Patents by Inventor Wenjin Niu

Wenjin Niu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11971501
    Abstract: A sensor module includes a sensor module main body having a rectangular board provided with a radio radar sensor function, and a metallic case having a rectangular parallelepiped box shape in which an opening part opened at one face in a thickness direction is formed and a cut-out opening for drawing out a cable connecting the sensor module main body is formed on a side face, the opening part being closed by the board inserted through the opening part with a component disposed on a front face of the board facing toward a bottom part on the inner side, and the cable is inserted into at least a part of the cut-out opening, and the cut-out opening is formed to be symmetrical with respect to a plane passing through the center of the metallic case and perpendicular to a plane of the cut-out opening.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: April 30, 2024
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Kazuhiro Kosugi, Yafeng Shao, Wenjin Niu, Yun Zhu
  • Publication number: 20230300991
    Abstract: An electronic apparatus includes a display panel and a chassis member that are fixed by a tensile-peelable first adhesive tape, second adhesive tape, and third adhesive tape. The first adhesive tape is located along a first edge of the chassis member. The third adhesive tape is located along a third edge of the chassis member. The second adhesive tape is located between the first adhesive tape and the third adhesive tape and orthogonal to the first adhesive tape and the third adhesive tape. The first adhesive tape and the third adhesive tape respectively have a first tab and a third tab for tensile peeling operation extending to a second edge of the chassis member. The second adhesive tape has a second tab for tensile peeling operation extending from one end thereof to the second edge.
    Type: Application
    Filed: January 26, 2023
    Publication date: September 21, 2023
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Wenjin Niu, Takehito Yamauchi, Keita Ishikawa, Shigehiro Horiuchi, So Nakanishi
  • Patent number: 11579513
    Abstract: An information device has a camera cover unit that is fixed to an upper edge in the outside of a display device in a back cover. The camera cover unit includes a cover case that is fixed to the upper edge and a cover body that is housed in the cover case and is slidable between a first position and a second position. The cover body includes an end that is placed in the first position to cover the front of the camera and placed in the second position to avoid the front of the camera, and a leaf spring that is elastically deformable inward and outward of the frame of the upper edge.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: February 14, 2023
    Assignee: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Wenjin Niu, Takehito Yamauchi, Sara Akiyama
  • Patent number: 11490185
    Abstract: An electronic device includes a chassis, a microphone hole penetrating an outer wall of the chassis, and a microphone module that faces the microphone hole. The microphone module has a microphone that obtains sound information outside the chassis through the microphone hole, a flexible substrate laminated on a back surface of the microphone, a metallic plate laminated on a back surface of the flexible substrate, and a sound hole opened in the back surface of the microphone and penetrating the flexible substrate and the metallic plate. The electronic device further includes a double-sided tape fastened to a first region, surrounding the sound hole, of a back surface of the metallic plate, and to an inner surface of the chassis, and that fixes the microphone module to the chassis, and a conductive member that electrically connects the second region of the metallic plate and the inner surface of the chassis.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: November 1, 2022
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Wenjin Niu, Jun Iwasaki, Toshikazu Horino, Toshinari Sumikawa, Shigehiro Horiuchi, Takehito Yamauchi, Yalu Liu, Keita Ishikawa
  • Publication number: 20220174386
    Abstract: An electronic device includes a chassis, a microphone hole penetrating an outer wall of the chassis, and a microphone module that faces the microphone hole. The microphone module has a microphone that obtains sound information outside the chassis through the microphone hole, a flexible substrate laminated on a back surface of the microphone, a metallic plate laminated on a back surface of the flexible substrate, and a sound hole opened in the back surface of the microphone and penetrating the flexible substrate and the metallic plate. The electronic device further includes a double-sided tape fastened to a first region, surrounding the sound hole, of a back surface of the metallic plate, and to an inner surface of the chassis, and that fixes the microphone module to the chassis, and a conductive member that electrically connects the second region of the metallic plate and the inner surface of the chassis.
    Type: Application
    Filed: July 29, 2021
    Publication date: June 2, 2022
    Applicant: Lenovo (Singapore) Pte. Ltd.
    Inventors: Wenjin Niu, Jun Iwasaki, Toshikazu Horino, Toshinari Sumikawa, Shigehiro Horiuchi, Takehito Yamauchi, Yalu Liu, Keita Ishikawa
  • Publication number: 20220163869
    Abstract: An information device has a camera cover unit that is fixed to an upper edge in the outside of a display device in a back cover. The camera cover unit includes a cover case that is fixed to the upper edge and a cover body that is housed in the cover case and is slidable between a first position and a second position. The cover body includes an end that is placed in the first position to cover the front of the camera and placed in the second position to avoid the front of the camera, and a leaf spring that is elastically deformable inward and outward of the frame of the upper edge.
    Type: Application
    Filed: February 18, 2021
    Publication date: May 26, 2022
    Applicant: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Wenjin Niu, Takehito Yamauchi, Sara Akiyama
  • Publication number: 20220026554
    Abstract: A sensor module includes a sensor module main body having a rectangular board provided with a radio radar sensor function, and a metallic case having a rectangular parallelepiped box shape in which an opening part opened at one face in a thickness direction is formed and a cut-out opening for drawing out a cable connecting the sensor module main body is formed on a side face, the opening part being closed by the board inserted through the opening part with a component disposed on a front face of the board facing toward a bottom part on the inner side, and the cable is inserted into at least a part of the cut-out opening, and the cut-out opening is formed to be symmetrical with respect to a plane passing through the center of the metallic case and perpendicular to a plane of the cut-out opening.
    Type: Application
    Filed: July 13, 2021
    Publication date: January 27, 2022
    Applicant: Lenovo (Singapore) Pte. Ltd.
    Inventors: Kazuhiro Kosugi, Yafeng Shao, Wenjin Niu, Yun Zhu
  • Publication number: 20210022246
    Abstract: A flexible printed circuit (FPC) terminal connection structure is provided. The FPC terminal connection structure includes a base material; a substrate secured to the base material, wherein the substrate includes a second terminal group on one surface thereof an FPC including a first terminal group on a first surface thereof, corresponding terminals of the first terminal group and the second terminal group being in contact with each other; a flat spring disposed on top of a first position that interferes with at least the first terminal group on a second surface of the FPC; and a fastening member for fastening the flat spring and the FPC to the base material at a second position different from the first position.
    Type: Application
    Filed: July 20, 2020
    Publication date: January 21, 2021
    Inventors: Wenjin Niu, Takehito Yamauchi, Kazutoshi Sugisawa, Shigehiro Horiuchi