Patents by Inventor Weng-Chu Chu

Weng-Chu Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190143705
    Abstract: An ink container for photo-curable ink is disclosed, comprising a plurality of walls, the walls forming a closed space to be filled with UV photo-curable ink; the walls are non-transparent filter plates, but have light transmittance property, in a color scheme of yellow or orange, i.e., hue number of 3-8 in the PCCS hue circle, able to shield off the UV, the light transmittance property of the walls allows observing liquid level inside the ink container after filling with the UV photo-curable ink.
    Type: Application
    Filed: March 20, 2018
    Publication date: May 16, 2019
    Inventors: YI-CHING LU, WENG-CHU CHU, YUN-HSUAN CHEN, CHUN-SHENG CHENG
  • Patent number: 9111957
    Abstract: A semiconductor structure includes a substrate, a first well region of a first conductivity type overlying the substrate, a second well region of a second conductivity type opposite the first conductivity type overlying the substrate, a cushion region between and adjoining the first and the second well regions, an insulation region in a portion of the first well region and extending from a top surface of the first well region into the first well region, a gate dielectric extending from over the first well region to over the second well region, wherein the gate dielectric has a portion over the insulation region, and a gate electrode on the gate dielectric.
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: August 18, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsueh-Liang Chou, Chen-Bau Wu, Weng-Chu Chu, Tsung-Yi Huang, Fu-Jier Fan
  • Publication number: 20140045304
    Abstract: A semiconductor structure includes a substrate, a first well region of a first conductivity type overlying the substrate, a second well region of a second conductivity type opposite the first conductivity type overlying the substrate, a cushion region between and adjoining the first and the second well regions, an insulation region in a portion of the first well region and extending from a top surface of the first well region into the first well region, a gate dielectric extending from over the first well region to over the second well region, wherein the gate dielectric has a portion over the insulation region, and a gate electrode on the gate dielectric.
    Type: Application
    Filed: September 18, 2013
    Publication date: February 13, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsueh-Liang Chou, Chen-Bau Wu, Weng-Chu Chu, Tsung-Yi Huang, Fu-Jier Fan
  • Patent number: 8592923
    Abstract: A semiconductor structure includes a substrate, a first well region of a first conductivity type overlying the substrate, a second well region of a second conductivity type opposite the first conductivity type overlying the substrate, a cushion region between and adjoining the first and the second well regions, an insulation region in a portion of the first well region and extending from a top surface of the first well region into the first well region, a gate dielectric extending from over the first well region to over the second well region, wherein the gate dielectric has a portion over the insulation region, and a gate electrode on the gate dielectric.
    Type: Grant
    Filed: October 24, 2011
    Date of Patent: November 26, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsueh-Liang Chou, Chen-Bau Wu, Weng-Chu Chu, Tsung-Yi Huang, Fu-Jier Fan
  • Publication number: 20120037987
    Abstract: A semiconductor structure includes a substrate, a first well region of a first conductivity type overlying the substrate, a second well region of a second conductivity type opposite the first conductivity type overlying the substrate, a cushion region between and adjoining the first and the second well regions, an insulation region in a portion of the first well region and extending from a top surface of the first well region into the first well region, a gate dielectric extending from over the first well region to over the second well region, wherein the gate dielectric has a portion over the insulation region, and a gate electrode on the gate dielectric.
    Type: Application
    Filed: October 24, 2011
    Publication date: February 16, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsueh-Liang Chou, Chen-Bau Wu, Weng-Chu Chu, Tsung-Yi Huang, Fu-Jier Fan
  • Patent number: 8049295
    Abstract: A semiconductor structure includes a substrate, a first well region of a first conductivity type overlying the substrate, a second well region of a second conductivity type opposite the first conductivity type overlying the substrate, a cushion region between and adjoining the first and the second well regions, an insulation region in a portion of the first well region and extending from a top surface of the first well region into the first well region, a gate dielectric extending from over the first well region to over the second well region, wherein the gate dielectric has a portion over the insulation region, and a gate electrode on the gate dielectric.
    Type: Grant
    Filed: September 21, 2010
    Date of Patent: November 1, 2011
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsueh-Liang Chou, Chen-Bau Wu, Weng-Chu Chu, Tsung-Yi Huang, Fu-Jier Fan
  • Patent number: 8000041
    Abstract: According to an embodiment of the present invention, a lens module is provided, which includes a first lens assembly including a first patterned substrate, a first recess formed from a first surface of the first patterned substrate, a first lens element disposed in the first recess, and a second lens element disposed on the first patterned substrate, wherein the second lens element aligns along an optical axis through the first lens element.
    Type: Grant
    Filed: September 20, 2010
    Date of Patent: August 16, 2011
    Assignees: VisEra Technologies Company Limited, OmniVision Technologies, Inc.
    Inventors: Chien-Pang Lin, San-Yuan Chung, Weng-Chu Chu
  • Patent number: 7888767
    Abstract: A semiconductor structure includes a first high-voltage well (HVW) region of a first conductivity type overlying a substrate, a second HVW region of a second conductivity type opposite the first conductivity type overlying the substrate and laterally adjoining the first HVW region, and a third HVW region of the second conductivity type underlying the second HVW region. A region underlying the first HVW region is substantially free from the third HVW region, wherein the third HVW region has a bottom lower than a bottom of the first HVW region. The semiconductor structure further includes an insulation region in a portion and extending from a top surface of the first HVW region into the first HVW region, a gate dielectric extending from over the first HVW region to over the second HVW region wherein the gate dielectric has a portion over the insulation region, and a gate electrode on the gate dielectric.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: February 15, 2011
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kun-Ming Huang, Hsueh-Liang Chou, Weng-Chu Chu, Chen-Bau Wu
  • Publication number: 20110006366
    Abstract: A semiconductor structure includes a substrate, a first well region of a first conductivity type overlying the substrate, a second well region of a second conductivity type opposite the first conductivity type overlying the substrate, a cushion region between and adjoining the first and the second well regions, an insulation region in a portion of the first well region and extending from a top surface of the first well region into the first well region, a gate dielectric extending from over the first well region to over the second well region, wherein the gate dielectric has a portion over the insulation region, and a gate electrode on the gate dielectric.
    Type: Application
    Filed: September 21, 2010
    Publication date: January 13, 2011
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsueh-Liang Chou, Chen-Bau Wu, Weng-Chu Chu, Tsung-Yi Huang, Fu-Jier Fan
  • Patent number: 7816214
    Abstract: A semiconductor structure includes a substrate, a first well region of a first conductivity type overlying the substrate, a second well region of a second conductivity type opposite the first conductivity type overlying the substrate, a cushion region between and adjoining the first and the second well regions, an insulation region in a portion of the first well region and extending from a top surface of the first well region into the first well region, a gate dielectric extending from over the first well region to over the second well region, wherein the gate dielectric has a portion over the insulation region, and a gate electrode on the gate dielectric.
    Type: Grant
    Filed: January 29, 2009
    Date of Patent: October 19, 2010
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsueh-Liang Chou, Chen-Bau Wu, Weng-Chu Chu, Tsung-Yi Huang, Fu-Jier Fan
  • Publication number: 20090142898
    Abstract: A semiconductor structure includes a substrate, a first well region of a first conductivity type overlying the substrate, a second well region of a second conductivity type opposite the first conductivity type overlying the substrate, a cushion region between and adjoining the first and the second well regions, an insulation region in a portion of the first well region and extending from a top surface of the first well region into the first well region, a gate dielectric extending from over the first well region to over the second well region, wherein the gate dielectric has a portion over the insulation region, and a gate electrode on the gate dielectric.
    Type: Application
    Filed: January 29, 2009
    Publication date: June 4, 2009
    Inventors: Hsueh-Liang Chou, Chen-Bau Wu, Weng-Chu Chu, Tsung-Yi Huang, Fu-Jier Fan
  • Publication number: 20080211026
    Abstract: A semiconductor structure includes a substrate, a first well region of a first conductivity type overlying the substrate, a second well region of a second conductivity type opposite the first conductivity type overlying the substrate, a cushion region between and adjoining the first and the second well regions, an insulation region in a portion of the first well region and extending from a top surface of the first well region into the first well region, a gate dielectric extending from over the first well region to over the second well region, wherein the gate dielectric has a portion over the insulation region, and a gate electrode on the gate dielectric.
    Type: Application
    Filed: November 8, 2006
    Publication date: September 4, 2008
    Inventors: Hsueh-Liang Chou, Chen-Bau Wu, Weng-Chu Chu, Tsung-Yi Huang, Fu-Jier Fan
  • Publication number: 20080017948
    Abstract: A semiconductor structure includes a first high-voltage well (HVW) region of a first conductivity type overlying a substrate, a second HVW region of a second conductivity type opposite the first conductivity type overlying the substrate and laterally adjoining the first HVW region, and a third HVW region of the second conductivity type underlying the second HVW region. A region underlying the first HVW region is substantially free from the third HVW region, wherein the third HVW region has a bottom lower than a bottom of the first HVW region. The semiconductor structure further includes an insulation region in a portion and extending from a top surface of the first HVW region into the first HVW region, a gate dielectric extending from over the first HVW region to over the second HVW region wherein the gate dielectric has a portion over the insulation region, and a gate electrode on the gate dielectric.
    Type: Application
    Filed: October 26, 2006
    Publication date: January 24, 2008
    Inventors: Kun-Ming Huang, Hsueh-Liang Chou, Weng-Chu Chu, Chen-Bau Wu