Patents by Inventor Wenmin Liu

Wenmin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240162628
    Abstract: Embodiments of the present disclosure provide a radiator and a radiation assembly for an antenna and an associated antenna. The radiator comprises a conductive body adapted to be arranged in an antenna for transmission and/or reception of radiation in a first frequency band, wherein along a length direction of the conductive body, the conductive body comprises: a plurality of first conductive members; and at least one second conductive member galvanically coupled to the plurality of first conductive members and having a size smaller than a size of each of the first conductive member to thereby converge induced current electrometrically coupled onto the radiator by radiation in a second frequency band different from the first frequency band. With the radiation assembly comprising the radiator, other antennas or radiation assemblies operating at different frequency bands may be located closer to the radiation assembly because less electromagnetic coupling occurs between the two antennas/radiation assemblies.
    Type: Application
    Filed: November 17, 2023
    Publication date: May 16, 2024
    Applicant: RFS Technologies, Inc.
    Inventors: Wenmin Yang, Qiang Liu
  • Publication number: 20240117470
    Abstract: A high-thermal conductivity composite material is AlNp/ZA27 composite material, including 2%, 4%, 6%, or 8% by volume of aluminum nitride (AlN) ceramic particles and zinc-aluminium-27 (ZA27) alloy. The ZA27 alloy includes 70.52-71.08% by weight of Zn, 25.58˜27.65% by weight of Al, 1.27˜3.45% by weight of Cu, and 0.50% or less by weight of Mg. In the preparation of the high-thermal conductivity composite material, an as-cast AlNp/ZA27 composite material is subjected to homogenizing annealing and reciprocating extrusion.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 11, 2024
    Inventors: Shengqiang MA, Ping LV, Xudong CUI, Yusheng LIU, Xuebin HE, Jiaxu CHEN, Jiankang ZHANG, Jiandong XING, Wenmin NIU
  • Publication number: 20210407843
    Abstract: An automatic wafer carrying system and a method for transferring a wafer using the system are provided.
    Type: Application
    Filed: June 22, 2021
    Publication date: December 30, 2021
    Inventors: Hualong Yang, Dezan Yang, Wenmin Liu, Fengli Wu