Abstract: A package includes a first package component including a semiconductor die, wherein the semiconductor die includes conductive pads, wherein the semiconductor die is surrounded by an encapsulant; an adaptive interconnect structure on the semiconductor die, wherein the adaptive interconnect structure includes conductive lines, wherein each conductive line physically and electrically contacts a respective conductive pad; and first bond pads, wherein each first bond pad physically and electrically contacts a respective conductive line; and a second package component including an interconnect structure, wherein the interconnect structure includes second bond pads, wherein each second bond pad is directly bonded to a respective first bond pad, wherein each second bond pad is laterally offset from a corresponding conductive pad which is electrically coupled to that second bond pad.

Abstract: A method for performing multi-camera automatic patrol control with aid of statistics data in a surveillance system and an associated apparatus are provided. The method includes: utilizing any camera of a plurality of cameras to capture a plurality of reference images along a plurality of capturing directions of the camera, and performing image analysis operations on the reference images to generate statistics data; performing importance estimation operations according to the statistics data to generate a plurality of importance estimation values respectively corresponding to the capturing directions; selecting one of the capturing directions as a predetermined scheduling direction of the camera according to the importance estimation values; and during a time interval of a plurality of time intervals of a scheduling plan, controlling the camera to capture a series of images along the predetermined scheduling direction to monitor the predetermined scheduling direction.