Patents by Inventor Wendell Stuber

Wendell Stuber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Controlled-grain-precious metal sputter targets
    Patent number: 7740723
    Abstract: A precious metal sputter target has a composition selected from the group consisting of platinum, palladium, rhodium, iridium, ruthenium, osmium and single-phase alloys thereof. The sputter target's grain structure is at least about 99 percent recrystallized and has a grain size of less than about 200 ?m for improving sputter uniformity. The cryogenic method for producing these sputter targets is also effective for improving sputter performance for silver an gold sputter targets.
    Type: Grant
    Filed: May 17, 2007
    Date of Patent: June 22, 2010
    Assignee: Praxair S.T. Technology, Inc
    Inventors: Andrew C. Perry, Paul S. Gilman, Wendell Stuber, Binu Mathew
  • Controlled-grain-precious metal sputter targets
    Publication number: 20080017282
    Abstract: A precious metal sputter target has a composition selected from the group consisting of platinum, palladium, rhodium, iridium, ruthenium, osmium and single-phase alloys thereof. The sputter target's grain structure is at least about 99 percent recrystallized and has a grain size of less than about 200 ?m for improving sputter uniformity. The cryogenic method for producing these sputter targets is also effective for improving sputter performance-for silver an gold sputter targets.
    Type: Application
    Filed: May 17, 2007
    Publication date: January 24, 2008
    Inventors: Andrew Perry, Paul Gilman, Wendell Stuber, Binu Mathew
  • Controlled-grain-precious metal sputter targets
    Patent number: 7235143
    Abstract: A precious metal sputter target has a composition selected from the group consisting of platinum, palladium, rhodium, iridium, ruthenium, osmium and single-phase alloys thereof. The sputter target's grain structure is at least about 99 percent recrystallized and has a grain size of less than about 200 ?m for improving sputter uniformity. The cryogenic method for producing these sputter targets is also effective for improving sputter performance for silver and gold sputter targets.
    Type: Grant
    Filed: August 8, 2002
    Date of Patent: June 26, 2007
    Assignee: Praxair S.T. Technology, Inc.
    Inventors: Andrew C. Perry, Paul S. Gilman, Wendell Stuber, Binu Mathew
  • Controlled-grain-precious metal sputter targets
    Publication number: 20040025986
    Abstract: A precious metal sputter target has a composition selected from the group consisting of platinum, palladium, rhodium, iridium, ruthenium, osmium and single-phase alloys thereof. The sputter target's grain structure is at least about 99 percent recrystallized and has a grain size of less than about 200 &mgr;m for improving sputter uniformity. The cryogenic method for producing these sputter targets is also effective for improving sputter performance for silver and gold sputter targets.
    Type: Application
    Filed: August 8, 2002
    Publication date: February 12, 2004
    Inventors: Andrew C. Perry, Paul S. Gilman, Wendell Stuber, Binu Mathew