Patents by Inventor Wendy Eng

Wendy Eng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modified lead frame for improved parallelism of a die to package
    Patent number: 6239480
    Abstract: A structure and method are provided to allow a die to be packaged more uniformly and in parallel with a package by utilizing a lead frame having at least one cavity within the lead frame, thereby allowing excess die-attach epoxy can flow into the cavity or cavities and reducing the amount of contact surface area between the die and lead frame.
    Type: Grant
    Filed: July 6, 1998
    Date of Patent: May 29, 2001
    Assignee: Clear Logic, Inc.
    Inventors: John MacPherson, Wendy Eng
  • Method of improving parallelism of a die to package using a modified lead frame
    Patent number: 6235556
    Abstract: A structure and method are provided to allow a die to be packaged more uniformly and in parallel with a package by utilizing a lead frame having at least one cavity within the lead frame, thereby allowing excess die-attach epoxy can flow into the cavity or cavities and reducing the amount of contact surface area between the die and lead frame.
    Type: Grant
    Filed: September 4, 1998
    Date of Patent: May 22, 2001
    Assignee: Clear Logic, Inc.
    Inventors: John MacPherson, Wendy Eng
  • Method of improving parallelism of a die to package using a modified lead frame
    Publication number: 20010000210
    Abstract: A structure and method are provided to allow a die to be packaged more uniformly and in parallel with a package by utilizing a lead frame having at least one cavity within the lead frame, thereby allowing excess die-attach epoxy can flow into the cavity or cavities and reducing the amount of contact surface area between the die and lead frame.
    Type: Application
    Filed: December 6, 2000
    Publication date: April 12, 2001
    Inventors: John MacPherson, Wendy Eng