Patents by Inventor Wenqin Huangfu
Wenqin Huangfu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240086292Abstract: A method for computing. In some embodiments, the method includes: calculating an advantage score of a first computing task, the advantage score being a measure of an extent to which a plurality of function in memory circuits is capable of executing the first computing task more efficiently by than one or more extra-memory processing circuits, the first computing task including instructions and data; in response to determining that the advantage score of the first computing task is less than a first threshold, executing the first computing task by the one or more extra-memory processing circuits; and in response to determining that the first computing task is at least equal to the first threshold: compiling the instructions for execution by the function in memory circuits; formatting the data for the function in memory circuits; and executing the first computing task, by the function in memory circuits.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Inventors: Krishna T. Malladi, Wenqin Huangfu
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Publication number: 20240004646Abstract: According to one embodiment, a memory module includes: a memory die including a dynamic random access memory (DRAM) banks, each including: an array of DRAM cells arranged in pages; a row buffer to store values of one of the pages; an input/output (IO) module; and an in-memory compute (IMC) module including: an arithmetic logic unit (ALU) to receive operands from the row buffer or the IO module and to compute an output based on the operands and one of a plurality of ALU operations; and a result register to store the output of the ALU; and a controller to: receive, from a host processor, operands and an instruction; determine, based on the instruction, a data layout; supply the operands to the DRAM banks in accordance with the data layout; and control an IMC module to perform one of the ALU operations on the operands in accordance with the instruction.Type: ApplicationFiled: September 14, 2023Publication date: January 4, 2024Inventors: Krishna T. Malladi, Wenqin Huangfu
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Patent number: 11853186Abstract: A method for computing. In some embodiments, the method includes: calculating an advantage score of a first computing task, the advantage score being a measure of an extent to which a plurality of function in memory circuits is capable of executing the first computing task more efficiently by than one or more extra-memory processing circuits, the first computing task including instructions and data; in response to determining that the advantage score of the first computing task is less than a first threshold, executing the first computing task by the one or more extra-memory processing circuits; and in response to determining that the first computing task is at least equal to the first threshold: compiling the instructions for execution by the function in memory circuits; formatting the data for the function in memory circuits; and executing the first computing task, by the function in memory circuits.Type: GrantFiled: March 21, 2022Date of Patent: December 26, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Krishna T. Malladi, Wenqin Huangfu
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Patent number: 11782707Abstract: According to one embodiment, a memory module includes: a memory die including a dynamic random access memory (DRAM) banks, each including: an array of DRAM cells arranged in pages; a row buffer to store values of one of the pages; an input/output (IO) module; and an in-memory compute (IMC) module including: an arithmetic logic unit (ALU) to receive operands from the row buffer or the IO module and to compute an output based on the operands and one of a plurality of ALU operations; and a result register to store the output of the ALU; and a controller to: receive, from a host processor, operands and an instruction; determine, based on the instruction, a data layout; supply the operands to the DRAM banks in accordance with the data layout; and control an IMC module to perform one of the ALU operations on the operands in accordance with the instruction.Type: GrantFiled: December 10, 2021Date of Patent: October 10, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Krishna T. Malladi, Wenqin Huangfu
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Publication number: 20230281128Abstract: A memory system is disclosed. The memory system may include a first cache-coherent interconnect memory module and a second cache-coherent interconnect memory module. A cache-coherent interconnect switch may connect the first cache-coherent interconnect memory module, the second cache-coherent interconnect memory module, and a processor. A processing element may process a data stored on at least one of the first cache-coherent interconnect memory module and the second cache-coherent interconnect memory module.Type: ApplicationFiled: June 7, 2022Publication date: September 7, 2023Inventors: Wenqin HUANGFU, Krishna T. MALLADI, Andrew CHANG
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Publication number: 20220206917Abstract: A method for computing. In some embodiments, the method includes: calculating an advantage score of a first computing task, the advantage score being a measure of an extent to which a plurality of function in memory circuits is capable of executing the first computing task more efficiently by than one or more extra-memory processing circuits, the first computing task including instructions and data; in response to determining that the advantage score of the first computing task is less than a first threshold, executing the first computing task by the one or more extra-memory processing circuits; and in response to determining that the first computing task is at least equal to the first threshold: compiling the instructions for execution by the function in memory circuits; formatting the data for the function in memory circuits; and executing the first computing task, by the function in memory circuits.Type: ApplicationFiled: March 21, 2022Publication date: June 30, 2022Inventors: Krishna T. Malladi, Wenqin Huangfu
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Publication number: 20220171620Abstract: According to one embodiment, a memory module includes: a memory die including a dynamic random access memory (DRAM) banks, each including: an array of DRAM cells arranged in pages; a row buffer to store values of one of the pages; an input/output (IO) module; and an in-memory compute (IMC) module including: an arithmetic logic unit (ALU) to receive operands from the row buffer or the IO module and to compute an output based on the operands and one of a plurality of ALU operations; and a result register to store the output of the ALU; and a controller to: receive, from a host processor, operands and an instruction; determine, based on the instruction, a data layout; supply the operands to the DRAM banks in accordance with the data layout; and control an IMC module to perform one of the ALU operations on the operands in accordance with the instruction.Type: ApplicationFiled: December 10, 2021Publication date: June 2, 2022Inventors: Krishna T. Malladi, Wenqin Huangfu
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Patent number: 11281554Abstract: A method for computing. In some embodiments, the method includes: calculating an advantage score of a first computing task, the advantage score being a measure of an extent to which a plurality of function in memory circuits is capable of executing the first computing task more efficiently by than one or more extra-memory processing circuits, the first computing task including instructions and data; in response to determining that the advantage score of the first computing task is less than a first threshold, executing the first computing task by the one or more extra-memory processing circuits; and in response to determining that the first computing task is at least equal to the first threshold: compiling the instructions for execution by the function in memory circuits; formatting the data for the function in memory circuits; and executing the first computing task, by the function in memory circuits.Type: GrantFiled: June 26, 2020Date of Patent: March 22, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Krishna T. Malladi, Wenqin Huangfu
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Patent number: 11226816Abstract: According to one embodiment, a memory module includes: a memory die including a dynamic random access memory (DRAM) banks, each including: an array of DRAM cells arranged in pages; a row buffer to store values of one of the pages; an input/output (IO) module; and an in-memory compute (IMC) module including: an arithmetic logic unit (ALU) to receive operands from the row buffer or the IO module and to compute an output based on the operands and one of a plurality of ALU operations; and a result register to store the output of the ALU; and a controller to: receive, from a host processor, operands and an instruction; determine, based on the instruction, a data layout; supply the operands to the DRAM banks in accordance with the data layout; and control an IMC module to perform one of the ALU operations on the operands in accordance with the instruction.Type: GrantFiled: April 27, 2020Date of Patent: January 18, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Krishna T. Malladi, Wenqin Huangfu
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Publication number: 20210349837Abstract: A memory module may include one or more memory devices, and a near-memory computing module coupled to the one or more memory devices, the near-memory computing module including one or more processing elements configured to process data from the one or more memory devices, and a memory controller configured to coordinate access of the one or more memory devices from a host and the one or more processing elements. A method of processing a dataset may include distributing a first portion of the dataset to a first memory module, distributing a second portion of the dataset to a second memory module, constructing a first local data structure at the first memory module based on the first portion of the dataset, constructing a second local data structure at the second memory module based on the second portion of the dataset, and merging the first and second local data structures.Type: ApplicationFiled: March 26, 2021Publication date: November 11, 2021Inventors: Wenqin HUANGFU, Krishna T. MALLADI, Dongyan JIANG
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Publication number: 20210294711Abstract: A method for computing. In some embodiments, the method includes: calculating an advantage score of a first computing task, the advantage score being a measure of an extent to which a plurality of function in memory circuits is capable of executing the first computing task more efficiently by than one or more extra-memory processing circuits, the first computing task including instructions and data; in response to determining that the advantage score of the first computing task is less than a first threshold, executing the first computing task by the one or more extra-memory processing circuits; and in response to determining that the first computing task is at least equal to the first threshold: compiling the instructions for execution by the function in memory circuits; formatting the data for the function in memory circuits; and executing the first computing task, by the function in memory circuits.Type: ApplicationFiled: June 26, 2020Publication date: September 23, 2021Inventors: Krishna T. Malladi, Wenqin Huangfu
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Publication number: 20210247978Abstract: According to one embodiment, a memory module includes: a memory die including a dynamic random access memory (DRAM) banks, each including: an array of DRAM cells arranged in pages; a row buffer to store values of one of the pages; an input/output (IO) module; and an in-memory compute (IMC) module including: an arithmetic logic unit (ALU) to receive operands from the row buffer or the IO module and to compute an output based on the operands and one of a plurality of ALU operations; and a result register to store the output of the ALU; and a controller to: receive, from a host processor, operands and an instruction; determine, based on the instruction, a data layout; supply the operands to the DRAM banks in accordance with the data layout; and control an IMC module to perform one of the ALU operations on the operands in accordance with the instruction.Type: ApplicationFiled: April 27, 2020Publication date: August 12, 2021Inventors: Krishna T. Malladi, Wenqin Huangfu