Patents by Inventor Wenmin NIU

Wenmin NIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HIGH-THERMAL CONDUCTIVITY COMPOSITE MATERIAL, PREPARATION METHOD AND APPLICATION THEREOF
    Publication number: 20240117470
    Abstract: A high-thermal conductivity composite material is AlNp/ZA27 composite material, including 2%, 4%, 6%, or 8% by volume of aluminum nitride (AlN) ceramic particles and zinc-aluminium-27 (ZA27) alloy. The ZA27 alloy includes 70.52-71.08% by weight of Zn, 25.58˜27.65% by weight of Al, 1.27˜3.45% by weight of Cu, and 0.50% or less by weight of Mg. In the preparation of the high-thermal conductivity composite material, an as-cast AlNp/ZA27 composite material is subjected to homogenizing annealing and reciprocating extrusion.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 11, 2024
    Inventors: Shengqiang MA, Ping LV, Xudong CUI, Yusheng LIU, Xuebin HE, Jiaxu CHEN, Jiankang ZHANG, Jiandong XING, Wenmin NIU