Patents by Inventor WENJUN TIAN
WENJUN TIAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230312812Abstract: The present disclosure relates to epoxide containing compounds comprising three benzene units linked by bridging groups. The disclosure also relates to the production of curable epoxy resin formulations comprising said epoxide containing compounds, and their possible incorporation into composite materials such as fibre reinforced composites. Possible methods for formulating the compounds epoxide containing compounds, as described herein, are also disclosed.Type: ApplicationFiled: June 8, 2023Publication date: October 5, 2023Inventors: Stephen CHRISTENSEN, Samuel TUCKER, Jeffrey WIGGINS, Russel John VARLEY, Nguyen Buu DAO, Wendy Wenjun TIAN
-
Patent number: 11718707Abstract: The present disclosure relates to epoxide containing compounds comprising three benzene units linked by bridging groups. The disclosure also relates to the production of curable epoxy resin formulations comprising said epoxide containing compounds, and their possible incorporation into composite materials such as fibre reinforced composites. Possible methods for formulating the compounds epoxide containing compounds, as described herein, are also disclosed.Type: GrantFiled: May 28, 2021Date of Patent: August 8, 2023Assignee: The Boeing CompanyInventors: Stephen Christensen, Samuel Tucker, Jeffrey Wiggins, Russell John Varley, Nguyen Buu Dao, Wendy Wenjun Tian
-
Publication number: 20210355269Abstract: The present disclosure relates to epoxide containing compounds comprising three benzene units linked by bridging groups. The disclosure also relates to the production of curable epoxy resin formulations comprising said epoxide containing compounds, and their possible incorporation into composite materials such as fibre reinforced composites. Possible methods for formulating the compounds epoxide containing compounds, as described herein, are also disclosed.Type: ApplicationFiled: May 28, 2021Publication date: November 18, 2021Inventors: Stephen CHRISTENSEN, Samuel TUCKER, Jeffrey WIGGINS, Russell John VARLEY, Nguyen Buu DAO, Wendy Wenjun TIAN
-
Patent number: 11059937Abstract: The present disclosure relates to epoxide containing compounds comprising three benzene units linked by bridging groups. The disclosure also relates to the production of curable epoxy resin formulations comprising said epoxide containing compounds, and their possible incorporation into composite materials such as fibre reinforced composites. Possible methods for formulating the compounds epoxide containing compounds, as described herein, are also disclosed.Type: GrantFiled: July 20, 2017Date of Patent: July 13, 2021Assignee: THE BOEING COMPANYInventors: Stephen Christensen, Samuel Tucker, Jeffrey Wiggins, Russell John Varley, Nguyen Buu Dao, Wendy Wenjun Tian
-
Patent number: 10844273Abstract: A method of controlling sand production in a sandstone reservoir comprising providing (i) an aminosilane and (ii) a polymeric linking agent comprising monomeric units having pendent functional groups selected from the group consisting of carboxylic acids, carboxylic acid esters and amides, wherein a plurality of the pendent functional groups are reacted with the amino group of the aminosilane by a process selected from the group consisting of aminolysis of carboxylic acid ester groups, Mannich reaction between the amino group of the aminosilane and a plurality of at least one of carboxylic acid and amide pendent groups in the presence of an aldehyde activating agent or combination thereof, contacting the aminosilane and polymeric linking agent with the sandstone reservoir to bond the silane group of the aminosilane with particles of sand and provide agglomeration as a result of covalent bonding of the linking agent with a plurality of aminosilanes.Type: GrantFiled: August 16, 2017Date of Patent: November 24, 2020Assignee: COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATIONInventors: Colin David Wood, Wendy Wenjun Tian, Khoa Nguyen Pham
-
Patent number: 10696801Abstract: A gas hydrate hydrogel inhibitor comprising at least one polymer hydrogel particle having from 50 to 100% hydrogel content, the at least one polymer hydrogel particle including an inhibitor selected from the group consisting of: at least one thermodynamic hydrate inhibitor, at least one kinetic hydrate inhibitor, or a combination thereof.Type: GrantFiled: May 27, 2016Date of Patent: June 30, 2020Assignee: COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATIONInventors: Colin David Wood, Yutaek Seo, Wendy Wenjun Tian
-
Publication number: 20190248953Abstract: The present disclosure relates to epoxide containing compounds comprising three benzene units linked by bridging groups. The disclosure also relates to the production of curable epoxy resin formulations comprising said epoxide containing compounds, and their possible incorporation into composite materials such as fibre reinforced composites. Possible methods for formulating the compounds epoxide containing compounds, as described herein, are also disclosed.Type: ApplicationFiled: July 20, 2017Publication date: August 15, 2019Inventors: Stephen CHRISTENSEN, Samuel TUCKER, Jeffrey WIGGINS, Russell John VARLEY, Nguyen Buu DAO, Wendy Wenjun TIAN
-
Publication number: 20190203102Abstract: A method of controlling sand production in a sandstone reservoir comprising providing (i) an aminosilane and (ii) a polymeric linking agent comprising monomeric units having pendent functional groups selected from the group consisting of carboxylic acids, carboxylic acid esters and amides, wherein a plurality of the pendent functional groups are reacted with the amino group of the aminosilane by a process selected from the group consisting of aminolysis of carboxylic acid ester groups, Mannich reaction between the amino group of the aminosilane and a plurality of at least one of carboxylic acid and amide pendent groups in the presence of an aldehyde activating agent or combination thereof, contacting the aminosilane and polymeric linking agent with the sandstone reservoir to bond the silane group of the aminosilane with particles of sand and provide agglomeration as a result of covalent bonding of the linking agent with a plurality of aminosilanes.Type: ApplicationFiled: August 16, 2017Publication date: July 4, 2019Applicant: COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATIONInventors: Colin David WOOD, Wendy Wenjun TIAN, Khoa Nguyen PHAM
-
Publication number: 20180265647Abstract: A gas hydrate hydrogel inhibitor comprising at least one polymer hydrogel particle having from 50 to 100% hydrogel content, the at least one polymer hydrogel particle including an inhibitor selected from the group consisting of: at least one thermodynamic hydrate inhibitor, at least one kinetic hydrate inhibitor, or a combination thereof.Type: ApplicationFiled: May 27, 2016Publication date: September 20, 2018Inventors: Colin David WOOD, Yutaek SEO, Wendy Wenjun TIAN
-
Patent number: 10072148Abstract: The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).Type: GrantFiled: November 15, 2017Date of Patent: September 11, 2018Assignee: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.Inventors: Rongtao Wang, Yu-Te Lin, Wenjun Tian, Ziqian Ma, Wenfeng Lv, Ningning Jia
-
Publication number: 20180072884Abstract: The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).Type: ApplicationFiled: November 15, 2017Publication date: March 15, 2018Inventors: Rongtao WANG, Yu-Te Lin, Wenjun Tian, Ziqian Ma, Wenfeng LV, Ningning Jia
-
Patent number: 9850375Abstract: The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).Type: GrantFiled: August 23, 2013Date of Patent: December 26, 2017Assignee: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO. LTD.Inventors: Rongtao Wang, Yu-Te Lin, Wenjun Tian, Ziqian Ma, Wenfeng Lv, Ningning Jia
-
Patent number: 9650512Abstract: A halogen-free resin composition, a copper clad laminate using the same, and a printed circuit board using the same are introduced. The halogen-free resin composition comprising (A) 100 parts by weight of epoxy resin; (B) 3 to 15 parts by weight of diaminodiphenyl sulfone (DDS); and (C) 5 to 70 parts by weight of phenolic co-hardener. The halogen-free resin composition features specific ingredients and proportion to thereby achieve satisfactory maximum preservation period of the prepreg manufactured from the halogen-free resin composition, control the related manufacturing process better, and attain satisfactory laminate properties, such as a high degree of water resistance, a high degree of heat resistance, and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.Type: GrantFiled: August 10, 2013Date of Patent: May 16, 2017Assignee: Elite Electronic Material (Kunshan) Co., LtdInventors: Rong-Tao Wang, Li-Chih Yu, Yu-Te Lin, Yi-Jen Chen, Wenjun Tian, Ziqian Ma, Wenfeng Lu
-
Patent number: 9574070Abstract: A low dissipation factor resin composition comprises the following components: (A) an aromatic tetrafunctional vinylbenzyl monomer, its prepolymer or a combination thereof, the aromatic tetrafunctional vinylbenzyl monomer having a structure shown below; (B) flame retardant; and (C) peroxide. The resin composition is applicable to laminates and printed circuit boards featuring low dissipation factor at high frequency and thermal resistance and thermal expansion meeting the demands.Type: GrantFiled: June 4, 2015Date of Patent: February 21, 2017Assignee: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.Inventors: Rongtao Wang, Chen-Yu Hsieh, Wenfeng Lv, Wenjun Tian, Yu Gao, Ningning Jia, Ziqian Ma
-
Patent number: 9469757Abstract: A low dissipation factor resin composition comprises: (A) 100 to 150 parts by weight of a vinyl-containing compound or a polymer thereof; (B) 0 to 75 parts by weight of styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, vinyl functional polybutadiene urethane oligomer or a combination thereof; (C) 30 to 150 parts by weight of flame retardant; and (D) 0.1 to 10 parts by weight of peroxide. The resin composition and a product made thereby are applicable to a copper-clad laminate and a printed circuit board, characterized by having low dissipation factor at high frequency and satisfactory thermal resistance and thermal expansion.Type: GrantFiled: June 4, 2015Date of Patent: October 18, 2016Assignee: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.Inventors: Rongtao Wang, Chen-Yu Hsieh, Wenfeng Lv, Wenjun Tian, Yu Gao, Ningning Jia, Ziqian Ma
-
Patent number: 9447238Abstract: A polyphenylene oxide resin belongs to a polymerized and/or modified thermosetting polyphenylene oxide resin, having a structure represented by formula (I): The polymerized and/or modified thermosetting polyphenylene oxide resin has better flame retardancy, thermal resistance, dielectric constant, dissipation factor, toughness, reactivity, viscosity and solubility. Therefore, the polyphenylene oxide resin is suitable for producing prepregs, resin films, laminates, printed circuit boards and other articles. A method of preparing polyphenylene oxide resins, a prepolymer thereof and a resin composition containing the polyphenylene oxide resin are also provided.Type: GrantFiled: March 10, 2015Date of Patent: September 20, 2016Assignee: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.Inventors: Yu Gao, Chen-Yu Hsieh, Ziqian Ma, Rongtao Wang, Wenjun Tian
-
Publication number: 20160222204Abstract: The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).Type: ApplicationFiled: August 23, 2013Publication date: August 4, 2016Inventors: Rongtao WANG, Yu-Te Lin, Wenjun Tian, Ziqian Ma, Wenfeng Lv, Ningning Jia
-
Patent number: 9402310Abstract: The present invention provides a resin composition useful for a copper-clad laminate and a printed circuit board, wherein the resin composition comprises the following components: (A) 100 parts by weight of vinyl-containing polyphenylene ether resin; (B) 5 to 50 parts by weight of maleimide; (C) 10 to 100 parts by weight of styrene-butadiene copolymer; and (D) 5 to 30 parts by weight of cyanate ester resin. The present invention also provides a resin composition and an article made therefrom having low dissipation factor at high frequency and excellent thermal resistance and peeling strength and being useful for a copper-clad laminate and a printed circuit board.Type: GrantFiled: January 31, 2014Date of Patent: July 26, 2016Assignee: Elite Electronic Material (Kunshan) Co., Ltd.Inventors: Rongtao Wang, Chen Yu Hsieh, Wenjun Tian, Ziqian Ma, Wenfeng LV
-
Publication number: 20160185904Abstract: A polyphenylene oxide resin belongs to a polymerized and/or modified thermosetting polyphenylene oxide resin, having a structure represented by formula (I): The polymerized and/or modified thermosetting polyphenylene oxide resin has better flame retardancy, thermal resistance, dielectric constant, dissipation factor, toughness, reactivity, viscosity and solubility. Therefore, the polyphenylene oxide resin is suitable for producing prepregs, resin films, laminates, printed circuit boards and other articles. A method of preparing polyphenylene oxide resins, a prepolymer thereof and a resin composition containing the polyphenylene oxide resin are also provided.Type: ApplicationFiled: March 10, 2015Publication date: June 30, 2016Inventors: Yu GAO, Chen-Yu HSIEH, Ziqian MA, Rongtao WANG, Wenjun TIAN
-
Publication number: 20160160008Abstract: A low dissipation factor resin composition comprises the following components: (A) an aromatic tetrafunctional vinylbenzyl monomer, its prepolymer or a combination thereof, the aromatic tetrafunctional vinylbenzyl monomer having a structure shown below; (B) flame retardant; and (C) peroxide.Type: ApplicationFiled: June 4, 2015Publication date: June 9, 2016Inventors: Rongtao WANG, Chen-Yu HSIEH, Wenfeng LV, Wenjun TIAN, Yu GAO, Ningning JIA, Ziqian MA