Patents by Inventor Wenxiao Gai

Wenxiao Gai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin film composite hollow fibre membrane
    Patent number: 11465100
    Abstract: There is provided a thin film composite (TFC) hollow fibre membrane comprising a porous hollow fibre support layer formed of a polymer and a selective layer, formed of a cross-linked polyamide, on an inner circumferential surface of the hollow fibre support layer, wherein the TFC hollow fibre membrane has a power density of 25-50 W/m2 at a pressure of 30 bar. There is also provided a method of forming the TFC hollow fibre membrane.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: October 11, 2022
    Assignee: NATIONAL UNIVERSITY OF SINGAPORE
    Inventors: Chunfeng Wan, Tianshi Yang, Wenxiao Gai, Tai-Shung Neal Chung
  • A THIN FILM COMPOSITE MEMBRANE
    Publication number: 20210060498
    Abstract: There is provided a thin film composite (TFC) membrane comprising a support layer and a selective layer, formed of a cross-linked polyamide comprising Na+-functionalised carbon quantum dots (NaCQD), on a surface of the support layer. There is also provided a method of forming the TFC membrane.
    Type: Application
    Filed: January 3, 2019
    Publication date: March 4, 2021
    Inventors: Wenxiao Gai, Dieling Zhao, Tai-Shung Neal Chung