Patents by Inventor WEN-YUAN CHOU

WEN-YUAN CHOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170050263
    Abstract: A friction stir welding device, provided for welding stacked metallic boards together, includes a mounting seat and a plurality of friction-stir tools. The mounting seat is defined with a rotational axis-direction. Each friction-stir tool has a shoulder portion and a stirring probe protruded from the shoulder portion. The friction-stir tools are arranged in the rotational axis-direction and disposed on a bottom surface of the mounting seat. The friction-stir tools can rotate along the rotational axis-direction. When a relative linear motion is applied between the friction-stir tools and the stacked metallic boards, the shoulders of the friction-stir tools produce stirring-coverage zones which are overlapped partially along the linear movement direction, so that the stirring-coverage zones by the friction-stir tools form a planar welding zone. The present disclosure also provides a method of friction stir welding for welding stacked metallic boards together.
    Type: Application
    Filed: August 21, 2015
    Publication date: February 23, 2017
    Inventors: CHUN-LUNG WU, MING-SIAN LIN, WEN-YUAN CHOU
  • Publication number: 20170055373
    Abstract: A heat-dissipating device includes a base and a plurality of heat-dissipating members. The base is formed with a plurality of joint holes. Each heat-dissipating member has an inserting section and an exposed section connected with the inserting section. The inserting sections are inserted into the joint holes in a close fit manner, respectively. The exposed sections are exposed outside a top surface of the base. The ends of the inserting sections and the bottom surface of the base are welded by a friction stir welding (FSW) manner with a solid-state joining structure. The present disclosure also provides a method for manufacturing a heat-dissipating device, which joins the ends of the inserting sections and the bottom surface of the base by a friction stir welding manner.
    Type: Application
    Filed: August 19, 2015
    Publication date: February 23, 2017
    Inventors: CHUN-LUNG WU, MING-SIAN LIN, WEN-YUAN CHOU