Abstract: An integrated MEMS inertial sensor device. The device includes a MEMS inertial sensor overlying a CMOS substrate. The MEMS inertial sensor includes a drive frame coupled to the surface region via at least one drive spring, a sense mass coupled to the drive frame via at least a sense spring, and a sense electrode disposed underlying the sense mass. The device also includes at least one pair of quadrature cancellation electrodes disposed within a vicinity of the sense electrode, wherein each pair includes an N-electrode and a P-electrode.

Abstract: A gyroscope device and method of operation therefor. The gyroscope device can include a power input, a charge pump portion coupled to the power input, a selection mechanism, a switching mechanism, an oscillator driving mechanism coupled to the switching mechanism, and an oscillator coupled to the charge pump portion and to the oscillator driving mechanism. The method of operation can include providing a first or second selection signal from a selection mechanism associated with the outputting of a DC input power or DC output power from a switching mechanism, respectively. These signals, along with an oscillator driving signal from an oscillator driving mechanism, can be used to initiate and maintain oscillation of an oscillator at a steady-state frequency within a predetermined range of frequencies.

Abstract: A method for fabricating an integrated MEMS-CMOS device. The method can include providing a substrate member having a surface region and forming a CMOS IC layer having at least one CMOS device overlying the surface region. A bottom isolation layer can be formed overlying the CMOS IC layer and a shielding layer and a top isolation layer can be formed overlying a portion of bottom isolation layer. The bottom isolation layer can include an isolation region between the top isolation layer and the shielding layer. A MEMS layer overlying the top isolation layer, the shielding layer, and the bottom isolation layer, and can be etched to form at least one MEMS structure having at least one movable structure and at least one anchored structure.

Abstract: An integrated MEMS inertial sensor device. The device includes a MEMS inertial sensor overlying a CMOS substrate. The MEMS inertial sensor includes a drive frame coupled to the surface region via at least one drive spring, a sense mass coupled to the drive frame via at least a sense spring, and a sense electrode disposed underlying the sense mass. The device also includes at least one pair of quadrature cancellation electrodes disposed within a vicinity of the sense electrode, wherein each pair includes an N-electrode and a P-electrode.

Abstract: A multi-axis integrated MEMS inertial sensor device. The device can include an integrated 3-axis gyroscope and 3-axis accelerometer on a single chip, creating a 6-axis inertial sensor device. The structure is spatially with efficient use of the design area of the chip by adding the accelerometer device to the center of the gyroscope device. The design architecture can be a rectangular or square shape in geometry, which makes use of the whole chip area and maximizes the sensor size in a defined area. The MEMS is centered in the package, which is beneficial to the sensor's temperature performance. Furthermore, the electrical bonding pads of the integrated multi-axis inertial sensor device can be configured in the four corners of the rectangular chip layout. This configuration guarantees design symmetry and efficient use of the chip area.

Abstract: A MEMS rate sensor device. In an embodiment, the sensor device includes a MEMS rate sensor configured overlying a CMOS substrate. The MEMS rate sensor can include a driver set, with four driver elements, and a sensor set, with six sensing elements, configured for 3-axis rotational sensing. This sensor architecture allows low damping in driving masses and high damping in sensing masses, which is ideal for a MEMS rate sensor design. Low driver damping is beneficial to MEMS rate power consumption and performance, with low driving electrical potential to achieve high oscillation amplitude.

Abstract: A method for fabricating a multiple MEMS device. A semiconductor substrate having a first and second MEMS device, and an encapsulation wafer with a first cavity and a second cavity, which includes at least one channel, can be provided. The first MEMS can be encapsulated within the first cavity and the second MEMS device can be encapsulated within the second cavity. These devices can be encapsulated within a provided first encapsulation environment at a first air pressure, encapsulating the first MEMS device within the first cavity at the first air pressure. The second MEMS device within the second cavity can then be subjected to a provided second encapsulating environment at a second air pressure via the channel of the second cavity.

Abstract: Gyroscopes that can compensate frequency mismatch are provided. In this regard, a representative gyroscope, among others, includes a top substrate including an outermost structure, a first driving structure and a first sensing structure. The first driving structure and the first sensing structure are disposed within the outermost structure. The first driving structure and the first sensing structure include a first driving electrode and a first sensing electrode that are disposed on a bottom surface of the first driving structure and first sensing structure, respectively. A portion of the mass on the top surface of the first sensing structure is removed. The gyroscope further includes a bottom substrate that is disposed below the top substrate. The bottom substrate includes a second driving electrode and a second sensing electrode that are disposed on a top surface of the bottom substrate and below the first driving electrode and the first sensing electrode.

Abstract: A resonant cavity with tunable nanowire. The resonant cavity includes a substrate. The substrate is coupleable to an optical resonator structure. The resonant cavity also includes a plurality of nanowires formed on the substrate. The plurality of nanowires is actuated in response to an application of energy.

Abstract: Gyroscopes using surface electrodes are provided. In this regard, a representative microelectromechanical systems (MEMS) gyroscope, among others, includes a top substrate and a bottom substrate. The top substrate includes an outermost structure that is open and enclosed and a first driving structure that is disposed within the outermost structure and includes first driving electrodes disposed on a bottom surface. The bottom substrate is disposed below the top substrate and includes second driving electrodes disposed on a top surface of the bottom substrate. The second driving electrodes are substantially aligned below the first driving electrodes such that a force can be applied to the first driving structure by an electrostatic force generated between the first and second driving electrodes. The first and second driving electrodes are also configured to provide a capacitance signal based on the movement of the first driving structure.

Abstract: A resonator includes a translator, a stator, and a control circuit. The control circuit is configured to provide first and second translator voltages and first through third stator voltages, wherein the translator is configured to move with respect to the stator at a resonant frequency of the resonator in response to the control circuit.

Abstract: Gyroscopes that can compensate frequency mismatch are provided. In this regard, a representative gyroscope, among others, includes a top substrate including an outermost structure, a first driving structure and a first sensing structure. The first driving structure and the first sensing structure are disposed within the outermost structure. The first driving structure and the first sensing structure include a first driving electrode and a first sensing electrode that are disposed on a bottom surface of the first driving structure and first sensing structure, respectively. A portion of the mass on the top surface of the first sensing structure is removed. The gyroscope further includes a bottom substrate that is disposed below the top substrate. The bottom substrate includes a second driving electrode and a second sensing electrode that are disposed on a top surface of the bottom substrate and below the first driving electrode and the first sensing electrode.

Abstract: Encapsulated devices that can adjust the damping level within are provided. In this regard, a representative encapsulated device, among others, comprises a bottom substrate, a middle substrate that is disposed above the bottom substrate, and a top substrate that is disposed above the middle substrate. The middle substrate comprises an outermost structure and at least one damping device. The at least one damping device is supported to the outermost structure. At least one top gap and a bottom gap are formed between the at least one damping device and the top and bottom substrates, respectively. The at least one top gap has at least one cavity depth that is adapted to adjust the damping level of the encapsulated device.

Abstract: A resonant cavity with tunable nanowire. The resonant cavity includes a substrate. The substrate is coupleable to an optical resonator structure. The resonant cavity also includes a plurality of nanowires formed on the substrate. The plurality of nanowires is actuated in response to an application of energy.

Abstract: Gyroscopes using surface electrodes are provided. In this regard, a representative microelectromechanical systems (MEMS) gyroscope, among others, includes a top substrate and a bottom substrate. The top substrate includes an outermost structure that is open and enclosed and a first driving structure that is disposed within the outermost structure and includes first driving electrodes disposed on a bottom surface. The bottom substrate is disposed below the top substrate and includes second driving electrodes disposed on a top surface of the bottom substrate. The second driving electrodes are substantially aligned below the first driving electrodes such that a force can be applied to the first driving structure by an electrostatic force generated between the first and second driving electrodes. The first and second driving electrodes are also configured to provide a capacitance signal based on the movement of the first driving structure.

Abstract: A resonator includes a translator, a stator, and a control circuit. The control circuit is configured to provide first and second translator voltages and first through third stator voltages, wherein the translator is configured to move with respect to the stator at a resonant frequency of the resonator in response to the control circuit.

Abstract: Encapsulated devices that can adjust the damping level within are provided. In this regard, a representative encapsulated device, among others, comprises a bottom substrate, a middle substrate that is disposed above the bottom substrate, and a top substrate that is disposed above the middle substrate. The middle substrate comprises an outermost structure and at least one damping device. The at least one damping device is supported to the outermost structure. At least one top gap and a bottom gap are formed between the at least one damping device and the top and bottom substrates, respectively. The at least one top gap has at least one cavity depth that is adapted to adjust the damping level of the encapsulated device.

Abstract: A method of reading code symbols using a digital image capture and processing system which includes: an image formation and detection subsystem; an illumination subsystem; an illumination control subsystem; a digital image processing subsystem; and an input/output subsystem; and a system control subsystem. In the illustrative embodiment, a micro-computing platform implements the digital image processing subsystem, the input/output subsystem and the system control subsystem. The micro-computing platform includes a microprocessor, a memory architecture, and a multi-tier modular software architecture responsive to the generation of a triggering event within the system. Triggering events can be generated by an automatic object detector or by a manually actuated trigger switch.

Abstract: A digital image capture and processing system comprising an illumination measurement subsystem for measuring the level of illumination at a particular region of the field of view (FOV) of the system during object illumination and imaging operations, and producing and storing an illumination measure for achieving a desired spatial intensity in a digital image to be formed and detected by the image formation and detection subsystem. An illumination control subsystem uses the illumination measure to control a LED-based illumination array during object illumination and imaging operations. A programmed image processor supports an image-processing based illumination metering program, as well as processes digital images formed and detected by the image formation and detection subsystem so as to read or acquire information graphically represented in the digital images.

Abstract: A hand-supportable digital-imaging based system for reading bar code symbols involving: automatically detecting the presence of an object within a field of view FOV of the system, and in response thereto, automatically generating an image cropping zone (ICZ) framing pattern and projecting the ICZ framing pattern within the FOV and onto the detected object; visually aligning the code symbol on the detected object, within the ICZ framing pattern; manually actuating a trigger switch when the code symbol on the object is located within the ICZ framing pattern, and while the ICZ framing pattern and a field of illumination are being simultaneously projected onto the object during object illumination operations, forming and capturing a digital image of the code symbol on the detected object; automatically cropping the image pixels contained within the spatial boundaries of the ICZ framing pattern, from the pixels of the digital image; and decode processing the cropped image so as to read one or more 1D and/or 2D cod