Abstract: A memory device is disclosed that includes a plurality of word lines and a plurality of memory cells operating in one of a plurality of modes and coupled to at least one of the word lines. The memory device also includes a plurality of reference lines and reference cells. Each reference cell corresponds to one of the operating modes, supplies a reference current for the corresponding mode, and is coupled to at least one of the reference lines. A reference cell current from a reference cell can also be compared to a target range and, if outside the target range, the voltage level on a corresponding reference line can be adjusted accordingly such that the reference current falls within the target range (i.e., reference current trimming).

Abstract: A test socket, adapted for electrically connecting an IC package to a printed circuit board, comprises a bottom board (10) and four separated clumps (20). The bottom board has a main body (11) having a rectangular shape and four mounting portions (12) integrally extending outwardly from four corners of the main body, respectively. The clumps are assembled upon the four mounting portions of the bottom board to cooperate with the bottom board to define a receiving space for receiving the IC package.

Abstract: A socket connector (100) comprises a socket body (5), a plurality of contacts (3) received in the socket body (5), a lid (1) movably mounted on the socket body (5) and moving up and down along a vertical direction, a moving plate (4) movably mounted upon the socket body (5) and moving along a horizontal direction and an operating lever (2) located between the lid (1) and the moving plate (4), the operating lever (2) comprises a press member (22), the press member (22) presses on the top surface of the moving plate (4) to prevent the floating of the moving plate (4) in the vertical direction.

Abstract: An optical board (100) includes a base layer (1), an optical module (4) assembled to the base layer, and an optical layer (2) attached to the base layer and defining a receiving recess (23). The optical module includes a ferrule (41) received in the receiving recess and defining a number of grooves (4131), and a number of optical circuits (42) positioned in the grooves of the ferrule. The optical circuits extend outside of the ferrule and into the optical layer.

Abstract: A photoelectric connection assembly includes a circuit board defining conductive pads on a first surface thereof and waveguides embedded therein, an electrical connector assembled to the circuit board and a light transmission module. The electrical connector includes a seat defining a first receiving cavity for receiving the conversion module and a second receiving cavity below the first receiving cavity, a cover rotatably associated with a rear end of the seat and rotating to shield the first receiving cavity and conductive terminals loaded on the seat. The terminals include contacting portions extending in the first receiving cavity for electrical connection with the conversion module and leg portions connecting with the conductive pads. The light transmission module is received in the second receiving cavity and includes conversion module.

Abstract: An electrical connector (100) for electrically connecting a Central Processing Unit (CPU) with a Printed Circuit Board (PCB), includes a base (2), a plurality of insulative layers (34), a plurality of contacts (4) and a plurality of cams (33). The base defines a cavity (21) and the insulative layers are stacked and received in the cavity. The insulative layers define a plurality of passageways therein. The contacts are received in the passageways of the insulative layers. The cams are rotatable around to push different insulative layers to have different degrees of movement in a predetermined direction.

Abstract: A contact for a burn-in socket electrically connecting an IC package and a printed circuit board, comprises a first contact, a second contact and a spring disposed between the first contact and the second contact. The first contact and the second contacts have a same configuration, and each contact has a U-shaped actuating portion with two legs and a conductive portion extending from one of the legs. The first contact and the second contact are orthogonally assembled together, and the first actuating portion bestrides the second actuating portion to clasp with second actuating portion, so that the conductive portions have an offset therebetween.

Abstract: A photoelectric connector assembly includes a first lens member connecting with fiber cables and defining convex lenses opposite to fiber cables, a connector and a substrate embedded with waveguides. The connector defines a mating cavity running through a front face thereof and inserted with said first lens member. The connector includes terminals with contacting sections exposing to the mating cavity, a second lens members. The second lens member is located at back of the first lens member and defines first convex lenses at a front face thereof and second convex lenses at a rear face thereof. The first convex lenses are coupled with the convex lens of the first lens member. The substrate defines light ports at free ends of the waveguides. The substrate is seated with the connector and the light ports are coupled with the second convex lenses of the second lens member.

Abstract: A manufacture method of a non-spherical lens module includes: firstly, forming a housing having a row of through holes running through a first surface and a second surface thereof; secondly, providing and filling liquid waveguide with the through holes and forming two convex portions at jointing positions of the through holes and said two surfaces respectively; lastly, cooling the liquid waveguide to form the waveguide in the through hole, cooling the two convex portions to form first and second lens portions.

Abstract: A burn-in socket for receiving an IC package comprises a socket body, a plurality of contacts mounted in the socket body and an actuator movably mounted upon the socket body. Each contact in the socket body includes a pair of clipping arms with tip portions at free ends thereof respectively. Solder balls attached to the bottom of the IC package are respectively clipped between the pair of the tip portions and thus the IC package should be brought into electrical contact with the contacts of the burn-in socket. The tip portion is plated with a Pd—Co layer for reducing the attachment of the Sn and preventing the impedance of the contacts to increase. Meanwhile, the IC package can be sucked up successfully without absorption from the contacts of the burn-in socket.

Abstract: A photoelectric connector assembly includes a first and a second connector and a photoelectric signal conversion module. The first connector defines a mating cavity, first terminals including contacting sections exposing to the mating cavity and a first light transmission module including convex lenses at a front thereof exposing to the mating cavity and first light ports at a rear thereof The second connector includes an insulating seat and second terminals. The seat defines a rear mating end loading the second terminals and a receiving cavity opening upwards. The conversion module is inserted in the receiving cavity and includes second light ports coupled with the first light ports of the first light transmission module and conductive pads touching with the second terminal.

Abstract: A test socket, adapted for connecting the semiconductor package and a printed circuit board comprises a base and a plurality of contacts received in the base. The base has a retaining board defining a plurality of first receiving holes and a positioning board defining a plurality of second receiving holes. The contacts has a contacting portion, an elastic portion and a retaining portion, the elastic portion is disposed between the retaining board and the positioning board and protruding rightward, and the contacting portion extends beyond the elastic portion and defines a acute angle with a horizontal line in a right hand before contacting with the semiconductor package to prevent the contacting portion from scratching with the left inner sidewall of the second receiving hole when pushed downward by the semiconductor package and rotating leftward.

Abstract: A socket assembly has a socket and a heat sink module detachably mounted on the socket. The socket has a base, a sliding board mounted on the base, a lid disposed upon the base and an actuator disposed between the base and the cover. The heat sink module has a fastening frame surrounding the base, a cover pivotally assembled to an end of the fastening frame and a heat sink mounted on the cover. The cover has a latching portion which latches with a top wall of the lid when the cover rotates to a closed position. The heat sink is brought by the cover to pass an open defined on the lid and to abut against an IC package seating on the sliding board.

Abstract: An optical fiber connector includes a lens member integrally forming pairs of lens at a front face thereof, a seat member assembly retained on a rear face of the lens member and fiber cables. The seat member defines slim grooves aligned with the lens and the fiber cables are received and retained in the slim grooves.

Abstract: An optical fiber connector includes a mating portion defining a coupled direction and including pairs of lenses and a pair of guiding portions. The pair of guiding portions each defines a guiding hole through a front face thereof in the coupled direction. Each guiding hole has a cross section of a polygon shape in the coupled direction and is configured with an imaginary circle perpendicular to the coupled direction.

Abstract: A socket connector comprises an insulating base receiving a plurality of contacts, a movable frame assembled to the insulating base, at least one latch device pivotally assembled to the insulating base, and at least one actuating member corresponding to the latch device and retained on a sidewall of the movable frame. The at least one actuating member includes a driving portion disposed at inner edge of the sidewall of the movable frame and extending downwardly. The movable frame is able to move up and down relative to the insulating base. Each latch device includes a latching member having a pressing portion with a cuneiform outside surface. When the actuating member moves up and down together with the movable frame, the driving portion of the actuating member pushes the cuneiform outside surface of the pressing portion of the latch device to shift between a closed position and an opened position.

Abstract: An optical fiber connector includes a pair of optical fibers and a seat defining a pair of lenses at a front edge thereof and passageways aligned with the lenses respectively and receiving the optical fibers. The seat defines a pair of first apertures at a first surface thereof communicating with the passageways, and a pair of second aperture at a second surface thereof opposite to the first surface communicating with the passageways. Rear insides of the first apertures are aligned with front insides of the second apertures.

Abstract: An IC socket includes a base receiving a number of contacts, a lid mounted upon the base, and at least one latch mounted in the base. The lid is able to be operated between a first position away from the base and a second position adjacent to the base. The latch is driven by the lid to open and close. At least one stopper is disposed on the lid and extends into a recess defined on the latch to lock with latch the latch when the lid located at the first position for preventing the lid from dropping from the base.

Abstract: A socket connector includes a socket body, a moving plate movably mounted upon the socket body, and an actuating mechanism. The actuating mechanism comprises a lid, a first operating lever, and a second operating lever. The first and second operating levers are disposed between the lid and moving plate with opposite tilted angles. The first operating lever has a cam section engaged with a bearing section formed on the moving plate so as to drive the moving plate to move in a substantially horizontal direction.

Abstract: An IC socket for receiving an IC package comprises a socket body for carrying the IC package. A plurality of contacts are received in the socket body for electrical connection with the IC package. A driving member is mounted upon the socket body and able to operate between an upper position and a lower position. At least one latch device comprises an upper section, a lower section parallel to the upper section and a regulator. The regular links the upper section and the lower section and force the lower section to move relative to the upper section.