: 20240077656Abstract: An imaging lens assembly includes a first optical element and a low-reflection layer. The first optical element has a central opening, and includes a first surface, a second surface and a first outer diameter surface. The first outer diameter surface is connected to the first surface and the second surface. The low-reflection layer is located on at least one of the first surface and the second surface, and includes a carbon black layer, a nano-microstructure and a coating layer. The nano-microstructure is directly contacted with and connected to the carbon black layer, and the nano-microstructure is farther from the first optical element than the carbon black layer from the first optical element. The coating layer is directly contacted with and connected to the nano-microstructure, and the coating layer is farther from the first optical element than the nano-microstructure from the first optical element.Type: ApplicationFiled: November 13, 2023Publication date: March 7, 2024Inventors: Wen-Yu TSAI, Heng-Yi SU, Ming-Ta CHOU, Chien-Pang CHANG, Kuo-Chiang CHU
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Patent number: 6903441Abstract: A semiconductor package and a fabrication method thereof are provided, in which a ground pad on a chip is electrically connected to a ground plane on a substrate by means of an electrically-conductive wall formed over a side surface of the chip and an electrically-conductive adhesive used for attaching the chip to the substrate. Therefore, a wire-bonding process is merely implemented for power pads and signal I/O (input/output) pads on the chip without having to form ground wires on the ground pads for electrical connection purposes. This benefit allows the use of a reduced number of bonding wires and simplifies wire arrangement or routability. And, a grounding path from the chip through the electrically-conductive wall and electrically-conductive adhesive to the substrate is shorter than the conventional one of using ground wires, thereby reducing a ground-bouncing effect and improving electrical performances of the semiconductor package.Type: GrantFiled: May 30, 2003Date of Patent: June 7, 2005Assignee: Siliconware Precision Industries, Ltd.Inventors: Chin Fa Wang, Wen-Ta Tsai, Yuan-Ping Joe
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Patent number: 6777266Abstract: A dual-chip integrated circuit package and a method for manufacturing such a dual-chip integrated circuit package are proposed, which can help prevent the occurrence of cracking and delamination in the chips and the occurrence of voids in the encapsulant during the manufacture process. The dual-chip integrated circuit package is constructed on a leadframe having a plurality of first leads and a plurality of second leads and at least a pair of support members between the first and second leads. Further, the dual-chip integrated circuit package includes at least one support member attached to the front side of the first integrated circuit chip for providing a support to the bonding pads on the second integrated circuit chip; the support member being not smaller in dimension than the area where the bonding pads on the second integrated circuit chip are located.Type: GrantFiled: May 19, 2003Date of Patent: August 17, 2004Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chieh-Ping Huang, Lian-Cherng Chiang, Wen-Ta Tsai
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Publication number: 20040070087Abstract: A semiconductor package and a fabrication method thereof are provided, in which a ground pad on a chip is electrically connected to a ground plane on a substrate by means of an electrically-conductive wall formed over a side surface of the chip and an electrically-conductive adhesive used for attaching the chip to the substrate. Therefore, a wire-bonding process is merely implemented for power pads and signal I/O (input/output) pads on the chip without having to form ground wires on the ground pads for electrical connection purposes. This benefit allows the use of a reduced number of bonding wires and simplifies wire arrangement or routability. And, a grounding path from the chip through the electrically-conductive wall and electrically-conductive adhesive to the substrate is shorter than the conventional one of using ground wires, thereby reducing a ground-bouncing effect and improving electrical performances of the semiconductor package.Type: ApplicationFiled: May 30, 2003Publication date: April 15, 2004Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: C. F. Wang, Wen-Ta Tsai, Yuan-Ping Joe
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Publication number: 20030197262Abstract: A dual-chip integrated circuit package and a method for manufacturing such a dual-chip integrated circuit package are proposed, which can help prevent the occurrence of cracking and delamination in the chips and the occurrence of voids in the encapsulant during the manufacture process. The dual-chip integrated circuit package is constructed on a leadframe having a plurality of first leads and a plurality of second leads and at least a pair of support members between the first and second leads. Further, the dual-chip integrated circuit package includes at least one support member attached to the front side of the first integrated circuit chip for providing a support to the bonding pads on the second integrated circuit chip; the support member being not smaller in dimension than the area where the bonding pads on the second integrated circuit chip are located.Type: ApplicationFiled: May 19, 2003Publication date: October 23, 2003Applicant: Siliconware Precision Industries Co., Ltd.Inventors: Chieh-Ping Huang, Lian-Cherng Chiang, Wen-Ta Tsai
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Patent number: D500607Type: GrantFiled: October 2, 2003Date of Patent: January 11, 2005Assignee: Zhejiang Himax Furniture Industry Corp. Ltd.Inventor: Wen-Ta Tsai
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Patent number: D512574Type: GrantFiled: April 20, 2004Date of Patent: December 13, 2005Assignee: Zhejiang Himax Furniture Industry Corp., Ltd.Inventor: Wen-Ta Tsai
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Patent number: D514831Type: GrantFiled: October 2, 2003Date of Patent: February 14, 2006Assignee: Zhejiang Himax Furniture Industry Corp., Ltd.Inventor: Wen-Ta Tsai
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Patent number: D514832Type: GrantFiled: October 2, 2003Date of Patent: February 14, 2006Assignee: Zhejiang Himax Furniture Industry Corp Ltd.Inventor: Wen-Ta Tsai
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Patent number: D516828Type: GrantFiled: July 2, 2004Date of Patent: March 14, 2006Assignee: Zhejiang Himax Furniture Industry Corp. Ltd.Inventor: Wen Ta Tsai
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Patent number: D537282Type: GrantFiled: October 26, 2005Date of Patent: February 27, 2007Assignee: Zhejiang Himax Furniture Industry Corp, Ltd.Inventor: Wen-Ta Tsai
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Patent number: D537283Type: GrantFiled: October 26, 2005Date of Patent: February 27, 2007Assignee: Zhejiang Himax Furniture Industry Corp. Ltd.Inventor: Wen-Ta Tsai
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Patent number: D538075Type: GrantFiled: October 26, 2005Date of Patent: March 13, 2007Assignee: Zhejiang Himax Furniture Industry Corp. Ltd.Inventor: Wen-Ta Tsai
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Patent number: D554877Type: GrantFiled: November 8, 2005Date of Patent: November 13, 2007Assignee: Zhejiang HiMax Furniture Industry Corp. Ltd.Inventor: Wen-Ta Tsai
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Patent number: D569116Type: GrantFiled: November 8, 2005Date of Patent: May 20, 2008Assignee: Zhejiang Himax Furniture Industry Corp. Ltd.Inventor: Wen-Ta Tsai