Abstract: A hand-portable electronic device having an exterior and comprising: a display; at least one light emitting device distinct from the display; means for controlling the presentation of a image on the display; means for determining a first color value that is dependent upon the image; means for converting the first color value to a color control signal; and means for controlling the at least one light emitting device, in response to the color control signal, to emit colored light from at least a portion of the exterior of the hand-portable electronic device.

Abstract: The present invention relates to a shielding element for electric and/or electronic components of an electric and/or electronic circuit, including an annular side wall (11) for surrounding those elements (25) of a circuit that have to be shielded against electromagnetic radiation, said side wall (11) defining a bottom and a ceiling opening (15), and a cover (12, 12?) for closing the ceiling opening (15). To provide a shielding element that facilitates a sampling of an electric and/or electronic circuit arrangement said cover (12, 12?) is either detachable attached to said side wall (11) by joint means that comprises a predetermined breaking (26) line or defined together with said side wall (11) as parts of an integral cap (32) by a predetermined breaking line (26). In both cases said predetermined breaking line (26) has to be destroyed for detaching said cover (12, 12?) from said side wall (11).

Abstract: The present invention relates to a shielding element for electric and/or electronic components of an electric and/or electronic circuit, comprising an annular side wall (11) for surrounding those elements (25) of a circuit that have to be shielded against electromagnetic radiation, said side wall (11) defining a bottom and a ceiling opening (15), and a cover (12, 12?) for closing the ceiling opening (15). To provide a shielding element that facilitates a sampling of an electric and/or electronic circuit arrangement said cover (12, 12?) is either detachable attached to said side wall (11) by joint means that comprises a predetermined breaking (26) line or defined together with said side wall (11) as parts of an integral cap (32) by a predetermined breaking line (26). In both cases said predetermined breaking line (26) has to be destroyed for detaching said cover (12, 12?) from said side wall (11).

Abstract: The invention relates to a method and to a device for thermally treating objects. The aim of the invention is to facilitate a better control of the temperature profile of an object to be thermally treated. To this end, the invention provides a method and a device for thermally treating an object in a heating system, especially for treating semiconductor wafers (2) in a rapid heating system (1). The objects are thermally treated at a predetermined temperature progression and the temperature of the object is controlled via a PID control and a feedforward control that are based on a simulation model of the heating system and the object. Said model consists of individual models of components of the heating system and/or the object. The parameters of at least one of the individual models are monitored during the thermal treatment and the model is adapted to the monitored parameters.

Abstract: The invention relates to a method and to a device for thermally treating objects. The aim of the invention is to facilitate a better control of the temperature profile of an object to be thermally treated. To this end, the invention provides a method and a device for thermally treating an object in a heating system, especially for treating semiconductor wafers (2) in a rapid heating system (1). The objects are thermally treated at a predetermined temperature progression and the temperature of the object is controlled via a PID control and a feedforward control that are based on a simulation model of the heating system and the object. Said model consists of individual models of components of the heating system and/or the object. The parameters of at least one of the individual models are monitored during the thermal treatment and the model is adapted to the monitored parameters.

Abstract: The aim of the invention is to provide an economical and homogenous thermal treatment for substrate. To this end, the inventive device and method for thermally treating substrates, especially semiconductor wafers, comprise at least one heating device for heating at least one substrate by electromagnetic radiation. Said heating device comprises at least two arc lamps, the radiation characteristics for each arc lamp being controlled individually, and the electromagnetic radiation of the arc lamps contributing essentially to the power density of the electromagnetic radiation of the heating device.

Abstract: An apparatus for the thermal treatment of substrates is provided. The apparatus includes a reaction chamber, at least one elongated heat source, and at least one reflection wall that is disposed adjacent to the heat source and serves to reflect at least a portion of the radiation given off thereby. The reflection wall has at least one rib, and the heat source is disposed at an oblique angle to the longitudinal direction of the rib.

Abstract: A temperature measuring apparatus, for measuring a temperature of a substrate in a heating apparatus heating a substrate by irradiation of light, and a method for measuring a substrate temperature, the measuring apparatus having a thermocouple and a covering member for covering it. The covering member portion covering the thermocouple is made of a material with a high heat conductivity and its excluding the material with a high heat conductivity portion is made of a material with a high light reflection factor respectively, whereby it is possible to accurately measure the temperature of the substrate heated by irradiation light without the measurement being affected by the heating irradiation light and without contaminating the substrate and further, without depending on film thicknesses structure of the substrate.

Abstract: A rapid thermal processing (RTP) chamber, wherein one wall of the chamber supporting a substrate rotates with respect to the rest of the chamber so that the substrate being treated in the RTP chamber is relatively rotated with respect to the lamps heating the substrate.