Patents by Inventor Weng-Jin Wu
Weng-Jin Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240120355Abstract: Implementations of a cover for an image sensor may include an optically transmissive portion and a black mask layer applied as a strip adjacent a perimeter of a largest planar surface of the optically transmissive portion. The first edge of the strip closest to the perimeter may be separated from the perimeter by a predetermined distance.Type: ApplicationFiled: September 25, 2023Publication date: April 11, 2024Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Gregg BARDEL, Shih-Chang TAI, Shunsuke YASUDA, Weng-Jin WU
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Publication number: 20240030265Abstract: In a general aspect, a package includes an optical sensor die fabricated in a semiconductor wafer. The optical sensor die has an optically active area on a front side of the semiconductor wafer generating a raw image signal. A transparent cover attached to the front side of the semiconductor wafer above the optically active area of the optical sensor die. An image signal processor (ISP) die processing the raw image signal is embedded in a layer of molding material attached to a back side the semiconductor wafer opposite the front side of the semiconductor wafer.Type: ApplicationFiled: July 21, 2022Publication date: January 25, 2024Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Weng-Jin WU
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Patent number: 11605659Abstract: According to an aspect, a sensor packaging structure includes a sensor die having a first surface and a second surface opposite the first surface, where the sensor die defines a sensor edge disposed between the first surface and the second surface. The sensor packaging structure includes a bonding material having a first surface and a second surface opposite the second surface, where the bonding material defines a bonding material edge disposed between the first surface of the bonding material and the second surface of the bonding material. The sensor packaging structure includes a transparent material, where the bonding material couples the sensor die to the transparent material. The sealing material is disposed on an interface between the sensor die and the bonding material, and at least one of a portion of the sensor edge or a portion of the bonding material edge.Type: GrantFiled: December 10, 2020Date of Patent: March 14, 2023Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Weng-Jin Wu
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Publication number: 20230063200Abstract: A method includes disposing a sheet of glass on a front side of a semiconductor substrate that includes at least one image sensor die, attaching the sheet of glass to the at least one image sensor die by a bead of adhesive material disposed on an edge of the at least one image sensor die, and sawing the semiconductor substrate from a back side to form a trench along a side of the at least one image sensor die. The trench extends through a thickness of the semiconductor substrate and through a part of a thickness of the sheet of glass. The method further includes filling the trench with a molding material to form a layer of molding material on a sidewall of the at least one image sensor die, and singulating the semiconductor substrate to isolate an individual image sensor package enclosing the at least one image sensor die.Type: ApplicationFiled: August 25, 2022Publication date: March 2, 2023Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Weng-Jin WU, Yusheng LIN
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Patent number: 11508776Abstract: An image sensor semiconductor package (package) includes a printed circuit board (PCB) having a first surface and a second surface opposite the first surface. A complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die has a first surface with a photosensitive region and a second surface opposite the first surface of the CIS die. The second surface of the CIS die is coupled with the first surface of the PCB. A transparent cover is coupled over the photosensitive region of the CIS die. An image signal processor (ISP) is embedded within the PCB. One or more electrical couplers electrically couple the CIS die with the PCB. A plurality of electrical contacts on the second surface of the PCB are electrically coupled with the CIS die and with the ISP. The ISP is located between the plurality of electrical contacts of the second surface of the PCB and the CIS die.Type: GrantFiled: April 3, 2019Date of Patent: November 22, 2022Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Larry Kinsman, Yusheng Lin, Yu-Te Hsieh, Oswald Skeete, Weng-Jin Wu, Chi-Yao Kuo
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Patent number: 11508766Abstract: Implementations of a molded image sensor chip scale package may include an image sensor having a first side and a second side. A first cavity wall and a second cavity wall may be coupled to the first side of the image sensor and extend therefrom. The first cavity wall and the second cavity wall may form a cavity over the image sensor. A transparent layer may be coupled to the first cavity wall and the second cavity wall. A redistribution layer (RDL) may be coupled to the second side of the image sensor. At least one interconnect may be directly coupled to the RDL. A mold material may encapsulate a portion of the RDL, a portion of the image sensor, and a side of each cavity wall, and a portion of the transparent layer.Type: GrantFiled: January 29, 2021Date of Patent: November 22, 2022Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Weng-Jin Wu
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Publication number: 20220216256Abstract: According to an aspect, an image sensor package includes a transparent member, a substrate, and an interposer disposed between and coupled to the transparent member and the substrate, where the interposer defines a first cavity area and a second cavity area. The image sensor package includes an image sensor die disposed within the first cavity area of the interposer, where the image sensor die has a sensor array configured to receive light through the transparent member and the second cavity area. The image sensor package includes a bonding material that couples the image sensor die to the interposer within the first cavity area.Type: ApplicationFiled: March 25, 2022Publication date: July 7, 2022Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Weng-Jin WU
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Patent number: 11289522Abstract: According to an aspect, an image sensor package includes a transparent member, a substrate, and an interposer disposed between and coupled to the transparent member and the substrate, where the interposer defines a first cavity area and a second cavity area. The image sensor package includes an image sensor die disposed within the first cavity area of the interposer, where the image sensor die has a sensor array configured to receive light through the transparent member and the second cavity area. The image sensor package includes a bonding material that couples the image sensor die to the interposer within the first cavity area.Type: GrantFiled: July 9, 2019Date of Patent: March 29, 2022Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Weng-Jin Wu
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Patent number: 11201182Abstract: An embedded image sensor package including a transparent cover having a first side and an opposing second side. A first layer couples over the second side of the transparent cover and has an opening. An electrically conductive layer couples in or over the first layer and electrically couples with one or more electrical contacts exposed on an outer surface of the package. An image sensor chip having a first side with an image sensor and an opposing second side electrically couples with the electrically conductive layer at the first side of the image sensor chip. The image sensor chip couples over the first layer so the first side of the image sensor chip faces the second side of the transparent cover through the opening. The image sensor chip, first layer, and transparent cover at least partially define a cavity hermetically sealed using an underfill material. The package includes no wirebonds.Type: GrantFiled: May 28, 2020Date of Patent: December 14, 2021Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Weng-Jin Wu
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Publication number: 20210151488Abstract: Implementations of a molded image sensor chip scale package may include an image sensor having a first side and a second side. A first cavity wall and a second cavity wall may be coupled to the first side of the image sensor and extend therefrom. The first cavity wall and the second cavity wall may form a cavity over the image sensor. A transparent layer may be coupled to the first cavity wall and the second cavity wall. A redistribution layer (RDL) may be coupled to the second side of the image sensor. At least one interconnect may be directly coupled to the RDL. A mold material may encapsulate a portion of the RDL, a portion of the image sensor, and a side of each cavity wall, and a portion of the transparent layer.Type: ApplicationFiled: January 29, 2021Publication date: May 20, 2021Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Weng-Jin WU
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Publication number: 20210143199Abstract: Implementations of semiconductor packages may include: a semiconductor device included within a cavity within a glass block. The package may also include a substrate coupled with a first side of the semiconductor device and two or more edges of the glass block. A fill material may be included between the substrate and the second conductor device and an opaque material may be between a side surface of the semiconductor device and an inner surface of the cavity. The opaque material may be configured to block light from contacting the side surface of the semiconductor device.Type: ApplicationFiled: January 25, 2021Publication date: May 13, 2021Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Weng-Jin WU
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Patent number: 11004832Abstract: A method of manufacturing a semiconductor substrate structure for use in a semiconductor substrate stack system is presented. The method includes a semiconductor substrate which includes a front-face, a backside, a bulk layer, an interconnect layer that includes a plurality of inter-metal dielectric layers sandwiched between conductive layers, a contact layer that is between the bulk layer and the interconnect layer, and a TSV structure commencing between the bulk layer and the contact layer and terminating at the backside of the substrate. The TSV structure is electrically coupled to the interconnect layer and the TSV structure is electrically coupled to a bonding pad on the backside.Type: GrantFiled: December 19, 2019Date of Patent: May 11, 2021Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hung-Pin Chang, Weng-Jin Wu, Wen-Chih Chiou, Chen-Hua Yu
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Publication number: 20210098518Abstract: According to an aspect, a sensor packaging structure includes a sensor die having a first surface and a second surface opposite the first surface, where the sensor die defines a sensor edge disposed between the first surface and the second surface. The sensor packaging structure includes a bonding material having a first surface and a second surface opposite the second surface, where the bonding material defines a bonding material edge disposed between the first surface of the bonding material and the second surface of the bonding material. The sensor packaging structure includes a transparent material, where the bonding material couples the sensor die to the transparent material. The sealing material is disposed on an interface between the sensor die and the bonding material, and at least one of a portion of the sensor edge or a portion of the bonding material edge.Type: ApplicationFiled: December 10, 2020Publication date: April 1, 2021Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Weng-Jin Wu
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Patent number: 10910421Abstract: Implementations of a molded image sensor chip scale package may include an image sensor having a first side and a second side. A first cavity wall and a second cavity wall may be coupled to the first side of the image sensor and extend therefrom. The first cavity wall and the second cavity wall may form a cavity over the image sensor. A transparent layer may be coupled to the first cavity wall and the second cavity wall. A redistribution layer (RDL) may be coupled to the second side of the image sensor. At least one interconnect may be directly coupled to the RDL. A mold material may encapsulate a portion of the RDL, a portion of the image sensor, and a side of each cavity wall, and a portion of the transparent layer.Type: GrantFiled: April 19, 2018Date of Patent: February 2, 2021Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Weng-Jin Wu
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Patent number: 10903255Abstract: Implementations of semiconductor packages may include: a semiconductor device included within a cavity within a glass block. The package may also include a substrate coupled with a first side of the semiconductor device and two or more edges of the glass block. A fill material may be included between the substrate and the second conductor device and an opaque material may be between a side surface of the semiconductor device and an inner surface of the cavity. The opaque material may be configured to block light from contacting the side surface of the semiconductor device.Type: GrantFiled: November 8, 2018Date of Patent: January 26, 2021Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Weng-Jin Wu
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Patent number: 10868061Abstract: According to an aspect, a sensor packaging structure includes a sensor die having a first surface and a second surface opposite the first surface, where the sensor die defines a sensor edge disposed between the first surface and the second surface. The sensor packaging structure includes a bonding material having a first surface and a second surface opposite the second surface, where the bonding material defines a bonding material edge disposed between the first surface of the bonding material and the second surface of the bonding material. The sensor packaging structure includes a transparent material, where the bonding material couples the sensor die to the transparent material. The sealing material is disposed on an interface between the sensor die and the bonding material, and at least one of a portion of the sensor edge or a portion of the bonding material edge.Type: GrantFiled: August 13, 2018Date of Patent: December 15, 2020Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Weng-Jin Wu
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Publication number: 20200321375Abstract: According to an aspect, an image sensor package includes a transparent member, a substrate, and an interposer disposed between and coupled to the transparent member and the substrate, where the interposer defines a first cavity area and a second cavity area. The image sensor package includes an image sensor die disposed within the first cavity area of the interposer, where the image sensor die has a sensor array configured to receive light through the transparent member and the second cavity area. The image sensor package includes a bonding material that couples the image sensor die to the interposer within the first cavity area.Type: ApplicationFiled: July 9, 2019Publication date: October 8, 2020Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Weng-Jin WU
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Publication number: 20200295065Abstract: An embedded image sensor package including a transparent cover having a first side and an opposing second side. A first layer couples over the second side of the transparent cover and has an opening. An electrically conductive layer couples in or over the first layer and electrically couples with one or more electrical contacts exposed on an outer surface of the package. An image sensor chip having a first side with an image sensor and an opposing second side electrically couples with the electrically conductive layer at the first side of the image sensor chip. The image sensor chip couples over the first layer so the first side of the image sensor chip faces the second side of the transparent cover through the opening. The image sensor chip, first layer, and transparent cover at least partially define a cavity hermetically sealed using an underfill material. The package includes no wirebonds.Type: ApplicationFiled: May 28, 2020Publication date: September 17, 2020Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Weng-Jin WU
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Patent number: 10707250Abstract: An embedded image sensor package including a transparent cover having a first side and an opposing second side. A first layer couples over the second side of the transparent cover and has an opening. An electrically conductive layer couples in or over the first layer and electrically couples with one or more electrical contacts exposed on an outer surface of the package. An image sensor chip having a first side with an image sensor and an opposing second side electrically couples with the electrically conductive layer at the first side of the image sensor chip. The image sensor chip couples over the first layer so the first side of the image sensor chip faces the second side of the transparent cover through the opening. The image sensor chip, first layer, and transparent cover at least partially define a cavity hermetically sealed using an underfill material. The package includes no wirebonds.Type: GrantFiled: October 11, 2018Date of Patent: July 7, 2020Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Weng-Jin Wu
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Publication number: 20200152681Abstract: Implementations of semiconductor packages may include: a semiconductor device included within a cavity within a glass block. The package may also include a substrate coupled with a first side of the semiconductor device and two or more edges of the glass block. A fill material may be included between the substrate and the second conductor device and an opaque material may be between a side surface of the semiconductor device and an inner surface of the cavity. The opaque material may be configured to block light from contacting the side surface of the semiconductor device.Type: ApplicationFiled: November 8, 2018Publication date: May 14, 2020Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventor: Weng-Jin WU