Patents by Inventor Wen-Ying Tsai

Wen-Ying Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170457
    Abstract: A method includes bonding a first wafer to a second wafer, with a first plurality of dielectric layers in the first wafer and a second plurality of dielectric layers in the second wafer bonded between a first substrate of the first wafer and a second substrate in the second wafer. A first opening is formed in the first substrate, and the first plurality of dielectric layers and the second wafer are etched through the first opening to form a second opening. A metal pad in the second plurality of dielectric layers is exposed to the second opening. A conductive plug is formed extending into the first and the second openings.
    Type: Application
    Filed: January 29, 2024
    Publication date: May 23, 2024
    Inventors: Cheng-Ying Ho, Jeng-Shyan Lin, Wen-I Hsu, Feng-Chi Hung, Dun-Nian Yaung, Ying-Ling Tsai
  • Patent number: 11923338
    Abstract: A method includes bonding a first wafer to a second wafer, with a first plurality of dielectric layers in the first wafer and a second plurality of dielectric layers in the second wafer bonded between a first substrate of the first wafer and a second substrate in the second wafer. A first opening is formed in the first substrate, and the first plurality of dielectric layers and the second wafer are etched through the first opening to form a second opening. A metal pad in the second plurality of dielectric layers is exposed to the second opening. A conductive plug is formed extending into the first and the second openings.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Ying Ho, Jeng-Shyan Lin, Wen-I Hsu, Feng-Chi Hung, Dun-Nian Yaung, Ying-Ling Tsai
  • Patent number: 4265402
    Abstract: A head (12) for incorporation in a strobed liquid display is disclosed. The head comprises a housing (30) defining a chamber (38), the housing (30) having an inlet opening (39) for connection to a liquid supply, a top wall (32) having a vent (42), a bottom wall (34) having a plurality of apertures (44) spaced from and distributed about the center thereof for accommodating the outflow of liquid droplets from the chamber (38), and a sidewall (36) extending between the top and bottom walls (32, (34). The head (12) also includes a vibrating device rigidly connected to the housing (30) for imparting a periodic wobble thereto for dispensing the droplets through the apertures (44) in sequential fashion with substantially uniform spacing between successive droplets dispensed through each aperture (44), whereby the dispensed droplets substantially define a helix. A strobe liquid display system (10) incorporating the head (12) is also disclosed.
    Type: Grant
    Filed: July 13, 1979
    Date of Patent: May 5, 1981
    Inventor: Wen-Ying Tsai